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News tagged packaging
  • Last update: Wednesday 25 May 2016 [458 news items]

Unity Opto expects 1Q13 LED lighting packaging shipments to reach 200,000 units

Jan 9, 22:13

As LED lighting is expected to boom, firms have been looking into adopting automated production. Nan Ya Photonics, a Taiwan-based joint venture between LED chipmaker Epistar and the...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

ASE reportedly lands small-volume orders for Apple processors

Dec 27, 21:00

Taiwan-based Advanced Semiconductor Engineering (ASE), an IC packaging and testing services provider, reportedly has begun to fulfill small-volume orders for Apple's A-series proce...

Packaging material supplier Chang Wah looks to strong sales in 4Q12

Dec 18, 15:48

Packaging material supplier Chang Wah Electromaterials is expected to continue to post strong sales in the fourth quarter of 2012 thanks to brisk demand coming from the handset and...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

Digitimes Research: China LED packaging houses Refond, Jufei, Z-Light to continue capacity growth in 2013

Nov 27, 11:45

Refond Optoelectronics, Jufei Optoelectronics, and Z-Light Optoelectronics are medium-size LED packaging firms in China. These firms have relatively low capital compared to Nationstar...

Solder material maker Shenmao strengthening deployment in China

Nov 26, 22:10

Taiwan-based Shenmao Technology, which manufactures solder materials for IC packaging, plans to set up new plants in China in order to sustain future growth, according to the compa...

Taiwan IC backend production value to dip in 4Q12, says IEK

Nov 20, 13:45

The production value of Taiwan's IC packaging and testing industry sectors registered sequential growth of 2% and 2.3%, respectively, in the third quarter of 2012, according to data...

IC substrate makers develop coreless substrates for thin-profile mobile devices

Oct 26, 13:59

Major Taiwan-based IC substrate suppliers, including Nanya PCB (NPC) and Unimicron Technology, have developed coreless IC substrates for use in thin-profile mobile devices, and already...

Chipbond 4Q12 sales likely to drop 5%

Oct 18, 22:14

LCD-driver-IC packaging and testing house Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit...

STATS ChipPAC cuts 3Q12 outlook

Sep 21, 01:25

STATS ChipPAC, a semiconductor test and packaging service provider, now expects its third-quarter sales to decrease 3-5% on quarter. The firm previously estimated flat sequential...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

SPTS announces dry etch process technology for via reveal applications

Sep 6, 13:50

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

Demand for copper wirebonding packaging to peak in 2014

Sep 6, 13:36

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

Taiwan IC backend firms look to expand in Korea

Sep 4, 01:00

Recent moves by Advanced Semiconductor Engineering (ASE) and Ardentec suggest that Taiwan-based IC packaging and testing houses are looking to expand their presence in South Korea,...

Taiwan copper wirebonding production value to rise

Sep 3, 12:11

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

Tong Hsing raises 2012 capex

Aug 24, 11:51

Tong Hsing Electronic Industries, which provides assembly and test services for niche ICs and produces ceramic substrates for the manufacture of LEDs, has budgeted more than NT$2...

Tong Hsing president Henry Liu

Taiwan IC packaging materials market to see 5% shipment rise in 3Q12

Aug 24, 10:39

Taiwan's semiconductor packaging materials industry is expected to generate NT$23.78 billion (US$794 million) in production value in the third quarter of 2012, with shipments up 5%...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Quanta aiming to move all notebook production lines to Chongqing by 2014

Aug 16, 01:25

Quanta Computer is aiming to move all its notebook production lines except those for Apple's products to Chongqing, China within two years and estimates that its notebook shipments...

Walton expects flat or slight growth in 3Q12 sales

Aug 10, 01:35

Walton Advanced Engineering, which provides packaging and testing services for memory chips, expects its third-quarter revenues to be flat or rise slightly on quarter. The firm indicated...

Walton president Yu Hong-chi says company will focus on niche-market DRAM and mobile DRAM markets

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

Packaging material supplier Chang Wah 3Q12 shipments to rise

Jul 4, 13:43

Chang Wah Electromaterials is forecast to post shipment growth of more than 10% sequentially in the third quarter of 2012 as its IC customers including Advanced Semiconductor Engineering...

China-based LED chipmaker obtains certification from Taiwan-based packaging houses

Jul 2, 11:27

China-based LED chipmaker Sanan Optoelectronics may enter Taiwan's LED supply chain in third-quarter 2012. The firm has been certified by packaging houses such as Everlight and Unity...

Epistar

Greatek remains focused on shift to copper wire bonding

Jun 29, 01:20

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

Greatek, Lingsen 2Q12 sales to grow

Jun 19, 14:24

Second-tier Taiwan-based IC packaging and testing companies Greatek Electronics and Lingsen Precision Industries expect to post sequential revenue growth of 20% and more than 30%,...

ChipMOS expects sales growth in 2Q12

May 29, 01:30

LCD driver IC packaging and testing firm ChipMOS Technologies expect second-quarter sales to increase 7-12% sequentially with gross margin up about 0.8pp to 7%, thanks to a pick-up...

KYEC, Tong Hsing gearing up for new CIS orders

May 29, 01:20

Packaging and testing firms King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries reportedly have landed new orders for CMOS image sensors (CIS) from OmniVision, with...

Packaging and testing firms see mobile DRAM orders rise

May 22, 14:07

Memory packaging and testing specialists including Powertech Technology (PTI) and Walton Advanced Engineering have both enjoyed a ramp-up in orders for mobile DRAM chips recently,...

LED lighting packaging price to drop nearly 10% in 2Q12

May 4, 16:58

Quoted prices for LED lighting packaging parts have dropped around 3% during the second quarter and could drop 10% due to packaging firms moving from backlighting applications to...

Tong Hsing expects revenue growth through 4Q12

Apr 24, 00:33

Tong Hsing Electronic Industries, which provides assembly and packaging services for niche ICs and produces ceramic substrates for the production of LED devices, has guided that its...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

Second-tier packaging and testing firms post sales growth in 1Q12

Apr 11, 14:16

Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...

Walton and FATC 1Q12 sales up, PTI down

Apr 10, 11:37

Memory IC packaging and testing firms have reported mixed results for the first quarter of 2012. Walton Advanced Engineering and Formosa Advanced Technologies (FATC) both saw their...

ASE, SPIL report slight decreases in 2011 revenues

Apr 3, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...

458 items [4/14]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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28-Jun-2016 markets closed

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OTC electronic159.97+1.39+0.88% 

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