Bits + chips
TSMC collaborates with Mentor Graphics enabling design and verification tools for new InFO technology variants
Press release; Jessie Shen, DIGITIMES

TSMC has extended its collaboration with Mentor Graphics on the Xpedition Enterprise platform in conjunction with the Calibre platform for the design and verification of TSMC's integrated fan-out (InFo) packaging technology for multi-chip and chip-DRAM...

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