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News tagged fab
  • Last update: Monday 28 March 2016 [324 news items]

Globalfoundries, TI in bid to purchase Powerchip 12-inch fab equipment

Jan 28, 22:59

Globalfoundries and Texas Instruments (TI) have both provided offers to acquire part of the equipment installed at Powerchp Technology's P3 12-inch plant, bringing uncertainty to...

North America fab tool book-to-bill continues growth, says SEMI

Jan 28, 14:07

North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.92 in December 2012, up for the third consecutive month, according to SEMI.

Nanya says 12-inch fab capacity for fabless customers sufficient

Jan 22, 15:01

Nanya Technology is confident that it will have enough capacity for its IC design customers, according to company president Charles Kau.

ESMT to acquire part of Powerchip foundry fab

Stockwatch - Jan 21, 22:31

Elite Semiconductor Memory Technology (ESMT), a Taiwan-based provider of niche-market memory chips, has announced plans to buy part of the facilities at one of Powerchip Technology's...

Powerchip likely to keep P3 fab

Jan 18, 10:28

High-level executives at Powerchip Technology and several Taiwan-based niche-market memory suppliers together visited Taiwan's Industrial Development Bureau (IDB) under the Ministry...

Fab spending to fall another 9.7% in 2013, Gartner says

Dec 20, 11:02

Worldwide wafer fab equipment spending is forecast to total US$27 billion in 2013, a 9.7% decline from 2012, according to Gartner. In 2012, spending is on pace to reach US$29.9 billion,...

ProMOS fails again to sell 12-inch fab

Dec 12, 22:09

ProMOS Technologies failed, for the second time, on December 12 to sell its 12-inch fab located in Taichung, central Taiwan, through an open bid despite offerings from Vanguard International...

Opening bids for ProMOS 12-inch fab delayed

Newswatch - Nov 29, 15:18

ProMOS Technologies was originally scheduled to determine a buyer for its 12-inch fab located in Taichung, central Taiwan, in an open bid held today (November 29). However, as bidders...

VIS likely to win bid to take up ProMOS 12-inch fab

Nov 28, 22:04

ProMOS Technologies will hold an open bid to liquidate its 12-inch fab at the Central Taiwan Science Park (CTSP) on November 29. Some industry watchers believe that Vanguard International...

Powerchip may sell 12-inch fab equipment and land separately

Nov 28, 21:31

Powerchip Technology may tear down its P3 12-inch fab and sell the production equipment and land separately if it cannot liquidate the plant in one lot. Potential buyers including...

VIS in bid to acquire ProMOS 12-inch fab

Nov 26, 10:39

Faced with increased competition from Powerchip Technology in the LCD driver IC foundry sector, Vanguard International Semiconductor (VIS) is actively pursuing a bid to acquire ProMOS...

TSMC starts phase 6 construction of Fab 14

Nov 26, 10:31

Taiwan Semiconductor Manufacturing Company (TSMC) on November 23 held a groundbreaking ceremony for the sixth-phase construction of its Fab 14, a 12-inch wafer plant located in the...

Green buildings: Q&A with Arthur Chuang, director of TSMC's New Fab Planning and Engineering Division

Nov 22, 12:06

Taiwan Semiconductor Manufacturing Company (TSMC) has received Leadership in Energy and Environmental Design (LEED) certifications for its green buidlings. Digitimes recently sat...

Arthur Chuang, director of TSMC's New Fab and Engineering Division

ProMOS to sell fab by year-end, become fabless

Nov 6, 11:11

ProMOS Technologies has announced plans to sell its 12-inch wafer plant and related facilities through open bidding by the end of 2012, in a move to become a fabless memory-IC comp...

ProMOS to become fabless

Samsung reportedly delays new logic fab construction

Nov 5, 21:53

Samsung Electronics is likely to put off the construction of a new logic fabrication facility dubbed Line-17, due to the possibility of losing a portion of orders for Apple's next-generation...

Wafer fab equipment spending to decline 13.3% in 2012, says Gartner

Oct 2, 15:56

Global wafer fab equipment spending is on pace to total US$31.4 billion in 2012, a decline of 13.3% from 2011 spending of US$36.2 billion, according to Gartner. The research firm...

Front-end fab equipment spending to grow 17% in 2013, says SEMI

Sep 6, 11:38

Total fab spending for equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size could increase 16.7% in 2013 to reach a new record high of US$42.7...

Elpida cutting DRAM production

Jul 31, 01:40

Elpida Memory has moved to scale down production at its DRAM fab in Hiroshima, Japan, as well as production at its Taiwan-based subsidiary Rexchip Electronics, according to industry...

Globalfoundries to expand Fab 8

Jul 25, 16:02

Globalfoundries has announced it is moving forward with the final construction for the extension of Module 1 at its Fab 8 campus in New York. The project will add 90,000 square feet...

Globalfoundries to fab 28nm chips for Qualcomm, says paper

Newswatch - Jul 13, 11:05

Qualcomm has contracted Globalfoundries' Dresden fab to manufacture 28nm chips, the Chinese-language Commercial Times cited unnamed equipment makers as saying in a recent...

TSMC has no plans to purchase Renesas 12-inch fab, says chairman

Jul 5, 01:45

Taiwan Semiconductor Manufacturing Company (TSMC) has no plans to take up Renesas Electronics' 12-inch fab in Tsuruoka, Yamagata prefecture, but will continue to maintain a close...

Maxim to expand and upgrade US wafer fabs

Jun 29, 13:51

Maxim Integrated Products, which specializes in the manufacture of analog and mixed-signal semiconductors, has announced a US$200 million multi-year investment to upgrade its US wafer...

Worldwide wafer fab equipment spending to decline 8.9% in 2012, Gartner says

Jun 25, 16:07

Worldwide wafer fab equipment spending is on pace to total US$33 billion in 2012, a decline of 8.9% from 2011 spending of US$36.2 billion, according to Gartner. The market will return...

North America fab tool book-to-bill continues slide, says SEMI

Jun 22, 14:29

The book-to-bill ratio for North America-made semiconductor equipment slipped for the second consecutive month but remained above one, according to SEMI.

Fab tool supplier Gudeng posts 20% sales growth in May

Jun 11, 15:18

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, saw its May revenues increase about 20% sequentially...

Samsung to build new 12-inch fab for logic ICs

Jun 8, 14:42

Samsung Electronics has unveiled plans to build a new fabrication line in Hwaseong, South Korea, to meet the growing demand for logic products.

Fab equipment spending to rise in 2012 and hit record in 2013, says SEMI

Jun 7, 11:26

Semiconductor fab equipment spending will enjoy positive growth in 2012, and climb further to hit an all-time high in 2013, according to SEMI.

UMC holds groundbreaking ceremony for new facilities at 12-inch fab

May 24, 16:26

United Microelectronics (UMC) on May 24 held a groundbreaking ceremony for the fifth and sixth phase (P5 and P6) construction of its 12-inch plant located in southern Taiwan. Equipment...

North America fab tool book-to-bill slips in April 2012, says SEMI

May 23, 14:56

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.

UMC to break ground for new factories at Fab 12A

May 15, 12:09

United Microelectronics (UMC) will soon break ground for the fifth and sixth phase construction of its 12-inch fab located at the Southern Taiwan Science Park (STSP), according to...

Commentary: AUO halting new fab plans puts government policy in dilemma

Apr 19, 01:00

Taiwan's National Science Council (NSC), which has overseen the establishment of major science industry parks in Taiwan over the past years, has been pushed into a political storm...

TSMC in race to buy ProMOS fab

Apr 16, 10:28

Taiwan Semiconductor Manufacturing Company (TSMC) has entered the race to buy the 12-inch wafer fab of ProMOS Technologies, which is seeking new funds and investors to restructure...

UMC to break ground for new factory buildings at 12-inch fab in May

Apr 10, 01:30

United Microelectronics (UMC) is scheduled to hold a groundbreaking ceremony for new factory buildings (Phase 5 and 6) at its 12-inch Fab 12A located at the Southern Taiwan Science...

UMC is set to break ground for new facilities at its 12-inch fab in southern Taiwan

TSMC begins further expansion of Fab 14

Apr 9, 12:03

TSMC on April 9 held a groundbreaking ceremony at the South Taiwan Science Park in Tainan for Phase 5 of its Fab 14 Gigafab. Following TSMC's Fab 12 Phase 6 in Hsinchu, this facility...

TSMC to fab Dialog chips used in Apple devices, says report

Newswatch - Mar 30, 11:56

Taiwan Semiconductor Manufacturing Company (TSMC), which reportedly has cut into the supply chain for the existing iPhones and iPads through providing foundry services for Broadcom,...

324 items [4/10]
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  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

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Innodisk Corporation
Wireless broadband developments in Southeast Asia markets

3-May-2016 markets closed

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Analysis of China revised domestic semiconductor industry goals
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    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.