- 21 May 2013:RFMD will phase out manufacturing in its UK-based GaAs pHEMT facility and transition most GaAs manufacturing to its GaAs HBT manufacturing facility in Greensboro, NC. RFMD will also partner with leading GaAs HBT foundries for additional capacity.
- Samsung Electronics ranked first in terms of production of sub 28-32 nanometer chip foundry in the first quarter of the year, data showed on Monday.
- 20 May 2013:It may seem strange but Chinese chip vendor Allwinner Technologies (Zhuhai, China) probably sold more application processors for tablet computers in 2012 than Intel and Qualcomm put together.
- 17 May 2013:Imec and Renesas Electronics have entered into a new strategic research collaboration at Holst Centre. Together, the companies will collaborate to enhance ultra-low power (ULP) wireless technologies for short range communication, targeting sensor networks for automotive and industrial purposes.
- 9 May 2013:
- 8 May 2013:IC Insights forecasts that in 2017, fabless IC companies will command at least one-third (33%) of the total IC market.
- 7 May 2013:Rubinstein's experience at a handset vendor, as well as at a large computing company like HP, will help Qualcomm with its strategy.
- 6 May 2013:German chipmaker Infineon brightened its gloomy outlook for this year, citing orders from carmakers hoping sales of higher-spec models in China will offset flagging demand in Europe.
- 3 May 2013:Intel hasn't signaled a change in strategy with the appointment of Brian Krzanich to CEO, but it is likely that the company will take steps to outrun its foundry competition by opening its industry-leading manufacturing facilities to more third parties.
- 2 May 2013:Altera posted revenue slightly below expectations in the first quarter and the programmable chipmaker said it was beginning to see a recovery from a dip in demand from its communications and industrial customers.
- 30 Apr 2013:SK Hynix Semiconductor will be supplying Samsung Electronics with memory chips as early as June, industry sources said on Monday. The firm will supply enough to make up 20% of Samsung's mobile business.
- 26 Apr 2013:Although smartphone sales are still climbing Qualcomm is now facing fiercer competition from other chip makers, including Intel, which has been redesigning its microprocessors in an attempt to grab a bigger piece of the mobile computing market.
- For the first time, the company that makes more than half the world's mobile DRAM chips may buy them from SK Hynix, said Shin Jong Kyun, head of Samsung's mobile business.
- 25 Apr 2013:
- 24 Apr 2013:David Falvo, an ex-IT worker who resides in Fulton County, accuses Globalfoundries of violating US and New York labor laws in a range of ways.
- ARM jumped the most in more than four years after reporting sales that beat estimates as demand increased for its graphics and processing technology.
- Finnish phone maker Nokia has won a court injunction banning HTC from using microphone parts made by STMicroelectronics in its flagship HTC One phones, in a move that will deepen the problems at the struggling Taiwanese handset company.
- 19 Apr 2013:For 30 years Altera has used the same, sole-sourced foundry - TSMC. Recently it announced it would be going to Intel for sole-sourced foundry at the 14nm generation. Isn't this a risk?
- 18 Apr 2013:Samsung Electronics is considering purchasing mobile memory chips from rival SK Hynix Inc for future products including its new flagship Galaxy S smartphone to be launched this month, JK Shin, head of Samsung's mobile business, said on Thursday.
- GlobalFoundries, the contract chip manufacturer whose clients include Advanced Micro Devices (AMD) and Qualcomm, plans to spend US$4.4 billion in 2013 to expand production as demand for smartphones and tablets climbs.
- 17 Apr 2013:
- 16 Apr 2013:Altera has agreed to acquire TPACK, a wholly-owned subsidiary of Applied Micro Circuits. TPACK delivers complete FPGA-based OTN (optical transport network) products targeting packet and optical networking equipment suppliers.
- "More generally there is a growing level of dissatisfaction among Apple executives and employees, and a greater willingness to explore leaving..."
- Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by Globalfoundries will create new opportunities for equipment and materials suppliers in Southeast Asia.
- 15 Apr 2013:
- TSMC has pulled in plans for initial production of its 16nm FinFET process to the end of 2013. In addition, it hopes to adopt extreme ultraviolet lithography to make 10nm chips starting in late 2015 but is still researching e-beam as an alternative.
- After strong gains in 2010 and 2011, power transistor sales fell more than 8% in 2012 to US$12.3 billion primarily due to weak economic growth and high levels of uncertainty, which caused equipment makers to rein in semiconductor purchases, according to IC Insights.
- Toshiba has said that it will concentrate on three fields: analog, automotive and communications in 2013.
- China's economic growth slowed unexpectedly in the first quarter, raising concerns that a recovery that started in the second half of last year is already losing steam.
- 10 Apr 2013:Data from Chinese semiconductor industry sources identifies Allwinner as, by far, the number one apps processor supplier for Chinese tablets in 2012, followed by Rockchip, ViaTech, Amlogic and Vimicro.
- At a recent event in San Jose, California, TSMC CEO Morris Chang said that company sales will rise at a percentage in the teens this year.
- Kingston's 512GB USB 3.0 Drive might have trouble being used as a boot drive for multiple operating systems as a result of this bug.
- Cadence, TSMC strengthen collaboration on design infrastructure for 16nm FinFET process (April 8) - Company releaseCadence Design Systems has announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.
- 9 Apr 2013:Worldwide semiconductor revenues reached US$299.9 billion in 2012, down 2.6% from 2011, according to Gartner.
- 1 Apr 2013:Lenovo, which has maintained a small IC design team consisting of about 10 people over the last decade, is now committed to expanding this team to about 100 engineers by the middle of 2013, according to a China-based industry source with direct knowledge of the company's recruitment of chip designers.
- Analog Devices' CEO Jerald Fishman has died at age 67 following an apparent heart attack Thursday night, according to the company.
- 29 Mar 2013:The HTC One was successfully torn down, but the excessive use of glue, rather than screws, helped make this device the single most difficult cellphone ever disassembled.
- The president of struggling Renesas Electronics said Thursday that the chipmaker is in talks with overseas companies on selling its loss-making mobile device chip operations as part of efforts to streamline its business.
- 28 Mar 2013:STMicroelectronics has signed a loan agreement with the European Investment Bank to strengthen its finances.
- Enriching multiple MEMS applications for mobile devices
- Dialog Semiconductor expands into ultrabooks and all-in-one PCs with a new generation of multi-touch display sensor ICs
- Altera Cyclone V GT FPGA is industry first low-power FPGA to achieve compliance for PCIe Gen2 at 5 Gbps
- Digi-Key adds Califia Lighting to line card of more than 650 global suppliers
- A Changing Landscape - Chilisin on the Rise
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
- Coto Technology claims industry's smallest MEMS reed switch
- Silicon Labs introduces single-chip digital radio receivers for CE devices
- Memory makers see better profits as chip pricing improves
- Globalfoundries quietly becoming a threat to competitors
- Digitimes Research: Mobile devices to drive 2013 DRAM market
Samsung Electronics reportedly is looking to expand the purchase of memory products, including mobile DRAM chips and eMMC NAND devices, from outside.
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