Bits + chips
TSMC reportedly to tie up with Micron to develop 3D ICs
Josephine Lien, Taipei; Steve Shen, DIGITIMES

Taiwan Semiconductor Manufacturing Company (TSMC) reportedly plans to team up with Micron Technology to develop 3D ICs that will integrate Micron's hybrid memory cube-based DRAM chips with TSMC's logic chips through TSV technology, according to industry...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.