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592 news items tagged packaging

  • Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...
  • With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
  • David+Fang%2C+chairman+of+HY+Electronic
    Taiwan's leading diode maker HY Electronic will inaugurate its second plant in Yangzhou, China in the first half of 2018, to support production of automotive alternator rectifier...
  • TSMC+CoWoS+eyeing+bigger+presence+in+supercomputer+field
    AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...
  • ASE August revenues increase

    Friday 8 September 2017
    IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw its August revenues climb to the highest monthly levels thus far in 2017.
  • Apple+is+expected+to+launch+the+new+iPhone+soon
    With Apple expected to launch its new iPhone soon, Taiwan players in the US vendor's smartphone supply chain are warming up to embrace a new round of business boom, with the upstream...
  • Nidec to acquire SV Probe

    Tuesday 29 August 2017
    Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...
  • Taiwan-based backend service company Lingsen Precision Industries is expected to post its highest revenues since the third quarter of 2013 in third-quarter 2017, the Chinese-language...
  • Xintec loss widens in 1H17

    Friday 25 August 2017
    Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.
  • AMD+Vega+GPUs+in+shortages
    AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...
  • Hong Kong-based Thunder Power Holding has announced a new electric car in Taiwan and has also recently signed a letter of intent with a local government to establish plants for battery...
  • Globalfoundries demos 2.5D HBM solution

    Wednesday 16 August 2017
    Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
  • Pneumatic automation component maker Taiwan Chelic has reported its second-quarter 2017 consolidated revenues reached NT$418 million (US$14.09 million), up 58.33% sequentially, with...
  • Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
  • Taiwan+IC+industry+output+value+drops+in+2Q17
    Taiwan's IC industry, consisting of designers, manufacturers, packaging and testing houses, generated output value of NT$572.6 billion (US$18.9 billion) in the second quarter of 2017,...
  • Taiwan Semiconductor Manufacturing Company (TSMC) has approved the appropriation of around US$3.15 billion, which includes funding for new facilities construction with costs estimated...
  • Capacitor
    Major Taiwan-based passive component makers including Yageo, Walsin Technology and Chilisin Electronics have reported record-high revenues for July 2017, thanks to a pick-up in customer...
  • SPIL July revenues rise 6%

    Tuesday 8 August 2017
    IC packaging and testing house Siliconware Precision Industries (SPIL) saw its July revenues climb to a 7-month high of NT$7.26 billion (US$240.1 million).
  • Global+Unichip+partnering+with+TSMC+to+expand+business+in+AI+field
    Taiwan-based Global Unichip, an IC design service company partnering with Taiwan Semiconductor Manufacturing Company (TSMC), is looking to expand its business in the artificial intelligence...
  • Due to tight supply, suppliers of materials used in LED packaging in the China market have hiked quotes and the increased prices are likely to remain in the fourth quarter of 2017,...
  • ASE
    Packaging and testing company Advanced Semiconductor Engineering (ASE) is expected to report 10-13% sequential growth in consolidated revenues for the third quarter of 2017, with...
  • PTI optimistic about 3Q17

    Tuesday 25 July 2017
    Memory backend specialist Powertech Technology (PTI) expects its sales to peak in the third quarter, and remains optimistic about the outlook for the fourth quarter.
  • TSMC+CoWoS+packaging+and+testing+capacity++
    Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill...
  • Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...
  • Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
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