- 28 Aug 2013:Moore's Law - the ability to pack twice as many transistors on the same sliver of silicon every two years - will come to an end as soon as 2020 at the 7nm node, said a keynoter at the Hot Chips conference here.
- 27 Aug 2013:Skyworks powers MediaTek latest generation dual-core smartphone platforms (August 14) - Company releaseMediaTek is leveraging several of Skyworks' front-end solutions in its dual-core MT6572 platform which is supporting multiple leading tier-one smartphone manufacturers in emerging markets.
- 26 Aug 2013:Solid-state drive adoption will continue to grow and it will be more than 10 years before it is ultimately replaced by a new memory technology, experts said.
- Clayton Morris has claimed on Twitter that the iPhone 5S's A7 processor is "running at about 31% faster" than the iPhone 5??s A6 chip.
- 22 Aug 2013:
- Micron Semiconductor Asia is laying off some 150 staff in Singapore. That is about 2% of its 7,500-strong workforce here.
- 20 Aug 2013:The construction of Intel's first wafer fab for processing 450mm diameter wafers is "well underway," having started in January 2013, an Intel spokesperson tells EE Times.
- 16 Aug 2013:Applied Materials' board of directors has appointed Gary Dickerson as president and chief executive officer (CEO) and Michael Splinter as executive chairman of the board of directors, effective September 1, 2013.
- Samsung has been named in a lawsuit filed by a Brazilian labor group, which said working conditions at the technology firm's assembly lines were in violation of Brazilian law.
- "We are seeing a near-term slowdown in investment by our foundry customers as they focus on ramping (production using) new capacity installed over the past two quarters," said Applied CEO Michael Splinter.
- 14 Aug 2013:Intel, AMD and ARM are looking to address new workloads fueled by such trends as cloud computing, mobility, big data and social networks.
- Intel has confirmed that it acquired last month Fujitsu Semiconductor Wireless Products, the Tempe, Ariz.-based subsidiary of Fujitsu that developed an advanced multimode LTE RF transceiver. The financial terms of the deal were not disclosed.
- The cuts will not come from among the employees acquired along with Elpida, Micron said.
- 9 Aug 2013:Toshiba's new chief executive said he won't pull the plug on the company's unprofitable television and personal-computer operations, shunning the "easy option" of exiting cutthroat competition for a chance to reclaim its former prominence in the businesses.
- A Taiwan government venture capital fund will sell more than 170 million shares in TSMC in 2014 to help fund Taiwan's budget, a source with direct knowledge of the sale said on Thursday.
- Desktops, notebooks, tablets: Just five years ago, those three words defined three distinct classes of products. But now consumers are being asked to choose among all-in-ones, two-in-ones, convertibles, mini-tablets, ultraportables, and phablets. With Intel's new "Bay Trail" Atom chip, due this fall, you can expect the market to diversify even more.
- 6 Aug 2013:Japan's Renesas Electronics said Friday it will close a plant that makes system LSI chips for Nintendo's game consoles and other consumer electronics after failing to find a buyer for the facility in Tsuruoka in northern Japan.
- 5 Aug 2013:Ericsson and STMicroelectronics today announced the closing of the transaction for the split up of ST-Ericsson.
- 2 Aug 2013:As we store more and more of our personal lives on smartphones, mobile security is becoming increasingly crucial. A password offers some protection, but it may not deter a serious hacker.
- Possible sales ban for Samsung to be decided next week in patent infringement case (August 1) - TechHiveThe US ITC expects to complete its investigation into allegations of patent infringement between Apple and Samsung at the end of next week (August 4-11).
- Eight-core processors are "dumb," as the consumer wants an experience that comes from more than just throwing cores together, a Qualcomm executive said, referring to new eight-core chips announced recently.
- The deal, which follows such prior chip investments as the 2008 purchase of PA Semi, comes as Apple is widely believed to be moving beyond smartphones and tablets to other kinds of devices that could need wireless chips, including smart watches.
- 1 Aug 2013:TSMC recently held a job fair in upstate New York, helping to drive up expectations that the chipmaker is planning to open a chip fabrication plant in the area to build mobile processors for Apple.
- 31 Jul 2013:Micron Technology anticipates the closing of its acquisition of 100% of Elpida's equity to occur on July 31, 2013, Tokyo time. Micron also anticipates concurrently closing its acquisition of a 24% share of Rexchip Electronics from Powerchip Technology and certain of its affiliates.
- 30 Jul 2013:Qualcomm is to acquire a stake in Alcatel-Lucent as part of a far-reaching partnership agreement to develop the next generation of smaller mobile cell transmitters capable of coping with the rapid increase in mobile data.
- 29 Jul 2013:When he founded Taiwan Semiconductor Manufacturing Company (TSMC) in 1987, Morris Chang recalls, "Nobody thought we were going anywhere."
- KLA-Tencor forecast current-quarter revenue below expectations as slumping personal computer sales hurt demand for new chip-manufacturing gear, sending its shares lower.
- Mali graphics IP core shipments are on course to be more than 300 million units in 2013, more than doubling the 150 million units shipped in 2012, according to Simon Segars, CEO of processor IP licensor ARM.
- Struggling chip-maker Renesas Electronics Corp. is looking to close or shrink its major production base for system LSI chips in Tohoku after failing to sell it to a Taiwanese firm, company sources said Saturday.
- 25 Jul 2013:Qualcomm rose 3% in after-hours trading Wednesday after the company booked US$6.2 billion in its third quarter, its twelfth straight quarter of double-digit gains, and raised its outlook for the full year.
- Spansion has expanded its serial peripheral interface (SPI) portfolio with the introduction of FL-1K family.
- 24 Jul 2013:
- 23 Jul 2013:Texas Instruments gave a third-quarter revenue forecast that was stronger than some analysts expected and said customers seem more confident about placing orders for chips.
- Aptina has announced a new 13-megapixel sensor for smartphones, the AR1331CP.
- Avago Technologies has announced that its 28nm Serializer/Deserializer (SerDes) core has achieved 32Gbps performance while withstanding up to 40dB of channel loss.
- 22 Jul 2013:Wolfson Audio Hub adopted for Sharp's latest smartphone and tablet devices (July 11) - Company releaseWolfson's WM5102 HD audio hub has been adopted by Sharp for its new range of AQUOS smartphone and tablet devices.
- Nova Measuring Instruments, the Israeli maker of equipment for semiconductor manufacturing, rebounded in New York after the chief executive officer said he's confident its largest customer won't pare back orders.
- 16 Jul 2013:The only thing that counts against Globalfoundries is that, being a newcomer with a new US fab, it has yet to build up a long track record of consistent, successful execution. This is one reason Apple would not wish to have all its processor eggs in one foundry, as it does now with Samsung.
- Knowles Corporation celebrates 40th anniversary in Taiwan, showcasing multiple innovative solutions
- Advantest announces newest handler for testing advanced memory ICs
- CEVA offers total solutions for the multi-billion-dollar IoT market
- Seizing IoT opportunities, CEVA acquires RivieraWaves
- NXP appoints new VP, Taiwan Sales and Country Manager
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: MediaTek, Rockchip to join Chromebook market
- Digitimes Research: Intel looking to promote x86 architecture to China chip designers
- Digitimes Research: Hisilicon AP to give Huawei cost advantage in high-end mobile device market
- Digitimes Research: Google looking to clean up Android device mess in emerging markets
- Digitimes Research: Qualcomm far ahead of Marvell and MediaTek in China LTE market
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