Breakthrough in MCCE process to enhance competitiveness of DW-sliced poly-Si wafers
Nuying Huang, Taipei; Adam Hwang, DIGITIMES
A breakthrough in MCCE (metal-catalyzed chemical etching) technology used in the production of diamond wire (DW)-sliced poly-Si wafers has enhanced significantly the competitiveness of such wafers against mono-Si wafers, according to industry sources...
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