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News tagged fab
  • Last update: Friday 20 October 2017 [472 news items]

Gudeng seeing robust 12-inch fab equipment orders from China

Mar 20, 21:44

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...

HLMC 12-inch fab running at full capacity, says company VP

Mar 15, 15:41

China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...

HLMC VP Jack Shu

Yangtze River Storage 3D NAND flash development on track

Mar 15, 09:54

Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab...

YMTC CEO

China 12-inch fab capacity set to boom

Mar 14, 12:20

With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.

Samsung Xian fab output value exceeds SMIC in 2016

Mar 9, 10:30

Samsung Electronics' NAND flash fab in Xian, China generated CNY23.75 billion (US$3.44 billion) in output value in 2016 outpacing the total output value generated by SMIC's fabs estimated...

Record spending for fab equipment expected in 2017 and 2018, says SEMI

Mar 8, 16:06

Fab equipment spending is expected to reach an industry all-time record, more than US$46 billion in 2017, according to SEMI. The record is expected to be broken again in 2018, nearing...

Winbond mulls opening 12-inch wafer fab in Singapore, says report

Feb 24, 13:51

Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering...

Taiwan maintains largest share of global IC wafer fab capacity, says IC Insights

Feb 24, 11:07

Taiwan led all regions/countries in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacity leader, according...

Robust fingerprint sensor demand continues to fill 8-inch fab capacity in 2017

Feb 14, 10:54

IC foundries will continue to see a pull-in of orders for fingerprint-recognition sensor chips to fill their 8-inch fab capacity in 2017, according to industry sources. Meanwhile,...

Globalfoundries Chengdu fab to start production in 4Q18

Feb 13, 21:21

Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...

Toshiba starts construction of new fab and memory R&D center

Feb 9, 14:56

Toshiba has started construction of a new semiconductor fabrication facility and a memory R&D center at its Yokkaichi operations in Mie (Japan), the company's main memory production...

US fab tool book-to-bill ratio rises to 7-month high

Jan 25, 14:34

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.06 in December 2016, the highest in seven months, compared with 0.96 in the prior month and 1.00...

Fab investment surging in China, says SEMI

Jan 13, 14:55

From 2004 through 2014, over US$70 billion was spent on semiconductor equipment and materials in China, according to SEMI. Over this period, assembly and packaging infrastructure...

TSMC could build plant in the US, says Chang

Jan 13, 10:40

Taiwan Semiconductor Manufacturing Company (TSMC) chairman Morris Chang has said the company has not ruled out building a wafer fab in the US in response to Donald Trump's plans to...

Morris Chang on the sidelines of the quarterly investors meeting

Fab toolmaker Gudeng posts record 2016 revenues

Jan 10, 15:20

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products and wafer handling equipment, saw its 2016...

SK Hynix to build new NAND flash fab

Dec 23, 11:41

SK Hynix has announced it will construct a new fab in Cheongju, South Korea to meet increasing NAND flash demand.

Wafer Works to set up 8-inch fab in China

Dec 21, 11:09

The Shanghai subsidiary of silicon wafer supplier Wafer Works plans to expand its capital by CNY700 million (US$102 million) by selling new shares to a Henan-based industrial development...

Nova Technology 2017 revenues likely to rise 20% or more

Dec 20, 11:18

Taiwan-based Nova Technology, which supplies fab tool services for wafer fabs and LCD plants, is expected to enjoy 20% or more revenue growth on year in 2017 with higher profits,...

PTI to enjoy particularly strong 1Q17

Dec 14, 21:42

Packaging and testing company Powertech Technology (PTI) is expected to enjoy a particularly strong first quarter of 2017 thanks to robust demand for DRAM and NAND flash chips, and...

SMIC opens JV fab for analog and specialty IC manufacturing

Nov 25, 10:10

Semiconductor Manufacturing International (SMIC) has announced the official inauguration of Ningbo Semiconductor International (NSI), established by China IC Capital - a wholly-owned...

Spreadtrum places 40nm chip orders with UMC Xiamen fab

Nov 23, 15:50

Spreadtrum Communications has placed 40nm chip orders with United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China, according to industry sources.

US fab tool book-to-bill ratio slips below parity

Nov 23, 15:19

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.91 in October 2016 after having stayed above parity for 10 straight months.

UMC unveils 12-inch fab in China

Nov 17, 10:08

United Microelectronics (UMC) on November 16 held an opening ceremony for a 12-inch wafer fab in Xiamen, China, according to the Taiwan-based pure-play foundry.

HLMC to break ground for new 12-inch fab in early December

Nov 11, 11:22

Shanghai Huali Microelectronics (HLMC) is scheduled to hold a groundbreaking ceremony in early December for its second 12-inch fab in Shanghai, according to the China-based pure-play...

Toshiba to build new fab for 3D flash memory

Nov 9, 13:42

Toshiba has announced the outline schedule for the construction of a state-of-the-art fabrication facility at Yokkaichi Operations in Mie, Japan, for expanded production of BiCS FLASH,...

Globalfoundries China fab put on hold

Oct 21, 10:19

The government of Chongqing has put on hold a deal with Globalfoundries for a joint venture 12-inch fab, according to industry sources.

China to produce 3D NAND chips as early as end-2017

Oct 18, 11:19

Yangtze River Storage Technology (YRST) will start operating China's first 12-inch fab for the manufacture of NAND flash and DRAM memory at the end of 2016, and is expected to produce...

SMIC breaks ground for new 12-inch fab in Shanghai

Oct 14, 10:57

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) on October 13 held a groundbreaking ceremony for a new 12-inch wafer fab in Shanghai.

Installed 200mm fab capacity rising, says SEMI

Oct 13, 13:42

Installed 200mm fab capacity has increased since 2009. By 2020, capacity is expected to reach 5.5 million wafers per month (wpm), although this is still less than the 2007 peak, according...

China HLMC to build new 12-inch fab

Sep 26, 15:38

Shanghai Huali Microelectronics (HLMC) is expected to announce by the end of 2016 the construction of its second 12-inch plant, which will directly enter 28nm production, according...

China SITRI 8-inch fab ready for MEMS manufacturing

Sep 21, 15:06

The government-sponsored Shanghai Industrial Technology Research Institute (SITRI) has its 8-inch wafer fab targeted specifically at the manufacture of MEMS parts with volume production...

Fab equipment spending trending upwards in 2016 and 2017, says SEMI

Sep 7, 13:44

SEMI has published an August update of its world fab forecast report, which shows increased equipment spending, reaching 4.1% on-year in 2016 and 10.6% in 2017.

Fingerprint sensor orders filling 8-inch fab capacity

Aug 10, 11:13

Foundries have seen a ramp-up of orders for fingerprint-recognition sensor chips which are filling their 8-inch fab capacity, according to industry sources.

Intel Dalian fab put into operation, says report

Jul 26, 14:34

Intel's 12-inch fab in Dalian has been put into operaton for the manufacture of non-volatile random-access memory (NVRAM) chips, according to a ChinaNews website report.

Fab tool book-to-bill slips

Jul 22, 14:41

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.

472 items [4/14]
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

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