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News tagged fab
  • Last update: Friday 8 December 2017 [493 news items]

Hefei Chang Xin keeps low profile but DRAM ambition remains unchanged

May 24, 16:11

Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...

Globalfoundries and Chengdu partner to expand FD-SOI ecosystem in China

May 23, 22:37

Globalfoundries and the Chengdu municipality have announced an investment to spur innovation in China's semiconductor industry. The partners plan to build a FD-SOI ecosystem including...

Win Semi expands GaAs wafer manufacturing capacity by more than 20%

May 17, 21:38

Win Semiconductors, the world’s largest pure-play compound semiconductor foundry, has completed phase 2 expansion at its newest wafer fab, Fab C. This operation is now fitted...

VIS seeking 8-inch fab equipment from memory chipmakers

May 9, 20:43

Specialty IC foundry Vanguard International Semiconductor (VIS) is looking to expand its 8-inch fabs, and has approached several memory makers to buy their second-hand equipment,...

Winbond planning new 12-inch fab

May 2, 14:16

Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.

UMC to roll out 22nm process as early as 2018

Apr 28, 11:46

Foundry chipmaker UMC has disclosed plans to roll out 22nm process technology as early as 2018. UMC has started IP development for its 22nm process, and expects to introduce the node...

UMC planning 22nm process technology

UMC expects flat performance in 2Q17

Apr 27, 11:08

United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...

Ardentec breaks ground for new plant in Nanjing

Apr 25, 15:05

Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...

Silicon wafer suppliers seeking long-term contracts

Apr 25, 11:18

Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.

Several China 12-inch fabs put construction on hold

Apr 21, 11:42

Several 12-inch fab projects implemented by China-based emerging chipmakers have been put on hold raising speculation about the country's overambitious plans to revamp the local chipmaking...

Powerchip chairman expects long-term DRAM shortage

Apr 20, 22:20

The supply of DRAM memory is likely to stay tight for a substantial period of time, according to Frank Huang, chairman for Taiwan-based pure-play foundry Powerchip Technology.

ASML secures pull-in of EUV equipment orders

Apr 20, 13:52

ASML has landed a pull-in of EUV lithography equipment orders with its backlog reaching 21 units, according to the company.

PTI to enjoy robust demand for NAND flash

Apr 20, 10:25

Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.

UMC Xiamen fab obtains orders from MediaTek, Spreadtrum

Apr 17, 11:40

United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China has obtained 40nm chip orders from MediaTek and Spreadtrum Communications, according to industry...

China fab toolmakers targeting advanced-node production

Apr 12, 11:32

Naura Technology (formerly Beijing Sevenstar Electronics) has started shipping ion etch equipment for the manufacture of 14nm chips to chipmakers, while Advanced Micro-Fabrication...

Powerchip JV fab in China ready for trial production in June

Apr 7, 10:57

Powerchip Technology's joint venture fab in Hefei, China will be ready for trial production in June 2017, according to Frank Huang, CEO for the Taiwan-based pure-play foundry.

TSMC Nanjing fab gearing up for opening

Apr 6, 11:14

Taiwan Semiconductor Manufacturing Company (TSMC) will soon strike deals with a number of equipment, materials and components companies that will support production at its new 12-inch...

VIS mulling fab tools purchases

Stockwatch - Mar 31, 09:58

Vanguard International Semiconductor (VIS) is considering acquiring production equipment from its fellow foundry companies, according to the Taiwan-based 8-inch IC foundry.

New Wafer Works China plant to come online in 2018, says report

Newswatch - Mar 29, 22:53

Taiwan-based silicon wafer supplier Wafer Works is expected to start operating its new plant in Zhengzhou, China which will be dedicated to producing 8-inch wafers in the first quarter...

TSMC to start installing equipment at Nanjing fab in 2H17

Mar 24, 10:31

Equipment move-in will take place at Taiwan Semiconductor Manufacturing Company's (TSMC) Nanjing plant in the second half of 2017, according to Roger Luo, president for TSMC Nanjing...

tsmc

UMC Xiamen fab gearing up for 28nm chip production

Stockwatch - Mar 22, 11:13

United Microelectronics' 12-inch foundry subsidiary in Xiamen, China will be ready for 28nm chip production in the second quarter of 2017 vying for orders from China's local handset...

Gudeng seeing robust 12-inch fab equipment orders from China

Mar 20, 21:44

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...

HLMC 12-inch fab running at full capacity, says company VP

Mar 15, 15:41

China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...

HLMC VP Jack Shu

Yangtze River Storage 3D NAND flash development on track

Mar 15, 09:54

Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab...

YMTC CEO

China 12-inch fab capacity set to boom

Mar 14, 12:20

With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.

Samsung Xian fab output value exceeds SMIC in 2016

Mar 9, 10:30

Samsung Electronics' NAND flash fab in Xian, China generated CNY23.75 billion (US$3.44 billion) in output value in 2016 outpacing the total output value generated by SMIC's fabs estimated...

Record spending for fab equipment expected in 2017 and 2018, says SEMI

Mar 8, 16:06

Fab equipment spending is expected to reach an industry all-time record, more than US$46 billion in 2017, according to SEMI. The record is expected to be broken again in 2018, nearing...

Winbond mulls opening 12-inch wafer fab in Singapore, says report

Feb 24, 13:51

Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering...

Taiwan maintains largest share of global IC wafer fab capacity, says IC Insights

Feb 24, 11:07

Taiwan led all regions/countries in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacity leader, according...

Robust fingerprint sensor demand continues to fill 8-inch fab capacity in 2017

Feb 14, 10:54

IC foundries will continue to see a pull-in of orders for fingerprint-recognition sensor chips to fill their 8-inch fab capacity in 2017, according to industry sources. Meanwhile,...

Globalfoundries Chengdu fab to start production in 4Q18

Feb 13, 21:21

Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...

Toshiba starts construction of new fab and memory R&D center

Feb 9, 14:56

Toshiba has started construction of a new semiconductor fabrication facility and a memory R&D center at its Yokkaichi operations in Mie (Japan), the company's main memory production...

US fab tool book-to-bill ratio rises to 7-month high

Jan 25, 14:34

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.06 in December 2016, the highest in seven months, compared with 0.96 in the prior month and 1.00...

Fab investment surging in China, says SEMI

Jan 13, 14:55

From 2004 through 2014, over US$70 billion was spent on semiconductor equipment and materials in China, according to SEMI. Over this period, assembly and packaging infrastructure...

TSMC could build plant in the US, says Chang

Jan 13, 10:40

Taiwan Semiconductor Manufacturing Company (TSMC) chairman Morris Chang has said the company has not ruled out building a wafer fab in the US in response to Donald Trump's plans to...

Morris Chang on the sidelines of the quarterly investors meeting
493 items [4/15]
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  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

UMC
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