- 17 Dec 2013:MagnaChip Semiconductor has completed qualification of 0.18-micron EEPROM IP developed in partnership with eMemory Technology, a Taiwan-based non-volatile memory (NVM) IP provider.
- Earlier this year, after Apple released the first 64-bit chip for smartphones, a Qualcomm spokesperson claimed the A7 processor was a "marketing gimmick" and that there is "zero benefit" to the consumer from the chip. Those comments were later walked back before the executive who made them was reassigned.
- 16 Dec 2013:The acquisition expands ARM's position at the forefront of the visual computing and graphics industries. Additionally, the agreement enables Geomerics to build on their existing partnerships as well as accelerate their development in mobile.
- Chip companies serving the automotive industry know exactly where the next-generation MCU battle will be played out: high-performance MCUs with fast-access flash memory at 40-nanometer process.
- 13 Dec 2013:CSR, the Cambridge-based microchip maker, has announced a retreat from the digital camera market as sales decline and amateur photographers increasingly rely on smartphones.
- Imagination Technologies yesterday saw its shares crash 16% to a three-year low, amid slowing smartphone growth and a slide in profits.
- 12 Dec 2013:Qualcomm will take a wait and see approach before turning to Intel's expanding foundry operation to manufacture its chips, Qualcomm CEO Paul Jacobs said Wednesday.
- Qualcomm intros Snapdragon 410 chipset with integrated 4G LTE for smartphones (December 9) - Company releaseThe new Snapdragon 410 chipsets are manufactured using 28nm process technology. They feature processors that are 64-bit capable along with superior graphics performance with the Adreno 306 GPU, 1080p video playback and up to a 13-megapixel camera.
- 11 Dec 2013:Rambus and Micron Technology have signed a broad patent cross-license agreement, giving Micron the right to use any Rambus patent for the manufacture of specified integrated circuit products, including memories.
- 5 Dec 2013:"Our latest checks for the 20nm technology production levels at TSMC are weaker than expectations and are projected to reach only 5,000 wpm by year-end," say BlueFin Research Partners anaylsts.
- 4 Dec 2013:Electronics firm Sony is considering the purchase of a Japanese chip plant from Renesas Electronics so that it can enhance production of smartphone image sensors, reports said.
- 3 Dec 2013:Xilinx has made its first customer shipment of a 20-nm UltraScale device, which is implemented in TSMC's 20nm process technology.
- The IMEC research center has demonstrated a new FinFET using III-V compound semiconductor material produced on 300mm wafers. This is the first time that such transistors have been produced.
- 2 Dec 2013:South Korea's largest family-owned conglomerate, Samsung Group, on Monday promoted the group owner's daughter to president of its de-facto holding firm.
- 29 Nov 2013:David Einhorn's hedge fund Greenlight Capital reported a stake of about 23.02 million shares in US memory chipmaker Micron Technology, according to a filing on Monday.
- 28 Nov 2013:Qualcomm Life, launched two years ago as a division of the San Diego-based telecommunications giant Qualcomm, is building software and protocols that could bring some order to the chaos of health data. Its first product, called the 2Net Platform, is a system for getting wireless data off those devices and onto the Internet servers of clients, like health device makers or hospitals.
- A software engineer formally involved in the development of the Siri voice assistant at Apple has joined Samsung's new talking internet of things initiative.
- 27 Nov 2013:Japan's Panasonic will sell three domestic semiconductor factories to Israel's TowerJazz as early as the current business year ending March, sources with direct knowledge of the matter said, bringing the embattled electronics giant closer to completing the overhaul of its loss-making businesses.
- The dynamics of the solid-state state drive market are shifting, and for Abhi Talwalkar it's been a disappointing shift in 2013.
- 26 Nov 2013:Apple has agreed to acquire PrimeSense, the maker of motion-tracking chip technology that was used in Microsoft's Kinect game console.
- Qualcomm said the probe involved China's anti-monopoly law, but added that regulators told it the "substance of the investigation is confidential."
- 25 Nov 2013:Rumors have buzzed surrounding ARM' possible release of 128-bit chip designs to power various new smartphones. Most recently, via PCPro UK, the company was cited by the Korea Herald to promise 128-bit architecture "within the next two years."
- DRAM's days numbered as Japan-US chip alliance homes in on MRAM (November 24) - Nikkei Electronics AsiaMore than 20 Japanese and US semiconductor-related companies are teaming up to develop a mass production method for next-generation memory chips.
- 22 Nov 2013:
- For years, technologies like Apple's Siri and Google's Google Now have been flying blind, awoken by the spoken command of their users. If Apple acquires PrimeSense, perceptual computing may finally open its eyes.
- Apple came in at No. 46 on the European Union's R&D spending report released this week, which ranked the top 2,000 global companies.
- "If we can use our silicon to provide the best computing, we'll do it," Intel CEO Brian Krzanich said. "You will see us focusing on a much broader set of customers."
- 21 Nov 2013:Kionix has announced that the KMX61G Micro-Amp Magnetic Gyro has met Microsoft's stringent sensor fusion requirements and received Windows 8.1 certification.
- Since Imagination's acquisition of MIPS Technologies in February 2013, the company has closed 22 MIPS related deals.
- ARM predicts a shift in demand toward lower-priced smartphones will help boost royalty revenues.
- 19 Nov 2013:Dongbu Group will sell off its core unit Dongbu HiTek, a silicon foundry that makes integrated circuits for other companies under contract, as a way to quell market concerns about the group's financial future.
- Spansion launches family of flexible MCUs for industrial "Internet of Things" (November 18) - Company releaseSpansion has announced a complete family of microcontrollers addressing high performance and low power needs for industrial applications such as factory automation, building management, inverter drives, smart meters, home appliances and medical devices.
- 18 Nov 2013:German semiconductor maker Infineon Technologies has reported higher revenues in the fourth fiscal quarter and forecast an increase in revenues for fiscal 2014.
- 15 Nov 2013:Applied Materials is benefiting from an increase in demand from companies such as TSMC that build semiconductors for other chipmakers, as they upgrade plants for new production processes.
- 13 Nov 2013:Sources close to the situation said the deal that appears to be taking shape looks more like this: Samsung will use Globalfoundries for what is known as "flex capacity." This is a long-standing industry practice under which a chip manufacturer pays to occasionally use another company's factories when demand on their own factory is running higher than they would like, and they need a little help.
- 12 Nov 2013:Apple is developing new iPhone designs including bigger screens with curved glass and enhanced sensors that can detect different levels of pressure, said a person familiar with the plans.
- Intel plans to lay off by end-2013 an undisclosed but "relatively small" number of workers at both of its assembly plants in Malaysia, the US chip maker's regional spokesman said Monday.
- XMC opens US office to support global growth of unique partnership-based foundry offering (November 12) - Company releaseThe focus of the US operations will be to find and support partners that can leverage XMC's customized manufacturing capabilities. XMC is currently in production technology nodes down to 45nm. Its leading-edge fabrication facilities in Wuhan China can be configured to produce up to 60,000 300mm wafers per month.
- GlobalFoundries is preparing to make chips for Apple's iPhone and iPad at its Fab 8 complex in Malta, according to a source close to the company.
- KFA: Compact power entry module with filter now with ground line choke
- Advantest wins new customer with installation of V93000 semiconductor test system at Shanghai Haier IC in China
- Indium Corporation features NC-SMQ75 die-attach solder paste at Productronica China
- Advantest opens registration for VOICE 2015 developer conference May 12-14
- G.SKILL releases the fastest DDR4-3400MHz memory kit
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: Smartphone AP suppliers looking to offload inventory to tablet market
- Digitimes Research: Intel simplifies Atom product lines for mobile devices
- Digitimes Research: Qualcomm antitrust probe reshapes patent licensing in China
- Digitimes Research: Qualcomm Snapdragon 810 ships as scheduled for Xiaomi and LG product launches
- Digitimes Research: Nvidia steps up efforts for GPU licensing
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