- 21 Jun 2013:The cost of designing system-on-chip silicon at 28nm went up by 78% over the previous node, but the software cost was larger and more than doubled.
- 20 Jun 2013:Qualcomm has expanded its entry-level offerings with the addition of six new processors to its Snapdragon 200 class, featuring dual- and quad-core CPUs. The new Snapdragon 200 processors are manufactured on a 28nm process technology and feature key modem technologies that are important in China and emerging regions, including support for HSPA+ (up to 21Mbps) and TD-SCDMA.
- A lack of new licensing agreements triggered a 7% fall in adjusted pre-tax profits last financial year, and analysts have suggested that the company, whose designs are used to make graphics-processing chips used in mobile devices, could be volnerable to increased competition from US rivals Qualcomm and Nvidia.
- "Our checks indicated that Samsung planned to increase the 28nm node starts to a target level of 40,000-50,000 wpm in September, from 6,000 to 7,000 in May. But our recent checks are indicating that the semi material suppliers have been recently caught off guard with a sudden change of production plans at this site."
- 19 Jun 2013:Nvidia on Tuesday said it would begin licensing its GPU cores and "visual computing" patent portfolio to device manufacturers - a new business model for the company. The technology could appear in a full range of products from phones to supercomputers, with products likely emerging in 2015.
- Both Toshiba and Taiwan Semiconductor Manufacturing Company (TSMC) have developed mask read-only memories (MROMs) that can offer greater data density by storing multiple bits per cell.
- AMD plans to sample its first ARM-based processors for servers early next year, alongside paired CPUs and integrated graphics cores in an attempt to oust Intel's Xeon from its dominance in the server market.
- Globalfoundries and Fuzhou Rockchip Electronics announced that Rockchip's next-generation mobile processors are ramping to production on Globalfoundries' 28nm HKMG process technology.
- 18 Jun 2013:Toshiba has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablets, Ultrabooks and other applications.
- 14 Jun 2013:Infineon Technologies has settled its patent infringement claim against Atmel, and both Infineon and Atmel have agreed to seek dismissal of all pending patent infringement claims.
- 13 Jun 2013:SK Hynix has signed a five-year licensing deal worth US$240 million to settle an ongoing patent infringement lawsuit brought against it by intellectual property licensing firm Rambus.
- 6 Jun 2013:Japan's NHK network is scheduled to broadcast an animated documentary on TSMC at midnight Thursday, with TSMC's chairman and CEO, Morris Chang, depicted by the fictional character Shima Kosaku.
- Contract chipmaker Globalfoundries will spend US$4.5 billion to boost production capacity in 2013, anticipating a burst in orders for chips used in low-cost smartphones.
- 5 Jun 2013:
- 4 Jun 2013:Qualcomm works with Microsoft to offer Snapdragon 800 processors for Windows RT 8.1 (June 4) - Company releaseQualcomm has expanded its Qualcomm Snapdragon 800 processors portfolio to include support for Microsoft Windows RT 8.1.
- 3 Jun 2013:IC Insights has lowered its 2013 IC market growth forecast 1pp to 5%.
- Samsung Electronics has chosen an Intel processor to power a new version of one of its top-tier Android tablets, a source with knowledge of the plans told Reuters.
- 1 Jun 2013:
- 29 May 2013:ST-Ericsson, which focuses on mobile and wireless chips, announced the sale on Tuesday without naming the buyer. An Intel spokesman later said the US chipmaker bought the assets.
- 28 May 2013:Worldwide semiconductor revenues decreased by 2.2% to US$295 billion in 2012, according to IDC.
- 23 May 2013:This is the second major project driven by the government of Taiwan that relies on security chips from Infineon: more than 25 million pieces have already been shipped for the electronic health cards of the Taiwan Health Care Project.
- 22 May 2013:Toshiba said it will soon begin mass producing a new type of 64Gbit NAND flash that is the smallest and fastest in its class, though it still lags rival Samsung Electronics in the development of an even denser flash technology.
- 21 May 2013:RFMD will phase out manufacturing in its UK-based GaAs pHEMT facility and transition most GaAs manufacturing to its GaAs HBT manufacturing facility in Greensboro, NC. RFMD will also partner with leading GaAs HBT foundries for additional capacity.
- Samsung Electronics ranked first in terms of production of sub 28-32 nanometer chip foundry in the first quarter of the year, data showed on Monday.
- 20 May 2013:It may seem strange but Chinese chip vendor Allwinner Technologies (Zhuhai, China) probably sold more application processors for tablet computers in 2012 than Intel and Qualcomm put together.
- 17 May 2013:Imec and Renesas Electronics have entered into a new strategic research collaboration at Holst Centre. Together, the companies will collaborate to enhance ultra-low power (ULP) wireless technologies for short range communication, targeting sensor networks for automotive and industrial purposes.
- 9 May 2013:
- 8 May 2013:IC Insights forecasts that in 2017, fabless IC companies will command at least one-third (33%) of the total IC market.
- 7 May 2013:Rubinstein's experience at a handset vendor, as well as at a large computing company like HP, will help Qualcomm with its strategy.
- 6 May 2013:German chipmaker Infineon brightened its gloomy outlook for this year, citing orders from carmakers hoping sales of higher-spec models in China will offset flagging demand in Europe.
- 3 May 2013:Intel hasn't signaled a change in strategy with the appointment of Brian Krzanich to CEO, but it is likely that the company will take steps to outrun its foundry competition by opening its industry-leading manufacturing facilities to more third parties.
- 2 May 2013:Altera posted revenue slightly below expectations in the first quarter and the programmable chipmaker said it was beginning to see a recovery from a dip in demand from its communications and industrial customers.
- 30 Apr 2013:SK Hynix Semiconductor will be supplying Samsung Electronics with memory chips as early as June, industry sources said on Monday. The firm will supply enough to make up 20% of Samsung's mobile business.
- 26 Apr 2013:Although smartphone sales are still climbing Qualcomm is now facing fiercer competition from other chip makers, including Intel, which has been redesigning its microprocessors in an attempt to grab a bigger piece of the mobile computing market.
- For the first time, the company that makes more than half the world's mobile DRAM chips may buy them from SK Hynix, said Shin Jong Kyun, head of Samsung's mobile business.
- Indium Corporation features high-reliability, low-voiding flux coating for solder preforms at IMAPS
- Photoimageable coverlay: A new FPCB non-rigid material that enhances hole-plugging with no glue overflow and 0.025mm alignment accuracy
- Indium Corporation technology experts to present at IPC Southeast Asia High Reliability Conference
- Indium Corporation technology expert to lead professional development course at SMTAi 2014
- Indium Corporation announces new Vice President of Operations
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: Hisilicon AP to give Huawei cost advantage in high-end mobile device market
- Digitimes Research: Google looking to clean up Android device mess in emerging markets
- Digitimes Research: Qualcomm far ahead of Marvell and MediaTek in China LTE market
- Turning a smartphone into a PC in a pocket: Q&A with Analogix
- What works in telecom can work in high-speed manufacturing: Leveraging IoT with Vitesse
Digitimes Research expects Taiwan's IC backend production to outperform global average n 2014
TSMC and UMC see strong results for 1Q14
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