- 12 May 2014:
- 24 Apr 2014:More than a year after announcing plans to combine their struggling system chip operations, Fujitsu and Panasonic are finally launching their new merged company with the help of Japanese government money.
- 21 Apr 2014:NXP Semiconductors has announced its investment in Senseg, a leader in next-generation spatial haptic feedback technology.
- 14 Apr 2014:
- 1 Apr 2014:Taiwan Semiconductor Manufacturing Co (TSMC), the world's biggest contract chipmaker, is expected to expand its global market share to more than 50 percent this year and to 60 percent in the next few years, benefiting primarily from its leadership position in advanced technologies, Credit Suisse AG said yesterday.
- Taiwan's semiconductor pioneer Morris Chang on Thursday said the protracted protest against the trade pact with Beijing is casting a gloom over the nation's future, calling for a rational and peaceful solution.
- 7 Mar 2014:STMicroelectronics and rivals such as NXP Semiconductor and Qualcomm are battling to be picked to provide the brains for the various products in the hot segment.
- Qualcomm has announced the management transition of Steve Mollenkopf to CEO and Paul E. Jacobs to executive chairman of the board of directors.
- 6 Mar 2014:Hillcrest Labs and Bosch Sensortec collaborate on sensor hub solution for head-mounted displays and wearable devices (March 6) - Company releaseHillcrest Labs and Bosch Sensortec have announced a partnership to launch a new sensor solution for head-mounted displays (HMDs).
- 5 Mar 2014:More than 450 employees at NXP Semiconductors wafer fab in Nijmegen, The Netherlands, have held a two-hour strike in protest at stalled wage negotiations, according to local reports.
- Intel is in the process of buying smartwatch startup Basis, as part of the tech giant's new focus on wearables and the Internet of Things.
- 4 Mar 2014:
- Broadcom collaborates with Datang Mobile to develop 4G LTE small cell solution (February 25) - Company releaseBroadcom has announced that Datang Mobile, a core subsidiary of the Datang Telecom Technology and Industry Group, has selected Broadcom's dual-mode TD-SCDMA/TD-LTE system-on-chip (SoC) to develop a new family of enterprise and residential small cell solutions.
- Amtech Systems, a supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, has received approximately US$10 million in new solar orders.
- Intel is expecting its next Atom tablet chip, code-named Cherry Trail, to be in devices by the end of 2014, the company said this week.
- Chipmaker Avago Technologies said it expects current-quarter sales to decline 3-6% from the first quarter as it lost revenue from a smartphone maker, which analysts said could be Apple.
- 27 Feb 2014:Fujitsu, Docomo, NEC abandon development of smartphone chips (February 27) - Nikkei Electronics AsiaFujitsu, NTT Docomo and NEC will dissolve by March a joint venture for developing core chips for smartphones. The venture, Access Network Technology, was formed in August 2012 to develop baseband chips.
- GCT Semiconductor has licensed the Cadence Tensilica ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications.
- JEDEC Solid State Technology Association has announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard describes new memory timing parameters and enables higher capacity memory modules.
- Qualcomm announces commercial 20nm LTE advanced chipset for automotive (February 24) - Company releaseThe Gobi 9x30 is the world's first commercially announced cellular modem for automotive based on the 20nm technology node with support for global carrier aggregation deployments up to 40MHz in both LTE FDD and TDD modes.
- 26 Feb 2014:Toshiba develops device controller for embedded NAND flash memory module compliant with JEDEC UFS Ver.2.0 standard (February 25) - Company releaseToshiba has developed what it claims is the world's fastest device controller for embedded NAND flash memory modules compliant with the Universal Flash Storage (UFS) Ver.2.0 and UFS Unified Memory Extension (UME) Ver.1.0 standards defined by JEDEC Solid State Technology Association (JEDEC).
- International Rectifier (IR) has commenced initial production at its new ultra-thin wafer processing facility in Singapore. Wafer thinning, metallization, testing and additional proprietary wafer level processing are undertaken at the new 60,000 square foot manufacturing site which receives processed wafers from IR's internal fabs and foundry partners.
- 25 Feb 2014:RF Micro Devices and TriQuint Semiconductor have announced a definitive merger agreement under which the companies will combine in an all-stock transaction. To reflect the nature of this transaction as a merger of equals, the new company will have a new name and shared leadership team.
- Qualcomm Snapdragon chipsets power new Samsung Galaxy S5 and Galaxy Grand 2 (February 25) - Company releaseThe Samsung Galaxy S5 features the Qualcomm Snapdragon 801 processor with integrated LTE. Additionally, the Qualcomm Snapdragon 400 processor is featured in the Samsung Galaxy Grand 2, bringing LTE connectivity in mainstream smartphones.
- InvenSense announces turnkey commercial grade wearable platform for health and fitness (February 24) - Company releaseInvenSense has announced a turnkey wearable platform solution intended to substantially shorten the time-to-market for any OEM or ODM.
- Hillcrest Labs brings advanced motion control to Oppo mobile devices (February 24) - Company releaseHillcrest Labs has announced that Oppo, a China-based CE manufacturer and smartphone OEM, is using Hillcrest's patented Freespace software to provide advanced motion-based functionality on their latest smartphones.
- 24 Feb 2014:Qualcomm has leaped ahead of Apple in 64-bit mobile chip development with its first eight-core Snapdragon 615 chip for mobile devices, which has integrated LTE and 4K video rendering capabilities.
- Renesas develops 28nm embedded flash memory technology for microcontrollers (February 18) - Company releaseRenesas Electronics has developed what it claims is the industry's first 28-nanometer (nm) flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.
- 20 Feb 2014:Qualcomm is under investigation in China for allegedly overcharging and exploiting its market position, which will see the US chipmaker facing fines of over US$1 billion.
- 19 Feb 2014:South Korean multinational conglomerates Samsung and LG are considering setting up units to manufacture electronic chips in India, following the government's clearance to build two such semiconductor units.
- 17 Feb 2014:Samsung Electronics Co said a memory chip plant being built in China will start operations as planned in the first half of 2014 and the company will remain flexible about further investment in the factory.
- AMD is rolling out its server CPU platform based on ARM's 64-bit technology - the first of such collaboration between the two firms. The Opteron A1100 series chip, codenamed Seattle, is fabricated using 28nm process technology, and the chip maker plans to sample it this quarter.
- 14 Feb 2014:ARM enhances IP suite for 2015 mid-range mobile and consumer markets (February 11) - Company releaseARM has announced an enhanced suite of higher performance and more energy-efficient products specifically designed for the rapidly growing mid-range mobile and consumer electronics markets.
- 13 Feb 2014:Chipmaker Microchip Technology said it would buy Supertex for US$394 million in cash to bolster its business that supplies to the medical, LED lighting, industrial and telecommunication industries.
- 12 Feb 2014:Sony has entered negotiations with Apple to double its supply of camera components for a new iPhone slated to roll out as early as next year.
- 11 Feb 2014:Infineon projects higher sales as car and security units pick up (January 30) - Bloomberg (via Businessweek)Infineon Technologies has projected sales growth in its fiscal second quarter as orders for automotive and identity-checking components rise.
- KFA: Compact power entry module with filter now with ground line choke
- Advantest wins new customer with installation of V93000 semiconductor test system at Shanghai Haier IC in China
- Indium Corporation features NC-SMQ75 die-attach solder paste at Productronica China
- Advantest opens registration for VOICE 2015 developer conference May 12-14
- G.SKILL releases the fastest DDR4-3400MHz memory kit
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: Smartphone AP suppliers looking to offload inventory to tablet market
- Digitimes Research: Intel simplifies Atom product lines for mobile devices
- Digitimes Research: Qualcomm antitrust probe reshapes patent licensing in China
- Digitimes Research: Qualcomm Snapdragon 810 ships as scheduled for Xiaomi and LG product launches
- Digitimes Research: Nvidia steps up efforts for GPU licensing
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