- 8 Jun 2015:Synopsys has signed a definitive agreement to acquire Atrenta, a privately held provider of SoC realization solutions for the semiconductor and consumer electronics industries.
- 4 Jun 2015:Toshiba and Microsoft have announced that the two companies have signed a memorandum of understanding (MOU) to jointly develop solutions for the Internet of Things (IoT).
- 3 Jun 2015:According to industry sources, SK Hynix will start processing 20-nano wafers for mass production from next month, and start the full-fledged production of 20-nano class DRAM in July.
- 2 Jun 2015:MagnaChip Semiconductor now offers a new 0.18-micron Bipolar-CMOS-DMOS (BCD) 100V high voltage process. This new process features operability up to 100V for various applications that include DC-DC converters, Power-over-Ethernet, LED drivers, motor drivers, audio amps and PMICs.
- Rohm has moved to acquire a 200mm wafer fab from Renesas Electronics for JPY450 million (US$3.7 million).
- A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.
- But company officials and market experts say if the two raise their production capacity, the long-term supply growth will remain constrained due to technological complexity.
- Altera has been a key customer at TSMC for years, especially at the advanced tech node, accounting for around 3% of TSMC's revenue at 20/28 nodes.
- The Helio P10 is built using TSMC's 28nm HPC+ process.
- 28 May 2015:Daimler and Qualcomm announce strategic collaboration on connected car technologies (May 24) - Company releaseIn the first phase of the collaboration, the companies will focus on transforming future vehicles with mobile technologies that enhance in-car experiences and vehicle performance such as 3G/4G connectivity, wireless charging technology for in-vehicle use and implementation of the Qualcomm Halo Wireless Electric Vehicle Charging (WEVC) technology.
- Chip maker Avago Technologies is in advanced talks to buy rival Broadcom in a deal worth about US$35 billion, the latest in a wave of takeovers for the companies that supply parts to power smartphones, tablets and other gadgets.
- 27 May 2015:NVIDIA reiterates for the second time in three months that TSMC is their primary manufacturing partner as they head towards 16nm, and even 10nm production.
- China's Spreadtrum Communications will use Intel's 14nm FinFET process technology for both the low- and high-end mobile chips the company plans to launch in 2016, according to Spreadtrum chairman and CEO Leo Li.
- 26 May 2015:The next-generation iPhone will reportedly sport a camera with a 12-megapixel Sony sensor that makes use of the firm's RGBW technology to help with low-light photography.
- 25 May 2015:Globalfoundries offers new low-power 28nm solution for high-performance mobile and IoT applications (May 20) - Company releaseGlobalfoundries has announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.
- Samsung was shy on specs, but said the process node will be in full production by the end of 2016, about the same time as its rival TSMC.
- 21 May 2015:Huawei and Qualcomm jointly complete CAT11-based 3CC CA+256QAM test, reaching 600 Mbit/s rate - Company releaseHuawei and Qualcomm Technologies, a subsidiary of Qualcomm, have jointly announced the completion of tests using LTE CAT11 terminals.
- 20 May 2015:The US has charged six Chinese nationals over the alleged theft of technology used in mobile phones. The six, including three university professors, are accused of using the technology to benefit universities and companies controlled by Beijing.
- 19 May 2015:A new leaked roadmap slide purportedly showing Intel's plans through to the end of 2016 has been published by a Finnish computer technology website. If the slide is genuine we will likely see Intel release its first 10nm Cannonlake CPUs sometime around the second and third quarters of next year.
- As Apple basks in the unprecedented demand for its latest iPhones, suppliers from Tokyo to Taipei are sharing in the spoils.
- Xiaomi wants its own custom-designed processors to differentiate its products and control its destiny, an executive of Leadcore Technology told EE Times.
- 18 May 2015:Fujitsu and Intel have reached an agreement to combine Fujitsu Laboratories' distributed service platform technology with the Intel IoT Gateway to build out comprehensive IoT solutions.
- The recent earnings season turned out to be largely good news for the companies that make semiconductor manufacturing gear. But investors haven't quite come around yet.
- Silicon Storage Technology and Globalfoundries announce qualification of auto grade 55nm embedded flash memory technology (May 5) - Company releaseMicrochip Technology through its Silicon Storage Technology (SST) subsidiary and Globalfoundries have announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on Globalfoundries' 55nm Low Power Extended (LPx)/ RF enabled platform.
- 15 May 2015:With the adoption rate of the ARM mbed IoT Device Platform increasing rapidly, the company has announced a new assurance standard, the ARM mbed Enabled program.
- Avago Technologies, looking to acquire a fellow chipmaker, has reached out to potential targets including Xilinx, Renesas Electronics and Maxim Integrated Products, according to people familiar with the matter.
- 13 May 2015:Samsung on Tuesday revealed a new chip family to power the Internet of Things, putting it in more direct competition with Intel, Qualcomm and others in the quest to connect everything.
- The world's most expensive semiconductor fabrication plant - at over US$14 billion - was announced at the ground breaking ceremony Thursday (May 7) by Samsung. Located in the Godeok Industrial Complex at Pyeongtaek City Gyeonggi-do Province - called "Samsung Semiconductor Valley" - in South Korea, Samsung will be building 10-nanometer FinFET semiconductors there.
- 12 May 2015:Recently Mediatek came up with Helio X which is going to be a premium lineup from MediaTek where they will be competing with processors from Qualcomm & Exynos. With the debut of Helio X20 which is the first deca-core processor, Qualcomm and Exynos might have got to think about the number count which Mediatek is rushing with. But now it looks Qualcomm is also working with the same strategy and is running with the same.
- 7 May 2015:eMemory Technology's One-Time Programmable (OTP) NeoFuse technology has been successfully verified in 16nm FinFET process, with full silicon IP development and customer application deployment expected to be completed by the end of 2015.
- Foxconn's Terry Guo says he lobbied Apple to choose TSMC over Samsung for 'A9' (April 28) - Apple InsiderFoxconn boss Terry Guo said he pushed Apple to choose TSMC because Taiwanese companies must stick together against the "Korean Wave."
- 4 May 2015:The Samsung Galaxy S6 and S6 Edge have recently been plagued by serious memory problems, as poor memory management is leading to massive slowdowns and random app crashes, including force closes.
- 29 Apr 2015:Qualcomm has announced that its subsidiary, Qualcomm Technologies, is powering LG's latest flagship smartphone, the LG G4. The new smartphone is the first to feature the Qualcomm Snapdragon 808 processor with X10 LTE.
- 28 Apr 2015:ASML reaches agreement for delivery of minimum of 15 EUV lithography systems (April 22) - Company releaseASML has signed an agreement with one of its major US customers to deliver a minimum of 15 ASML EUV lithography systems to support increased development activity and pilot production of future-generation manufacturing processes.
- Cramer said competitors like Intel, Samsung, Qualcomm, ARM and Nvidia will fight the deal in Washington because it has the potential to crunch their gross margins by bringing up costs. He also pointed out that Washington has been relatively unfriendly to larger mergers this year.
- Samsung Electronics has inked an agreement to produce its 3D NAND solid state drives for Google, in a deal deemed to beef up the South Korean manufacturer's gameplay against its global competitors.
- 24 Apr 2015:Qualcomm's second-quarter profit dropped 46%, mainly because of a large fine the company had to pay in China for settling antitrust issues. The company also cut its revenue outlook for 2015, citing loss of business for its Snapdragon processor from key customer Samsung Electronics and a concentration of the premium market around two players - Apple and Samsung, among other factors.
- Samsung Electronics is set to spend at least another 10 trillion won (US$9.2 billion) to boost capacity at a new South Korean chip plant, a 64% increase over announced investment plans, domestic online news service MoneyToday reported.
- 23 Apr 2015:Texas Instruments has forecast current-quarter revenue below analysts' expectations, citing weak demand for its chips from communication equipment and consumer electronics markets and a strong dollar.
- Xilinx has reported that revenue fell 8.2%, missing expectations for the quarter ended in March and the chip maker's sales guidance for the current period missed analysts' estimates.
- Orbotech shares vision for future electronics manufacturing models; leverages rebranding efforts
- Indium Corporation's EZ-Pour Gallium Trichloride simplifies room temperature processes
- Entegris introduces the SmartStack 300 mm contactless horizontal wafer shipper for safer wafer handling
- Kilopass announces breakthrough memory technology for IoT devices
- DKIH common mode chokes for 1- and 3-phase applications mount on PCB
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Rockchip statement on merger rumor
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Mentor Graphics Veloce VirtuaLAB adds protocols for networking designs
- Mouser Electronics undergoing expansion
- Digitimes Research: Shrinking tablet market prompts China touch panel supply chain to look for growth elsewhere
- Digitimes Research: Tsinghua Unigroup acquisition of Micron faces difficulties, but is a must for China for further development
- Digitimes Research: Qualcomm to push inexpensive mobile device market with Microsoft and Allwinner solutions
A CNY120 billion (US$19 billion) national industry investment fund has been set up to help local foundries finance the build-up of advanced manufacturing...
Advanced Semiconductor Engineering (ASE) is seeking to acquire an up to 25% stake in fellow packaging house Siliconware Precision Industries (SPIL).
After acquiring MStar Semiconductor, MediaTek has announced more acquisitions.
Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies,...
China-based Tsinghua Unigroup is currently riding high in the global semiconductor industry with a...
While the product life cycles of analog ICs are getting shorter and shorter, the technical standards...
The acquisition of Freescale by NXP Semiconductors will make NXP the world's second largest MCU supplier...
Socionext, a Japan-based corporation focused on the design, development, and sales of system-on-chip...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Taiwan DRAM-module industry overview - May 2010
Back to 2006 when total revenues for the third-party module market reached US$12.2 billion, Taiwan had over 15 vendors shipping DRAM modules under their own brand...
- Taiwan semiconductor equipment industry overview - Aug 2008
Worries about a global economic downturn have taken a toll on a number of industries, with the semiconductor industry being no exception. Players in the semiconductor...
- Foundry overview - Sep 2006
Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility...