- 26 May 2015:The next-generation iPhone will reportedly sport a camera with a 12-megapixel Sony sensor that makes use of the firm's RGBW technology to help with low-light photography.
- 25 May 2015:Globalfoundries offers new low-power 28nm solution for high-performance mobile and IoT applications (May 20) - Company releaseGlobalfoundries has announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.
- Samsung was shy on specs, but said the process node will be in full production by the end of 2016, about the same time as its rival TSMC.
- 21 May 2015:Huawei and Qualcomm jointly complete CAT11-based 3CC CA+256QAM test, reaching 600 Mbit/s rate - Company releaseHuawei and Qualcomm Technologies, a subsidiary of Qualcomm, have jointly announced the completion of tests using LTE CAT11 terminals.
- 20 May 2015:The US has charged six Chinese nationals over the alleged theft of technology used in mobile phones. The six, including three university professors, are accused of using the technology to benefit universities and companies controlled by Beijing.
- 19 May 2015:A new leaked roadmap slide purportedly showing Intel's plans through to the end of 2016 has been published by a Finnish computer technology website. If the slide is genuine we will likely see Intel release its first 10nm Cannonlake CPUs sometime around the second and third quarters of next year.
- As Apple basks in the unprecedented demand for its latest iPhones, suppliers from Tokyo to Taipei are sharing in the spoils.
- Xiaomi wants its own custom-designed processors to differentiate its products and control its destiny, an executive of Leadcore Technology told EE Times.
- 18 May 2015:Fujitsu and Intel have reached an agreement to combine Fujitsu Laboratories' distributed service platform technology with the Intel IoT Gateway to build out comprehensive IoT solutions.
- The recent earnings season turned out to be largely good news for the companies that make semiconductor manufacturing gear. But investors haven't quite come around yet.
- Silicon Storage Technology and Globalfoundries announce qualification of auto grade 55nm embedded flash memory technology (May 5) - Company releaseMicrochip Technology through its Silicon Storage Technology (SST) subsidiary and Globalfoundries have announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on Globalfoundries' 55nm Low Power Extended (LPx)/ RF enabled platform.
- 15 May 2015:With the adoption rate of the ARM mbed IoT Device Platform increasing rapidly, the company has announced a new assurance standard, the ARM mbed Enabled program.
- Avago Technologies, looking to acquire a fellow chipmaker, has reached out to potential targets including Xilinx, Renesas Electronics and Maxim Integrated Products, according to people familiar with the matter.
- 13 May 2015:Samsung on Tuesday revealed a new chip family to power the Internet of Things, putting it in more direct competition with Intel, Qualcomm and others in the quest to connect everything.
- The world's most expensive semiconductor fabrication plant - at over US$14 billion - was announced at the ground breaking ceremony Thursday (May 7) by Samsung. Located in the Godeok Industrial Complex at Pyeongtaek City Gyeonggi-do Province - called "Samsung Semiconductor Valley" - in South Korea, Samsung will be building 10-nanometer FinFET semiconductors there.
- 12 May 2015:Recently Mediatek came up with Helio X which is going to be a premium lineup from MediaTek where they will be competing with processors from Qualcomm & Exynos. With the debut of Helio X20 which is the first deca-core processor, Qualcomm and Exynos might have got to think about the number count which Mediatek is rushing with. But now it looks Qualcomm is also working with the same strategy and is running with the same.
- 7 May 2015:eMemory Technology's One-Time Programmable (OTP) NeoFuse technology has been successfully verified in 16nm FinFET process, with full silicon IP development and customer application deployment expected to be completed by the end of 2015.
- Foxconn's Terry Guo says he lobbied Apple to choose TSMC over Samsung for 'A9' (April 28) - Apple InsiderFoxconn boss Terry Guo said he pushed Apple to choose TSMC because Taiwanese companies must stick together against the "Korean Wave."
- Indium Corporation receives SMT China Vision Award
- Surf on the mobile world: You'll never forget the eMMC duplicator
- Advantest ships 4,000th V93000 semiconductor test system to Taiwanese test house Ardentec
- Indium Corporation's Greg Evans awarded Cheongju City's Businessman Award
- Indium Corporation releases BiAgX solder paste technology as drop-in replacement for high-Pb solders
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Is Japan losing its influence in global semiconductor market?, asks IC Insights
- Digitimes Research: Samsung to adopt MediaTek APs for smartphones
- Digitimes Research: Smartphone AP suppliers looking to offload inventory to tablet market
- Digitimes Research: Intel simplifies Atom product lines for mobile devices
- Digitimes Research: Qualcomm antitrust probe reshapes patent licensing in China
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