Bits + chips
TSMC InFO-WLP technology to generate significant revenues starting 2016
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's revenues in 2016, according to industry sources.

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