- 10 Apr 2013:Kingston's 512GB USB 3.0 Drive might have trouble being used as a boot drive for multiple operating systems as a result of this bug.
- Cadence, TSMC strengthen collaboration on design infrastructure for 16nm FinFET process (April 8) - Company releaseCadence Design Systems has announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.
- 9 Apr 2013:Worldwide semiconductor revenues reached US$299.9 billion in 2012, down 2.6% from 2011, according to Gartner.
- 1 Apr 2013:Lenovo, which has maintained a small IC design team consisting of about 10 people over the last decade, is now committed to expanding this team to about 100 engineers by the middle of 2013, according to a China-based industry source with direct knowledge of the company's recruitment of chip designers.
- Analog Devices' CEO Jerald Fishman has died at age 67 following an apparent heart attack Thursday night, according to the company.
- 29 Mar 2013:The HTC One was successfully torn down, but the excessive use of glue, rather than screws, helped make this device the single most difficult cellphone ever disassembled.
- The president of struggling Renesas Electronics said Thursday that the chipmaker is in talks with overseas companies on selling its loss-making mobile device chip operations as part of efforts to streamline its business.
- 28 Mar 2013:STMicroelectronics has signed a loan agreement with the European Investment Bank to strengthen its finances.
- Samsung Semiconductor is moving swiftly to begin work on a new 680,000-square-foot office project that will be built on its existing 215,000-square-foot office complex at North First Street and West Tasman Drive.
- 27 Mar 2013:Persistent speculation about a pending merger between Chinese fabless chip vendors RDA Microelectroics and Spreadtrum Communications may have some basis in reality, but word is that RDA has its sights set on a higher bidder.
- I have to admit I missed this item of news that came out last October. And the news was that successful MEMS company InvenSense had announced that its founder and CEO, Steve Nasiri, would be stepping down from the company.
- 26 Mar 2013:Micron Technology is poised to get a US$400 million discount on the acquisition of Japanese rival Elpida Memory, after a 16% slump in the yen against the US dollar.
- Micron Technology has posted a quarterly loss, hurt by acquisition-related expenses, but the chipmaker's revenue and margins improved.
- The latest toxic gas leaks may not have caused serious physical harm, but the fact that the culprit companies failed to promptly report to state authorities is raising suspicions of corporate negligence.
- Semiconductor Manufacturing International (SMIC), for the first time in a long time, has a good story to tell.
- 22 Mar 2013:Manufacturing activity in China picked up speed in March, an initial HSBC survey has indicated, adding to hopes of a sustained recovery in its economy.
- 20 Mar 2013:The deal aims at building a long-term, mutually beneficial relationship between Renesas and J-Devices as strategic partners in the semiconductor production business. The two companies intend to complete the transfer on June 1, 2013.
- ARM has announced that CEO Warren East has decided to retire from the company, effective 1 July 2013. Simon Segars, currently president of ARM, will become the company's new CEO.
- 18 Mar 2013:STMicroelectronics and Ericsson have agreed to split up their unprofitable ST-Ericsson chip venture after failing to find a buyer for the business, cutting about 1,600 jobs as they divide the assets.
- Each time in recent years that the Federal Reserve has paused in its efforts to stimulate the economy, it has come to regret the decision as premature.
- "We are proud to say that the newest Snapdragon 600 processor is at the heart of the GALAXY S 4 in select regions," Qualcomm said in a blog post.
- Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011.
- 15 Mar 2013:Cadence Design Systems has entered into a definitive agreement to acquire Tensilica, a leader in dataplane processing IP, for approximately US$380 million in cash.
- 14 Mar 2013:China is over-reliant on imported goods for its semiconductor industry, and local chip companies supply only about 10% of its domestic needs as they remain in the development stage despite years of investments.
- 13 Mar 2013:Despite continued rumors that Apple has been working very hard to transition away from Samsung for production of A-series chips, it appears that Apple has not yet been able to make that step on a mass production basis, as this new smaller A5 is still being fabbed by Samsung.
- The reason is quite understandable really: demand for DRAM is still dropping, so how can there be a price improvement?
- 12 Mar 2013:Fab equipment spending for front-end facilities is expected to be flat in 2013, remaining around US$31.7 billion, increasing to US$39.3 billion in 2014 - a 24% increase.
- Intel's next CEO is likely to shepherd the top chipmaker into a growing contract-manufacturing business, a strategic shift that could lead to a deal with Apple Inc and give it a fighting chance to make inroads in the mobile arena.
- 11 Mar 2013:Spansion and UMC announce joint technology development and licensing agreement (March 4) - Company releaseSpansion and United Microelectronics (UMC) have announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap (eCT) Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.
- 10 Mar 2013:"Led by continuing strength in the Americas, the global semiconductor industry has built on its momentum from the end of 2012 with an encouraging start to 2013, but ongoing economic uncertainty is holding back more robust growth," said Brian Toohey, president and CEO of Semiconductor Industry Association (SIA).
- Texas Instruments, the largest maker of analog chips, raised the lower end of its forecasts for first-quarter sales and profit, as customers increase orders ahead of a projected rebound in electronics demand.
- Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January. Capex budgets are also being trimmed for NAND flash (though not nearly as much as DRAM), and that, along with ongoing unit demand, has put upward pressure on ASPs for these memory devices as well.
- 5 Mar 2013:
- 1 Mar 2013:SanDisk partners with Nvidia on Tegra 4-powered tablet reference design (February 25) - Company releaseSanDisk has announced that the iNAND Extreme Embedded Flash Drive (EFD) supports tablet reference designs based on the Nvidia Tegra 4.
- 27 Feb 2013:The board of directors of Toshiba has nominated Hisao Tanaka, corporate senior executive VP of Toshiba, for the post of president and CEO of the company.
- 26 Feb 2013:Growth in the giant China manufacturing sector in February withdrew from the highest point in nearly two years despite a fourth consecutive month of expansion, a private survey showed Monday, as foreign demand remained unsteady.
- JEDEC Solid State Technology Association has announced that its board of directors appointed two new members, Jong H. Oh of SK hynix and Hung Vuong of Qualcomm.
- 21 Feb 2013:Qualcomm has announced a pair of new mobile processors designed for entry-level and mid-range smartphones. Expected in handsets later in 2013, the Snapdragon 200 and 400 balance the high-end 600 and 800 processors introduced in January.
- Globalfoundries offers enhanced 55nm CMOS logic process with ARM next-generation memory and logic IP support for low voltage (February 19) - Company releaseThe 55nm LPe 1V is especially suited for high-volume, battery-operated mobile consumer devices, as well as a broad range of green or energy-saving products. PDK and EDA tools are available now, along with MPW shuttle availability.
- Atmel moves its groundbreaking XSense touch sensor into mass production
- Indium features new, high-reliability solder alloy SACM at Productronica
- Orbotech Ultra Fusion 600 delivers advanced performance with high speed for IC substrates down to 5μm
- Orbotech presents advanced technologies for HDI and IC substrate production
- Indium soldering products meet new IPC J-STD004B
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
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