- 9 Aug 2013:Desktops, notebooks, tablets: Just five years ago, those three words defined three distinct classes of products. But now consumers are being asked to choose among all-in-ones, two-in-ones, convertibles, mini-tablets, ultraportables, and phablets. With Intel's new "Bay Trail" Atom chip, due this fall, you can expect the market to diversify even more.
- 6 Aug 2013:Japan's Renesas Electronics said Friday it will close a plant that makes system LSI chips for Nintendo's game consoles and other consumer electronics after failing to find a buyer for the facility in Tsuruoka in northern Japan.
- 5 Aug 2013:Ericsson and STMicroelectronics today announced the closing of the transaction for the split up of ST-Ericsson.
- 2 Aug 2013:As we store more and more of our personal lives on smartphones, mobile security is becoming increasingly crucial. A password offers some protection, but it may not deter a serious hacker.
- Possible sales ban for Samsung to be decided next week in patent infringement case (August 1) - TechHiveThe US ITC expects to complete its investigation into allegations of patent infringement between Apple and Samsung at the end of next week (August 4-11).
- Eight-core processors are "dumb," as the consumer wants an experience that comes from more than just throwing cores together, a Qualcomm executive said, referring to new eight-core chips announced recently.
- The deal, which follows such prior chip investments as the 2008 purchase of PA Semi, comes as Apple is widely believed to be moving beyond smartphones and tablets to other kinds of devices that could need wireless chips, including smart watches.
- 1 Aug 2013:TSMC recently held a job fair in upstate New York, helping to drive up expectations that the chipmaker is planning to open a chip fabrication plant in the area to build mobile processors for Apple.
- 31 Jul 2013:Micron Technology anticipates the closing of its acquisition of 100% of Elpida's equity to occur on July 31, 2013, Tokyo time. Micron also anticipates concurrently closing its acquisition of a 24% share of Rexchip Electronics from Powerchip Technology and certain of its affiliates.
- 30 Jul 2013:Qualcomm is to acquire a stake in Alcatel-Lucent as part of a far-reaching partnership agreement to develop the next generation of smaller mobile cell transmitters capable of coping with the rapid increase in mobile data.
- 29 Jul 2013:When he founded Taiwan Semiconductor Manufacturing Company (TSMC) in 1987, Morris Chang recalls, "Nobody thought we were going anywhere."
- KLA-Tencor forecast current-quarter revenue below expectations as slumping personal computer sales hurt demand for new chip-manufacturing gear, sending its shares lower.
- Mali graphics IP core shipments are on course to be more than 300 million units in 2013, more than doubling the 150 million units shipped in 2012, according to Simon Segars, CEO of processor IP licensor ARM.
- Struggling chip-maker Renesas Electronics Corp. is looking to close or shrink its major production base for system LSI chips in Tohoku after failing to sell it to a Taiwanese firm, company sources said Saturday.
- 25 Jul 2013:Qualcomm rose 3% in after-hours trading Wednesday after the company booked US$6.2 billion in its third quarter, its twelfth straight quarter of double-digit gains, and raised its outlook for the full year.
- Spansion has expanded its serial peripheral interface (SPI) portfolio with the introduction of FL-1K family.
- 24 Jul 2013:
- 23 Jul 2013:Texas Instruments gave a third-quarter revenue forecast that was stronger than some analysts expected and said customers seem more confident about placing orders for chips.
- Aptina has announced a new 13-megapixel sensor for smartphones, the AR1331CP.
- Avago Technologies has announced that its 28nm Serializer/Deserializer (SerDes) core has achieved 32Gbps performance while withstanding up to 40dB of channel loss.
- 22 Jul 2013:Wolfson Audio Hub adopted for Sharp's latest smartphone and tablet devices (July 11) - Company releaseWolfson's WM5102 HD audio hub has been adopted by Sharp for its new range of AQUOS smartphone and tablet devices.
- Nova Measuring Instruments, the Israeli maker of equipment for semiconductor manufacturing, rebounded in New York after the chief executive officer said he's confident its largest customer won't pare back orders.
- 16 Jul 2013:The only thing that counts against Globalfoundries is that, being a newcomer with a new US fab, it has yet to build up a long track record of consistent, successful execution. This is one reason Apple would not wish to have all its processor eggs in one foundry, as it does now with Samsung.
- 15 Jul 2013:Samsung Electronics will supply 14nm A9 chips that will be used for Apple's iPhone 7.
- There's now a rumor that the fruity iPhone maker will make its own chips, thus entering the fab industry thanks to a purchase of an unnamed chip fabricator. There's speculation that Taiwan-based chipmaker UMC was Apple's purchase of choice.
- If Apple owned capacity at a fab, it would give the company the kind of control over both design and chip manufacturing that Intel has.
- 12 Jul 2013:
- Applied Materials demonstrates momentum for profitable growth in mobile era (July 8) - Company releaseConsumer demand for sophisticated mobile devices creates profitable growth opportunities for Applied's semiconductor and display equipment businesses.
- 11 Jul 2013:Amazon, Sony and Nvidia are emerging as potential customers who will replace Apple as key buyers of Samsung Electronics' semiconductors, sources said Tuesday.
- ARM chipmakers TSMC and Globalfoundries plan to release ARM processor chips capable of running at 3GHz sometime in 2014.
- 10 Jul 2013:Xilinx has worked with TSMC to infuse high-end FPGA requirements into the TSMC 20SoC development process, just as it had done in the development of 28HPL.
- Samsung is putting down roots in Silicon Valley.
- 9 Jul 2013:The original goal was two fabs and after the latest chip initiative was formed two years ago, it managed to finally shortlist two consortia to set up chip fabrication units in the country.
- 3 Jul 2013:The two companies have reached an agreement to share patents for chipmaking technologies.
- 27 Jun 2013:With Toshiba's existing chip facilities now running at full capacity, the company may spend some of a 38% hike in its capex budget this year on extending a factory, the company's incoming president, Hisao Tanaka, said in a recent interview.
- 26 Jun 2013:
- 25 Jun 2013:Toshiba also may be among the initial customers since the three companies partner with SK Hynix on the development of resistive random access memory, or ReRam.
- Samsung reduces parts inventory for first time in its smartphone-making history (June 20) - ETNews.comThe July order for Galaxy S4 parts is for 6.5 million handsets, which is only about a half of the same order placed for May.
- G.SKILL Releases World's Fastest DDR4 3333MHz Memory, Available Now! The Bleeding Edge of Speed Has Arrived!
- Indium Corporation announces new EZ-Pour Gallium Trichloride
- Genesys Logic announces a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics
- Indium Corporation expands Shenzhen sales office to accommodate growth
- Entegris offers new VaporSorb filter for advanced yield protection in semiconductor processing
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: Intel looking to promote x86 architecture to China chip designers
- Digitimes Research: Hisilicon AP to give Huawei cost advantage in high-end mobile device market
- Digitimes Research: Google looking to clean up Android device mess in emerging markets
- Digitimes Research: Qualcomm far ahead of Marvell and MediaTek in China LTE market
- Turning a smartphone into a PC in a pocket: Q&A with Analogix
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