- 2 Dec 2014:Samsung Electronics has joined hands with US-based Thermo Fisher Scientific in a bid to expand its presence in the medical industry with its smartphone business slowing down.
- The next generation of Google Glass may have new guts, according to The Wall Street Journal (subscription required), which expects a deal between Google and Intel.
- 30 Nov 2014:Samsung Electronics' semiconductor sales are expected to jump 15.6% on year in 2014, closing the gap with industry leader Intel, a global market tracker said Sunday.
- 26 Nov 2014:The Quintic Wearable & BTLE team of approximately 65 world class engineers located in China (Beijing, Shenzhen, Shanghai) and Sunnyvale, CA, and its leadership is expected to join NXP at close of this transaction which is targeted for Q1 2015.
- 25 Nov 2014:Samsung Electronics spent KRW1.38 trillion (US$1.2 billion) in patent fees in the nine months to September, the most in four years, the company said.
- RF Micro Devices (RFMD) and TriQuint Semiconductor have set Wednesday, December 31, 2014, as the anticipated closing date for the transaction.
- Xilinx and NXP collaborate to reduce capex and opex costs of wireless infrastructure radios (Nov 19) - Company releaseXilinx and NXP have announced their collaboration to reduce capex and opex costs of wireless infrastructure radios.
- Marvell's ARMADA Mobile PXA1802 5-mode 4G LTE modem is at the core of Meizu's flagship MX4 Pro Premium smartphone, now available for more than one billion of combined subscribers of China Mobile and China Unicom.
- 23 Nov 2014:Qualcomm, which uses processor technology licensed from ARM, follows a handful of other ARM chip suppliers that are trying to offer server chips.
- Qualcomm said it is holding "difficult discussions" with Chinese authorities as the world's largest maker of mobile-phone chips tries to resolve an investigation that's hurting the collection of licensing revenue.
- 21 Nov 2014:According to Qualcomm, who builds many of today's key technologies in mobile, 4K smartphones are just around the corner, and they'll take pixel counts to an - arguably absurd - new level.
- Marvell Technology has forecast lower-than-expected revenue for the current quarter as weak demand for its chips used in third-generation mobile communication offset a rise in sales of its more profitable 4G LTE chips.
- Qualcomm announces fifth-generation LTE multimode modem for download speeds of up to 450Mbps and next-generation envelope tracker for optimized power consumption (Nov 19) - Company releaseDesigned with LTE connectivity, both products are designed to work together to support fast downloads, swift application performance, as well as provide enhanced thermal efficiency and optimized power consumption. These two new products are currently sampling with customers and are anticipated to be commercially available in 2015.
- 19 Nov 2014:Korea Times claims Samsung will be lead supplier for next year's A-series chips (Nov 17) - 9to5Mac.comKorea Times is claiming that a deal has been struck with Apple for Samsung to supply 80% of the chips for next year's iPhones and iPads, with TSMC picking up the balance of orders.
- 18 Nov 2014:Intel plans to combine operations that handle chips for personal computers with those targeting smartphones and tablets, according to an email sent to employees by Chief Executive Brian Krzanich.
- Fairchild has announced management changes that streamline the company's reporting structure.
- Marvell has announced two new 64-bit mobile processors targeting the fast growing global LTE market: a new mobile SoC based on octa-cores for high performance smartphones and tablets and another that uses quad-cores for economy models.
- 14 Nov 2014:Toshiba has become the latest electronics giant to move into a very different business line - the production of vegetables.
- 13 Nov 2014:Spansion has launched a family of industrial-grade e.MMC NAND memory products for the consumer, communication and industrial equipment markets.
- Trade negotiators from China and the US have reached a preliminary deal they say could end tariffs on as much as a trillion dollars in annual global sales of high-tech goods, eliminating tariffs as high as 25% on some next-generation semiconductors. The deal requires approval of the World Trade Organization, which could take up the issue as early as December.
- 12 Nov 2014:Intel CEO Brian Krzanich expects new semiconductor partners in China to migrate to the US chipmaker's architecture within a few years and give up on ARM technology more widely used in smartphones and tablets.
- 11 Nov 2014:Imagination PowerVR Series7 GPUs target applications from wearables to servers (Nov 10) - Company releasePowerVR Series7 is architected for the broadest range of next-generation products from wearables and IoT through automotive, mobile and consumer electronics devices, up to high-performance GPU compute.
- 10 Nov 2014:According to industry sources, Apple has decided to discontinue its use of triple-level cell (TLC) NAND, since the company believes that the functional defects plaguing the 64GB iPhone 6 and the 128GB iPhone 6+ stem from a problem in the controller IC of the TLC NAND flash. The controller IC in question is reportedly made by SSD maker Anobit, which was sold to Apple in 2011.
- 8 Nov 2014:GT Advanced COO: Apple told us 'put on your big boy pants and accept the agreement' (Nov 7) - Mac RumorsApple and GT Advanced fought to keep key documents related to their sapphire agreement out of the public eye after the latter company filed for Chapter 11 Bankruptcy protection, but earlier this week, a judge ruled that the documents did not contain trade secrets or confidential information, and would thus be largely unsealed.
- 7 Nov 2014:Globalfoundries and Invecas intro new dedicated design service partner for leading-edge technologies (Nov 6) - Company releaseGlobalfoundries has announced a partnership with Invecas, a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.
- 6 Nov 2014:Synaptics has completed its acquisition of Renesas SP Drivers (RSP), a supplier of small- and medium-size display driver ICs for smartphones and tablets.
- 5 Nov 2014:GT Advanced Technologies has announced a multi-year, US$578 million contract with Apple to supply advanced sapphire material.
- 4 Nov 2014:As numerous reports of low read performance of the Samsung SSD 840 and 840 EVO using TLC NAND flash have surfaced on the Internet, a problem in the controller IC is considered to be the more likely cause of the defects.
- 3 Nov 2014:Samsung is expected to start producing application processors (APs) for clients such as Apple, Qualcomm, and AMD, using its 14-nanometre process around the end of the year.
- Kilopass Technology has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.
- 31 Oct 2014:Micron Technology said Monday that its board had authorized as much as $1 billion in share buybacks, its first such repurchases in three years.
- Samsung starts mass production of 8Gb DDR4 based on 20nm process technology (Oct 22) - Company releaseSamsung successfully expands the use of the 20 nanometer process from PC and mobile memory to the enterprise server market.
- Microchip Technology missed revenue targets for its second fiscal quarter ending September 30 and said the next quarter will see single-digit declines.
- SiTime, a MEMS and analog semiconductor company, has signed a definitive agreement under which MegaChips, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for US$200 million in cash.
- Three of Japan's biggest electronics companies reported modest earnings gains Thursday for the first half of the financial year ending March, helped by the yen's weakness and restructuring, but held back by a soft domestic economy.
- 8 Oct 2014:The 2014 Nobel Prize for physics has been awarded to a trio of scientists in Japan and the US for the invention of blue light emitting diodes (LEDs).
- 3 Oct 2014:
- 16 Sep 2014:
- 21 Aug 2014:
- Indium Corporation Features Heat-Spring for LED Manufacturing at IMAPS 2015
- MagnaChip to host first Foundry Technology Symposium in Shanghai, China
- Indium Corporation features ultra-low residue no-clean Flip-Chip Flux at SEMICON Taiwan
- Indium Corporation's patented BiAgX: A drop-in replacement for high-Pb solders
- NANIUM enables WLCSP without UBM
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Rockchip statement on merger rumor
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Digitimes Research: Shrinking tablet market prompts China touch panel supply chain to look for growth elsewhere
- Digitimes Research: Tsinghua Unigroup acquisition of Micron faces difficulties, but is a must for China for further development
- Digitimes Research: Qualcomm to push inexpensive mobile device market with Microsoft and Allwinner solutions
- Digitimes Research: Touch IC developers turning to fingerprint sensors
- Digitimes Research: Intel 28nm SoFIA 4G AP delayed to early 2016; may face overlap issue with 14nm version
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