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News tagged packaging
  • Last update: Tuesday 2 September 2014 [406 news items]

Taiwan IC packaging materials market to see 5% shipment rise in 3Q12

Aug 24, 10:39

Taiwan's semiconductor packaging materials industry is expected to generate NT$23.78 billion (US$794 million) in production value in the third quarter of 2012, with shipments up 5%...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Quanta aiming to move all notebook production lines to Chongqing by 2014

Aug 16, 01:25

Quanta Computer is aiming to move all its notebook production lines except those for Apple's products to Chongqing, China within two years and estimates that its notebook shipments...

Walton expects flat or slight growth in 3Q12 sales

Aug 10, 01:35

Walton Advanced Engineering, which provides packaging and testing services for memory chips, expects its third-quarter revenues to be flat or rise slightly on quarter. The firm indicated...

Walton president Yu Hong-chi says company will focus on niche-market DRAM and mobile DRAM markets

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

Packaging material supplier Chang Wah 3Q12 shipments to rise

Jul 4, 13:43

Chang Wah Electromaterials is forecast to post shipment growth of more than 10% sequentially in the third quarter of 2012 as its IC customers including Advanced Semiconductor Engineering...

China-based LED chipmaker obtains certification from Taiwan-based packaging houses

Jul 2, 11:27

China-based LED chipmaker Sanan Optoelectronics may enter Taiwan's LED supply chain in third-quarter 2012. The firm has been certified by packaging houses such as Everlight and Unity...

Epistar

Greatek remains focused on shift to copper wire bonding

Jun 29, 01:20

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

Greatek, Lingsen 2Q12 sales to grow

Jun 19, 14:24

Second-tier Taiwan-based IC packaging and testing companies Greatek Electronics and Lingsen Precision Industries expect to post sequential revenue growth of 20% and more than 30%,...

ChipMOS expects sales growth in 2Q12

May 29, 01:30

LCD driver IC packaging and testing firm ChipMOS Technologies expect second-quarter sales to increase 7-12% sequentially with gross margin up about 0.8pp to 7%, thanks to a pick-up...

KYEC, Tong Hsing gearing up for new CIS orders

May 29, 01:20

Packaging and testing firms King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries reportedly have landed new orders for CMOS image sensors (CIS) from OmniVision, with...

Packaging and testing firms see mobile DRAM orders rise

May 22, 14:07

Memory packaging and testing specialists including Powertech Technology (PTI) and Walton Advanced Engineering have both enjoyed a ramp-up in orders for mobile DRAM chips recently,...

LED lighting packaging price to drop nearly 10% in 2Q12

May 4, 16:58

Quoted prices for LED lighting packaging parts have dropped around 3% during the second quarter and could drop 10% due to packaging firms moving from backlighting applications to...

Tong Hsing expects revenue growth through 4Q12

Apr 24, 00:33

Tong Hsing Electronic Industries, which provides assembly and packaging services for niche ICs and produces ceramic substrates for the production of LED devices, has guided that its...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

Second-tier packaging and testing firms post sales growth in 1Q12

Apr 11, 14:16

Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...

Walton and FATC 1Q12 sales up, PTI down

Apr 10, 11:37

Memory IC packaging and testing firms have reported mixed results for the first quarter of 2012. Walton Advanced Engineering and Formosa Advanced Technologies (FATC) both saw their...

ASE, SPIL report slight decreases in 2011 revenues

Apr 3, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

Walton says 1Q12 revenues to hit bottom

Feb 17, 01:15

Walton Advanced Engineering expects sales to register sequential growth starting the second quarter after hitting bottom in the first. The memory-IC backend service provider has also...

Walton expects sales to see sequential growth starting 2Q12

South Korea-based LED makers beat out Taiwan makers in LED packaging market share

Feb 14, 15:40

Samsung LED, LG Innotek, Seoul Semiconductors, and other South Korea-based makers together occupied 26% of the global production value for LED packaging in 2011, higher than the 19%...

LED TVs

Lextar operates in the red in 2011

Feb 10, 11:01

Taiwan-based LED firm Lextar Electronics has reported net losses of NT$138 million (US$4.67 million) or NT$0.34 per share for 2011. It also reported consolidated revenues of NT$650...

Lextar

PTI 1Q12 sales to drop up to 10%, says chairman

Feb 10, 01:30

Memory packaging and testing specialist Powertech Technology (PTI) now expects its sales to decrease up to 10% sequentially in the first quarter of 2012, company chairman DK Tsai...

ASE, SPIL post sales drops in January

Feb 9, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...

Packaging and testing firms to post 5-10% drop in 1Q12

Jan 20, 01:05

Revenues at semiconductor packaging and testing houses will likely register a 5-10% sequential decrease in the first quarter of 2012, affected by fewer working days, according to...

Chang Wah seeing orders for driver IC-use packaging materials surge

Jan 19, 17:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects orders for COF (chip-on-film) packaging materials...

LED chipmakers and packaging firms suffer revenue declines in December

Jan 10, 15:58

Affected by seasonal factors, most Taiwan-based LED chipmakers and LED packaging companies have posted declines in revenues for December, with the setbacks suffered by upstream chipmakers...

Shenmao tapping Japan market

Jan 5, 01:00

Taiwan-based Shenmao Technology, which manufactures solder materials for IC assembly, has set up an office in Japan with the aim to cut into the supply chain of the country's first-tier...

Shenmao chairman San Lian Lee

PTI buys Nexx tool for advanced packaging

Jan 4, 15:49

IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...

Solder material maker Shenmao expects drop in 1Q12 sales

Jan 3, 13:48

Shenmao Technology expects its consolidated revenues to decrease 5-10% sequentially in the first quarter of 2012, citing seasonal factors as well as fewer working days due to Lunar...

Walton 1Q12 sales to decrease 5-10%

Jan 3, 01:10

Memory-IC packaging and testing specialist Walton Advanced Engineering expects its revenues to drop by another 5-10% sequentially in the first quarter following an almost 20% sequential...

SPIL steps into LED packaging

Dec 30, 16:48

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, has stepped into high-end packaging of multiple LED chips, according to company vice...

Rohm reportedly places backend orders with Taiwan firms

Dec 29, 15:02

Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...

PTI looking to become world No. 4 packaging, testing firm

Dec 26, 12:13

Powertech Technology's (PTI) plan to acquire a controlling stake in Greatek Electronics will further expand its backend service offerings and production capacity for the logic IC...

LCD market to rebound in 2Q12, says Chipbond

Dec 22, 01:05

Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...

406 items [3/12]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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