- 23 Jul 2013:Aptina has announced a new 13-megapixel sensor for smartphones, the AR1331CP.
- Avago Technologies has announced that its 28nm Serializer/Deserializer (SerDes) core has achieved 32Gbps performance while withstanding up to 40dB of channel loss.
- 22 Jul 2013:Wolfson Audio Hub adopted for Sharp's latest smartphone and tablet devices (July 11) - Company releaseWolfson's WM5102 HD audio hub has been adopted by Sharp for its new range of AQUOS smartphone and tablet devices.
- Nova Measuring Instruments, the Israeli maker of equipment for semiconductor manufacturing, rebounded in New York after the chief executive officer said he's confident its largest customer won't pare back orders.
- 16 Jul 2013:The only thing that counts against Globalfoundries is that, being a newcomer with a new US fab, it has yet to build up a long track record of consistent, successful execution. This is one reason Apple would not wish to have all its processor eggs in one foundry, as it does now with Samsung.
- 15 Jul 2013:Samsung Electronics will supply 14nm A9 chips that will be used for Apple's iPhone 7.
- There's now a rumor that the fruity iPhone maker will make its own chips, thus entering the fab industry thanks to a purchase of an unnamed chip fabricator. There's speculation that Taiwan-based chipmaker UMC was Apple's purchase of choice.
- If Apple owned capacity at a fab, it would give the company the kind of control over both design and chip manufacturing that Intel has.
- 12 Jul 2013:
- Applied Materials demonstrates momentum for profitable growth in mobile era (July 8) - Company releaseConsumer demand for sophisticated mobile devices creates profitable growth opportunities for Applied's semiconductor and display equipment businesses.
- 11 Jul 2013:Amazon, Sony and Nvidia are emerging as potential customers who will replace Apple as key buyers of Samsung Electronics' semiconductors, sources said Tuesday.
- ARM chipmakers TSMC and Globalfoundries plan to release ARM processor chips capable of running at 3GHz sometime in 2014.
- 10 Jul 2013:Xilinx has worked with TSMC to infuse high-end FPGA requirements into the TSMC 20SoC development process, just as it had done in the development of 28HPL.
- Samsung is putting down roots in Silicon Valley.
- 9 Jul 2013:The original goal was two fabs and after the latest chip initiative was formed two years ago, it managed to finally shortlist two consortia to set up chip fabrication units in the country.
- 3 Jul 2013:The two companies have reached an agreement to share patents for chipmaking technologies.
- 27 Jun 2013:With Toshiba's existing chip facilities now running at full capacity, the company may spend some of a 38% hike in its capex budget this year on extending a factory, the company's incoming president, Hisao Tanaka, said in a recent interview.
- 26 Jun 2013:
- 25 Jun 2013:Toshiba also may be among the initial customers since the three companies partner with SK Hynix on the development of resistive random access memory, or ReRam.
- Samsung reduces parts inventory for first time in its smartphone-making history (June 20) - ETNews.comThe July order for Galaxy S4 parts is for 6.5 million handsets, which is only about a half of the same order placed for May.
- Chipmaker Qualcomm is now Sharp's third-largest shareholder following the completion of a US$120 million investment in the ailing electronics firm.
- 21 Jun 2013:The cost of designing system-on-chip silicon at 28nm went up by 78% over the previous node, but the software cost was larger and more than doubled.
- 20 Jun 2013:Qualcomm has expanded its entry-level offerings with the addition of six new processors to its Snapdragon 200 class, featuring dual- and quad-core CPUs. The new Snapdragon 200 processors are manufactured on a 28nm process technology and feature key modem technologies that are important in China and emerging regions, including support for HSPA+ (up to 21Mbps) and TD-SCDMA.
- A lack of new licensing agreements triggered a 7% fall in adjusted pre-tax profits last financial year, and analysts have suggested that the company, whose designs are used to make graphics-processing chips used in mobile devices, could be volnerable to increased competition from US rivals Qualcomm and Nvidia.
- "Our checks indicated that Samsung planned to increase the 28nm node starts to a target level of 40,000-50,000 wpm in September, from 6,000 to 7,000 in May. But our recent checks are indicating that the semi material suppliers have been recently caught off guard with a sudden change of production plans at this site."
- 19 Jun 2013:Nvidia on Tuesday said it would begin licensing its GPU cores and "visual computing" patent portfolio to device manufacturers - a new business model for the company. The technology could appear in a full range of products from phones to supercomputers, with products likely emerging in 2015.
- Both Toshiba and Taiwan Semiconductor Manufacturing Company (TSMC) have developed mask read-only memories (MROMs) that can offer greater data density by storing multiple bits per cell.
- AMD plans to sample its first ARM-based processors for servers early next year, alongside paired CPUs and integrated graphics cores in an attempt to oust Intel's Xeon from its dominance in the server market.
- Globalfoundries and Fuzhou Rockchip Electronics announced that Rockchip's next-generation mobile processors are ramping to production on Globalfoundries' 28nm HKMG process technology.
- 18 Jun 2013:Toshiba has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablets, Ultrabooks and other applications.
- 14 Jun 2013:Infineon Technologies has settled its patent infringement claim against Atmel, and both Infineon and Atmel have agreed to seek dismissal of all pending patent infringement claims.
- 13 Jun 2013:SK Hynix has signed a five-year licensing deal worth US$240 million to settle an ongoing patent infringement lawsuit brought against it by intellectual property licensing firm Rambus.
- 6 Jun 2013:Japan's NHK network is scheduled to broadcast an animated documentary on TSMC at midnight Thursday, with TSMC's chairman and CEO, Morris Chang, depicted by the fictional character Shima Kosaku.
- Contract chipmaker Globalfoundries will spend US$4.5 billion to boost production capacity in 2013, anticipating a burst in orders for chips used in low-cost smartphones.
- 5 Jun 2013:
- 4 Jun 2013:Qualcomm works with Microsoft to offer Snapdragon 800 processors for Windows RT 8.1 (June 4) - Company releaseQualcomm has expanded its Qualcomm Snapdragon 800 processors portfolio to include support for Microsoft Windows RT 8.1.
- 3 Jun 2013:IC Insights has lowered its 2013 IC market growth forecast 1pp to 5%.
- Atmel moves its groundbreaking XSense touch sensor into mass production
- Indium features new, high-reliability solder alloy SACM at Productronica
- Orbotech Ultra Fusion 600 delivers advanced performance with high speed for IC substrates down to 5μm
- Orbotech presents advanced technologies for HDI and IC substrate production
- Indium soldering products meet new IPC J-STD004B
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
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