- 23 Jun 2015:Any split of AMD would result in two smaller companies, heavily interdependent, taking on larger, entrenched, and determined competitors.
- Goldman analysts added that they expect DRAM prices to drop 30% over the next three quarters.
- 18 Jun 2015:Samsung Electronics has asked that a full bench of an appeals court should review a damages award in a long-standing patent infringement dispute with arch-rival Apple.
- The proximate source of a lot of this pressure is China, say SouthBay Economics' Andrew Zatlin. Semiconductors are suffering a fallout stemming from China's slowing economy just like other commodities have.
- Intel's CEO, Brian Krzanich, made his commitment to wearable technology very clear shortly after assuming his current role in 2013.
- 16 Jun 2015:Pricing of DRAM, based on his "checks" with entities in Taiwan, is weak in PC, servers, and in graphics applications, writes Moore.
- Chip makers are feeling pressures to find new sales, including by merging with rivals, amid declines in some businesses such as personal computers and rising expectations for margin growth.
- 15 Jun 2015:Demand for semiconductors continued to weaken in the second quarter with some PC assemblers in Asia suggesting a decline in purchases of some parts of as much as 15-20% from the second quarter of 2014, according to a report from Wall Street analysts at Deutsche Bank.
- 12 Jun 2015:Facebook showed the world its first commercial version of virtual reality on Thursday - and offered tantalizing hints of how it hopes to turn three-dimensional goggles into a new kind of computing and communications device.
- 11 Jun 2015:Meng has 30 years of telecommunications experience, eight of those with Qualcomm, which included serving as senior vice president and president of Qualcomm Greater China from 2008 to 2010.
- Integrated Silicon Solution (ISSI) has finalized a definitive agreement to be acquired by Cypress Semiconductor for US$20.25 per share in cash, according to the fabless memory supplier.
- 10 Jun 2015:In the data center, where Intel has handily trounced AMD in sales of server microprocessors, there is still a need for x86-compatible chips, of which AMD holds the only cards outside Intel. That could make AMD a target in the data center for Xilinx or for Chinese state-owned investment vehicles.
- Cypress Semiconductor's latest acquisition ambitions have been stopped due to anti-trust concerns.
- 8 Jun 2015:Applied Materials announced that its board of directors has elected Willem Roelandts as chairman effective immediately. Roelandts succeeds Michael Splinter, who has retired from the board.
- Synopsys has signed a definitive agreement to acquire Atrenta, a privately held provider of SoC realization solutions for the semiconductor and consumer electronics industries.
- 4 Jun 2015:Toshiba and Microsoft have announced that the two companies have signed a memorandum of understanding (MOU) to jointly develop solutions for the Internet of Things (IoT).
- 3 Jun 2015:According to industry sources, SK Hynix will start processing 20-nano wafers for mass production from next month, and start the full-fledged production of 20-nano class DRAM in July.
- 2 Jun 2015:MagnaChip Semiconductor now offers a new 0.18-micron Bipolar-CMOS-DMOS (BCD) 100V high voltage process. This new process features operability up to 100V for various applications that include DC-DC converters, Power-over-Ethernet, LED drivers, motor drivers, audio amps and PMICs.
- Rohm has moved to acquire a 200mm wafer fab from Renesas Electronics for JPY450 million (US$3.7 million).
- A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.
- But company officials and market experts say if the two raise their production capacity, the long-term supply growth will remain constrained due to technological complexity.
- Altera has been a key customer at TSMC for years, especially at the advanced tech node, accounting for around 3% of TSMC's revenue at 20/28 nodes.
- The Helio P10 is built using TSMC's 28nm HPC+ process.
- 28 May 2015:Daimler and Qualcomm announce strategic collaboration on connected car technologies (May 24) - Company releaseIn the first phase of the collaboration, the companies will focus on transforming future vehicles with mobile technologies that enhance in-car experiences and vehicle performance such as 3G/4G connectivity, wireless charging technology for in-vehicle use and implementation of the Qualcomm Halo Wireless Electric Vehicle Charging (WEVC) technology.
- Chip maker Avago Technologies is in advanced talks to buy rival Broadcom in a deal worth about US$35 billion, the latest in a wave of takeovers for the companies that supply parts to power smartphones, tablets and other gadgets.
- 27 May 2015:NVIDIA reiterates for the second time in three months that TSMC is their primary manufacturing partner as they head towards 16nm, and even 10nm production.
- China's Spreadtrum Communications will use Intel's 14nm FinFET process technology for both the low- and high-end mobile chips the company plans to launch in 2016, according to Spreadtrum chairman and CEO Leo Li.
- 26 May 2015:The next-generation iPhone will reportedly sport a camera with a 12-megapixel Sony sensor that makes use of the firm's RGBW technology to help with low-light photography.
- 25 May 2015:Globalfoundries offers new low-power 28nm solution for high-performance mobile and IoT applications (May 20) - Company releaseGlobalfoundries has announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.
- Samsung was shy on specs, but said the process node will be in full production by the end of 2016, about the same time as its rival TSMC.
- 21 May 2015:Huawei and Qualcomm jointly complete CAT11-based 3CC CA+256QAM test, reaching 600 Mbit/s rate - Company releaseHuawei and Qualcomm Technologies, a subsidiary of Qualcomm, have jointly announced the completion of tests using LTE CAT11 terminals.
- 20 May 2015:The US has charged six Chinese nationals over the alleged theft of technology used in mobile phones. The six, including three university professors, are accused of using the technology to benefit universities and companies controlled by Beijing.
- 19 May 2015:A new leaked roadmap slide purportedly showing Intel's plans through to the end of 2016 has been published by a Finnish computer technology website. If the slide is genuine we will likely see Intel release its first 10nm Cannonlake CPUs sometime around the second and third quarters of next year.
- As Apple basks in the unprecedented demand for its latest iPhones, suppliers from Tokyo to Taipei are sharing in the spoils.
- Xiaomi wants its own custom-designed processors to differentiate its products and control its destiny, an executive of Leadcore Technology told EE Times.
- 18 May 2015:Fujitsu and Intel have reached an agreement to combine Fujitsu Laboratories' distributed service platform technology with the Intel IoT Gateway to build out comprehensive IoT solutions.
- The recent earnings season turned out to be largely good news for the companies that make semiconductor manufacturing gear. But investors haven't quite come around yet.
- Silicon Storage Technology and Globalfoundries announce qualification of auto grade 55nm embedded flash memory technology (May 5) - Company releaseMicrochip Technology through its Silicon Storage Technology (SST) subsidiary and Globalfoundries have announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on Globalfoundries' 55nm Low Power Extended (LPx)/ RF enabled platform.
- 15 May 2015:With the adoption rate of the ARM mbed IoT Device Platform increasing rapidly, the company has announced a new assurance standard, the ARM mbed Enabled program.
- Imagination receives TSMC 2015 Graphics Partner of the Year Award
- Revolutionary dynamic AC test system for power transistors
- Merck shows strong commitment by accelerating its development in the semiconductor sector
- Advantest to exhibit and present papers on its newest IC test solutions at the International Test Conference, October 6-8 in Anaheim, Calif
- Fortrend Engineering (Hsin Chu) Corp. – A pioneer in semiconductor automatic system integration
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Rockchip statement on merger rumor
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Digitimes Research: Shrinking tablet market prompts China touch panel supply chain to look for growth elsewhere
- Digitimes Research: Tsinghua Unigroup acquisition of Micron faces difficulties, but is a must for China for further development
- Digitimes Research: Qualcomm to push inexpensive mobile device market with Microsoft and Allwinner solutions
- Digitimes Research: Touch IC developers turning to fingerprint sensors
- Digitimes Research: Intel 28nm SoFIA 4G AP delayed to early 2016; may face overlap issue with 14nm version
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