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News tagged packaging
  • Last update: Friday 11 April 2014 [399 news items]

PTI to reduce reliance on PC DRAM

Oct 28, 01:20

Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...

PTI chairman DK Tsai

Xilinx shipping new FPGA built on TSMC 28nm process

Oct 27, 10:12

Xilinx has announced the first shipments of its Virtex-7 2000T FPGA, the first product using 2.5D IC stacked packaging technology. The chip is built on TSMC's 28nm HPL (low power...

Vincent Tong, company senior VP of worldwide quality and new product introduction

SPIL sees 4-8% decline in 4Q11 revenues on lower utilization

Oct 27, 01:00

Semiconductor packaging and testing company Silicon Precision Industries (SPIL) has forecast revenues will decrease 4-8% sequentially in the fourth quarter of 2011, citing slowing...

SPIL chairman Bough Lin

Integration a must for packaging and testing industry, says ASE chairman

Oct 24, 15:04

If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...

ASE chairman Jason Chang

Packaging and testing firms see flat growth in 4Q11

Oct 21, 01:05

The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...

ASE looks to expand

Sep 23, 01:05

IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...

IC packaging house Sigurd lands large volume orders for 4Q11, says paper

Newswatch - Sep 22, 14:47

IC packaging and testing house Sigurd Microelectronics is expected to see its revenues grow 10% sequentially in the fourth quarter of 2011 due to increasing orders from four major...

ASE breaks ground on China headquarters

Sep 22, 01:00

Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...

SEMICON Taiwan 2011: Companies announce job openings

Sep 8, 01:40

A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...

TSMC high-end IC packaging impacts IC packaging/testing houses

Sep 6, 01:10

Taiwan Semiconductor Manufacturing Company (TSMC) has undertaken in-house high-end packaging of ICs produced by its foundry processes for fabless IC design houses in the US and Europe...

Tong Hsing expects revenues to peak in 4Q11

Sep 2, 11:37

Tong Hsing Electronic Industries, which provides assembly and packaging services for niche ICs and produces ceramic substrates for the production of LED devices, expects revenues...

ASE to compete for orders for low pin-count packaging from IDMs

Aug 30, 01:00

Taiwan-based Advanced Semiconductor Engineering (ASE), viewing that global outsourced production value for wire-bonding packaging of low pin-count ICs, including logic and discrete...

SPIL vying for CPU back-end orders from Apple

Aug 26, 11:07

Packaging and testing firm Siliconware Precision Industries (SPIL) is likely to snatch outsourcing orders for Apple's new processor dubbed A6, according to industry sources.

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

PTI, Walton look to lower revenues in 4Q11

Aug 18, 14:58

Memory packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering both expect their fourth-quarter revenues to be lower than the levels recorded in the...

Walton expects flat 3Q11, but drop in 4Q

Aug 18, 01:10

Memory IC packaging and testing firm Walton Advanced Engineering has narrowed its sales forecast for the third quarter to flat growth sequentially, compared with the 0-5% increase...

Walton president Yu Hong-chi

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

ChipMOS mulls phasing out DRAM backend business

Jul 15, 01:10

Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...

ChipMOS secures NT$8.4 billion syndicated loan

Jul 14, 14:08

IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...

Laser Tek June sales up 60%

Jul 8, 01:30

Laser Tek, a supplier of surface-mount-device (SMD) packaging materials and semiconductor equipment, has reported NT$325 million (US$11.3 million) in consolidated revenues for June...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

PTI, Walton seeing weaker-than-expected demand for mobile DRAM

Jun 30, 01:25

Memory IC packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering have revised downward their targeted sales contributions from mobile DRAM products...

ASE aims at global market share of 25-30% in 2014

Jun 29, 01:00

IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) aims to hike its global market share from 17-18% in 2010 to 25-30% in 2014, COO Tien Wu said at the...

Harvatek and TCL to jointly build LED packaging facility in China

Jun 28, 01:15

Taiwan-based LED packaging house, Harvatek, will be cooperating with China-based TCL Corporation to set up an LED packaging facility in Huizhou, China. The facility will begin production...

SPIL turning focus to SiP packaging, IDM orders

Jun 23, 01:30

Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...

Elpida develops 4-layer DRAM package with 0.8mm thickness

Jun 22, 10:13

Elpida Memory and its subsidiary, Akita Elpida Memory, have announced development of a four-layer 0.8mm DRAM package. The thin package consists of four low-power consumption 2Gb DDR2...

Ta-I shipping LED heat sink substrates to Everlight, Delta

Jun 17, 10:08

Ta-I Technology reportedly has cut into the supply chain of LED packaging house Everlight Electronics and lighting system manufacturer Delta Electronics with its LED heat sink substrates,...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

Taiwan battery makers say no impact from HP recall

May 31, 01:30

With Hewlett-Packard (HP) recently announcing a recall to some notebook batteries due to overheating and being a fire hazard, Taiwan-based notebook battery makers pointed out that...

Packaging material supplier Chang Wah eyeing solar, touch panel applications

May 23, 15:46

Chang Wah Electromaterials is looking to venture into the solar- and touch panel-use material sectors to sustain future growth, according to company chairman Chia-neng Huang.

Packaging material supplier Chang Wah sees growth in 2Q11 sales

May 9, 16:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects sales to grow sequentially in the second quarter...

Tong Hsing sees flat growth in 2Q11 revenues

May 5, 01:05

Taiwan's Tong Hsing Electronic Industries now expects second-quarter revenues to stay flat sequentially, compared with its previous estimate of sequential growth through the last...

Baseband processors still essential, says Petrov Group

May 3, 17:02

With the proliferation of tablets and smartphones application processors are in the limelight, but another group of mobile processors, basebands, deserve attention too, according...

PTI beats 1Q11 guidance, gives positive outlook

Apr 29, 01:35

Powertech Technology (PTI) on April 28 reported better-than-expected results for its first-quarter performance. The memory packaging and testing service provider also gave a rosy...

PTI chairman DK Tsai
399 items [4/12]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

2014 China smartphone market and industry
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2014 global mobile application processor market forecast