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News tagged fab
  • Last update: Friday 15 September 2017 [452 news items]

BOE kicks off product shipments on new 8.5G fab

Apr 9, 15:05

China-based panel maker BOE has officially kicked off shipments for new products from its newly established 8.5G fab in Chongqing, China to clients that include Konka, Wistron and...

UMC begins construction of 12-inch fab in Xiamen

Mar 30, 15:57

United Semiconductor (Xiamen) or United Semi, a subsidiary of United Microelectronics Corporation (UMC) in Xiamen, has begun construction of its new 12-inch fab, which is scheduled...

US fab tool book-to-bill ratio stays above parity, says SEMI

Mar 24, 21:02

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.02 in February 2015, staying above parity for the second consecutive month.

Fab equipment spending to rise in 2015, says SEMI

Mar 11, 20:51

Worldwide fab equipment spending, which increased almost 20% in 2014, will rise 15% in 2015, according to SEMI. Growth will slow to only 2-4% in 2016, however, said SEMI.

Micron to expand NAND flash fab in Singapore

Mar 10, 20:34

Micron Technology recently hosted a groundbreaking ceremony to begin the expansion of its NAND flash memory fabrication facility in Singapore, according to the US memory vendor.

US fab tool book-to-bill ratio rises

Feb 24, 10:53

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.03 in January 2015 from 0.99 in the prior month.

HKC to build 8.5G LCD panel fab in China

Jan 8, 14:51

China-based display products maker HKC has signed an agreement with the Chongqing government to invest CNY12 billion (US$1.92 billion) in a new 8.5G fab in the western Chinese city...

UMC allowed to invest in 12-inch foundry in China

Jan 6, 10:45

United Microelectronics' (UMC) application to invest in a 12-inch foundry in Xiamen, China has been approved by Taiwan's investment commission. UMC is allowed to invest a total of...

BOE to invest US$3.53 billion in new 6G fab

Dec 30, 14:30

China panel maker BOE has announced it will invest CNY22 billion (US$3.53 billion) to construct a new 6G fab that will focus on production of LTPS and AMOLED panels for use in high-end...

Globalfoundries reportedly to likely delay 14nm ramp-up

Dec 30, 14:17

Globalfoundries has stopped deliveries of tools for 14nm to its fab, which would delay the foundry's production ramp-up of the process by one to two quarters, according to an industry...

Korea and Taiwan companies control 56% of global 300mm fab capacity, says IC Insights

Dec 24, 10:48

South Korea- and Taiwan-based chip companies are well known for manufacturing prowess when it comes to efficiently fabricating huge amounts of IC wafers. Most of the IC industry's...

US fab tool book-to-bill ratio rises above parity, says SEMI

Dec 23, 15:14

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.02 in November 2014 from 0.93 in the prior month.

HLMC said to invest NT$100 billion to build new fab

Dec 22, 21:36

Shanghai Huali Microelectronics (HLMC) will invest around NT$100 billion (US$3.2 billion) to build a new 12-inch wafer fab in 2015, according to industry sources.

Demand for 8-inch fab equipment rises

Dec 19, 11:09

Demand for 8-inch fab tools, particularly used equipment, has risen significantly, as foundries are gearing up for their 8-inch fab expansion to grasp the rising IoT opportunity,...

SMIC Shenzhen 8-inch fab goes into operation

Dec 17, 20:43

Semiconductor Manufacturing International (SMIC) has begun operations at its Shenzhen 200mm (8-inch) wafer fab, according to the China-based IC foundry.

IC foundries gearing up for 8-inch fab expansions

Dec 17, 11:10

China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing...

US fab tool book-to-bill ratio stays below parity, says SEMI

Nov 21, 15:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 0.93 in October 2014, staying below parity for the second consecutive month.

VIS hiking production at 8-inch fab

Oct 20, 11:45

Wafer foundry service provider Vanguard International Semiconductor (VIS) has increased monthly output at its 8-inch Fab 3 to 26,000 wafers since September and will increase to 27,000-28,000...

UMC to build 12-inch fab in Xiamen, keep 28/14nm production in Taiwan

Oct 13, 13:56

Having reached an agreement to invest in a 12-inch fab in Xiamen, China recently, United Microelectronics Corporation (UMC) has insisted that it will keep its advanced manufacturing...

China promoting development of MEMS industry

Sep 16, 14:59

In view of strong demand for MEMS components from China-based smartphone vendors, the China government has been promoting the development of the local MEMS industry by teaming up...

EPA passes initial environmental impact assessment for TSMC planned 18-inch fab

Aug 28, 15:03

A special panel of the Environmental Protection Administration (EPA) has approved the environmental impact assessment for a piece of land designated for construction of an 18-inch...

Samsung to produce DRAM chips at Line-17 fab, causes concerns of oversupply

Aug 21, 13:37

The DRAM and NAND flash chip markets are on alert with spot DRAM prices making a downward correction that could upset contract quotes for September 2014. Prices of NAND flash remain...

SPIL to take over idle ProMOS 12-inch fab for NT$6.4 billion

Aug 19, 22:06

Siliconware Precision Industries (SPIL) has won the bid to take over the idle 12-inch fab of ProMOS Technologies for NT$6.4 billion (US$213.62 million). SPIL will use the fab to develop...

ProMOS idle 12-inch fab is up for grabs

Aug 11, 12:19

A number of semiconductor firms, including Taiwan Semiconductor Manufacturing Company (TSMC), Micron Technology, Globalfoundries and Toshiba, are likely to participate in an open...

Nanya Technology to ramp up 2014 capex

Jul 1, 21:55

Nanya Technology plans to ramp up its capex for 2014 to NT$6.69 billion (US$224 million) from NT$3.05 billion set previously, mainly to remove production bottlenecks at its 12-inch...

GlobalFoundries to upgrade Singapore fab from 8-inch to 12-inch, says senior VP

Jun 30, 22:07

GloablFoundries will upgrade its 8-inch fab in Singapore to a 12-inch fab mainly by having equipment moved from a 12-inch fab in Taiwan that it acquired from Taiwan-based DRAM maker...

Lite-On Semiconductor to expand capacity at 4-inch fab

May 12, 21:49

Taiwan-based discrete device and contact image sensor maker Lite-On Semiconductor will invest NT$800-900 million (US$26.5-29.8 million) to expand annual foundry capacity at its 4-inch...

VIS to increase capital, acquire 8-inch fab

Mar 17, 13:11

Vanguard International Semiconductor (VIS) plans to increase its capital by 22% to NT$1.26 billion (US$41.54 million) for capacity ramps, according to the wafer foundry house.

VIS reportedly to acquire an 8-inch fab from Nanya Technology

Mar 11, 21:53

Vanguard International Semiconductor (VIS) reportedly will acquire an 8-inch fab from Taiwan-based Sumpro Electronic, an affiliate of Nanya Technology. The deal is expected to be...

Fab equipment spending to rise 20-30% in 2014, says SEMI

Mar 6, 14:39

Semiconductor fab equipment spending is forecast to increase 20-30% in 2014, according to SEMI. The uptick to 30% depends on specific fab projects in the Europe/Mideast and Asia regions,...

Intel to cut a deal with Apple for Fab 42?

Feb 13, 14:27

With shipments of desktop and notebooks in the doldrums since 2010, Intel's PC processor business has been in decline. Meanwhile, AMD and others are taking aim at the Intel-dominated...

DRAM supplies to remain tight through 2014

Jan 15, 11:15

The supply of commodity DRAM for PCs is expected to remain tight through the entire year of 2014, despite reports indicating that SK Hynix has resumed wafer start production at its...

Though SK Hynix has gradually resumed production from its fire-hit fab, the facility is suffering p

TSMC to produce fingerprint sensors for next-generation iPhone at 12-inch fab

Jan 13, 21:31

Taiwan Semiconductor Manufacturing Company (TSMC) reportedly will begin producing fingerprint sensors for Apple's next-generation iPhone at its 12-inch fab using a 65nm process in...

ASE, Micron rumored to set up joint venture fab in China

Jan 7, 11:34

Rumors have circulated in the industry that IC packager Advanced Semiconductor Engineering (ASE) and memory chipmaker Micron Technology will set up a joint venture fab in Xi'an, China...

US fab tool book-to-bill rises above parity, says SEMI

Nov 21, 14:10

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.05 in October 2013 from 0.97 in the prior month.

452 items [6/13]
Realtime news
  • Taiwan foreign direct investment totals US$4.9 billion in January-August

    Bits + chips | 14min ago

  • Taiwan August export order value increases

    Bits + chips | 23min ago

  • Taiwan market: Optoma launches LED projector

    Displays | 34min ago

  • Innolux to expand 6G fab capacity

    Before Going to Press | 3min ago

  • Japan, Korea, Taiwan among top-5 Google Play markets

    Before Going to Press | 4min ago

  • DRAM bit growth to reach 19.6% in 2018, says DRAMeXchange

    Before Going to Press | 8min ago

  • Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET

    Before Going to Press | 20min ago

  • HTC in trading halt pending release of material information

    Before Going to Press | 28min ago

  • TSMC to hold over 70% of PWM IC orders from Qualcomm

    Before Going to Press | 29min ago

  • Taiwan August export order value increases

    Before Going to Press | 35min ago

  • Taiwan foreign direct investment totals US$4.9 billion in January-August

    Before Going to Press | 39min ago

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  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

UMC
Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
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    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

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  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.