Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper
EDN, March 4; Steve Shen, DIGITIMES
Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process developed by Taiwan Semiconductor Manufacturing Company (TSMC), according...
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Amid bleak outlook for downstream vendors, uncertainties surrounding the US-China trade tension, factory relocation and exchange rate volatility, global smartphone AP shipments may experience further decline in 2019, down two years in row, according to Digitimes Research estimates.
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This Digitimes Research Special Report offers global shipment forecasts for three major mobile device market segments - smartphones, notebooks and tablets - for the year 2019 and beyond. It gives in-depth analyses of their respective market outlooks, with shipment forecasts extending to 2023.