Bits + chips
TSMC to expand CoWoS capacity to fill increasing AI chip packaging orders
Josephine Lien, Taipei; Willis Ke, DIGITIMES

Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill increasing orders from Nvidia and Google for AI chips, indicating that...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.