Taipei, Sunday, April 19, 2015 08:52 (GMT+8)
mostly cloudy
Taipei
27°C
News tagged fab
  • Last update: Thursday 16 April 2015 [281 news items]

Samsung Austin Semiconductor ramps new 12-inch fab

Dec 6, 12:05

Samsung Austin Semiconductor, Samsung Electronics' only wafer fabrication plant located outside Korea, has announced the completion of its 300mm automated fab, S2.

Toshiba to shut three fabs, cutting chip production

Dec 1, 01:05

Toshiba on November 30 announced a reorganization of its semiconductor production facilities in Japan, aimed at reinforcing the operating structure and profitability of its discrete,...

TSMC seeing tight capacity for 28nm processes

Nov 25, 01:00

Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, despite a general slowdown in the semiconductor industry, according...

TSMC Fab 15 at CTSP

ON Semiconductor to shut Japan fab

Oct 18, 16:53

ON Semiconductor has announced plans to close its wafer manufacturing facility located in Aizu, Japan, by the end of June 2012.

TSMC Solar readies new CIGS fab

Oct 17, 10:59

TSMC Solar, a wholly-owned subsidiary of Taiwan Semiconductor Manufacturing Company, has announced that it recently completed equipment move-in in preparation for commercial production...

ProMOS completes sale of 8-inch fab in China

Oct 3, 13:48

ProMOS Technologies has announced that the company completed its sale of an 8-inch wafer fab in Chongqing, China for CNY100 million (US$15.7 million).

ProMOS HQ

Samsung new memory fab goes on line

Sep 23, 01:30

Samsung Electronics has announced that its new memory semiconductor fabrication facility, Line-16, at its Nano City Complex in Hwaseong, Gyeonggi Province, has commenced operations...

Rexchip might ramp R2 for Elpida

Sep 16, 01:20

Elpida Memory is likely to remove some of its production lines from Japan to Rexchip Electronics's second 12-inch fab, R2, which has been left idle since the shell construction was...

SEMI downgrades forecast for 2011 fab-tool spending, but still sees record year

Sep 7, 10:47

SEMI's latest statistics suggests that capital expenditure will increase to US$41.1 billion in 2011, the highest on record, according to the industry association. The prediction is...

Globalfoundries, Samsung extend fab sync

Sep 2, 01:00

Globalfoundries and Samsung Electronics have jointed announced they expect to broaden collaboration, and synchronize global semiconductor fabrication facilities to produce chips based...

Intel investment reduction plans may affect PC and semiconductor players

Sep 1, 01:15

Intel, facing weak PC performance, reportedly is considering to temporarily halt its plans to upgrade to a 22nm process at Fab 24, and has decided to delay the launch of its next-generation...

IDT to sell Oregon fab for US$26 million

Aug 30, 13:56

Integrated Device Technology (IDT) has announced that it intends to sell its Hillsboro, Oregon wafer fabrication facility and related assets to Alpha and Omega Semiconductor (AOS),...

Macronix allocates more capacity to flash production

Jul 28, 17:00

Macronix International has said that capacity at its newly-opened 12-inch fab has almost all shifted to NOR flash production to meet demand for new orders. The capacity was originally...

Samsung said to ramp new fab in September

Jul 14, 01:00

Samsung Electronics is expected to open a new memory semiconductor fabrication plant in September, according to industry sources. Dubbed Line-16, the facility will be focused on the...

VIS reportedly offers to buy ProMOS 12-inch fab

Jul 4, 11:46

Vanguard International Semiconductor (VIS), a Taiwan Semiconductor Manufacturing Company (TSMC) affiliate specializing in analog/mixed-signal and logic ICs, has offered to acquire...

ProMOS 12-inch fab at CTSP, central Taiwan

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

Rexchip revises 2011 capex

May 27, 01:15

Rexchip Electronics has budgeted NT$9 billion (US$311 million) in capex for 2011 to ramp a new 12-inch DRAM fab and upgrade to 30nm-class process technology, according to company...

Rexchip president Stephen Chen

ProMOS sells China subsidiary with 8-inch fab

May 24, 01:10

Taiwan-based DRAM maker ProMOS Technologies on May 23 announced the sale of ProMOS (Chongqing) Technologies, its wholly owned subsidiary semiconductor maker located in Xiyoung Micro-electronics...

ProMOS to liquidate China fab

May 18, 13:31

Taiwan's ProMOS Technologies has decided to sell off a 100%-owned subsidiary in Chongqing, western China, which has an 8-inch fab, in order to raise funds to finance its existing...

ProMOS

SMIC wraps up deal to share ownership of Wuhan fab

May 13, 01:35

Semiconductor Manufacturing International Corporation (SMIC) and Hubei Science & Technology Investment Group announced on May 12 the formal signing of a joint venture agreement...

TSMC to ramp new 12-inch fab ahead of schedule

May 6, 01:35

Taiwan Semiconductor Manufacturing Company (TSMC) has begun equipment move-in for the phase 1 facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products...

Big to grow bigger in fab tool market, says The Information Network

May 5, 13:42

Applied Materials' planned acquisition of Varian Semiconductor will strengthen its dominance of the global semiconductor equipment market, according to The Information Network.

UMC says Japan fab unaffected by aftershocks

Apr 13, 14:10

United Microelectronics Corporation's (UMC) 8-inch wafer plant in Chiba Prefecture has not been affected by the latest aftershocks that struck Japan, continuing to run at normal capacity,...

Aggressive LED fab investment drives 40% growth in equipment spending in 2011, says SEMI

Apr 6, 10:18

With the widespread adoption of LED technology in LCD backlight applications and growing interest in LEDs for general lighting purposes, LED manufacturers are poised to meet the soaring...

TSMC to start second phase of China fab construction, says paper

Newswatch - Mar 29, 13:51

Taiwan Semiconductor Manufacturing Company (TSMC) will soon break ground for the second phase construction of its 8-inch wafer plant in Songjiang, Shanghai (China), according to a...

Record capex leads to 28% fab equipment growth in 2011, says SEMI

Mar 3, 14:45

SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...

Taiwan analog IC prices affected by TI 12-inch fab going on-line

Mar 2, 01:00

With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected...

Japan fab tool book-to-bill slips below parity in January 2011

Feb 18, 15:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...

TSMC to ramp capacity at Fab 14, hire new staff

Feb 18, 11:24

Taiwan Semiconductor Manufacturing Company (TSMC) is currently equipping 12-inch tools at its Fab 14, Phase 4 facility located at the Southern Taiwan Science Park (STSP). Designed...

AUO Crystal sets up solar wafer fab in central Taiwan

Feb 11, 16:18

AU Optronics (AUO) subsidiary AUO Crystal Corp (ACC) will establish a solar wafer plant in Taiwan's Chungkang Export Processing Zone, under the Ministry of Economic Affairs (MOEA).

Powerchip sends 40nm process NAND flash samples to clients

Jan 12, 15:00

Powerchip Technology has already delivered samples of NAND flash chips built using a 40nm process to clients, according to the company, adding that its flash business will target...

TSMC spends more than NT$30 billion on fab gear in December

Stockwatch - Dec 31, 14:08

Taiwan Semiconductor Manufacturing Company (TSMC) has spent more than NT$30 billion (US$1.03 billion) on equipment procurement, cleanroom facilities and factory building construction...

Intel personnel change sparks speculation about future of Micron

Dec 30, 14:22

Michael Chen, director of Intel's Asia-Pacific embedded sales and ultra-mobility group, has reportedly resigned from the company. The news comes after comments were made by the CEO...

Gintech reportedly mulls joint venture fab for solar wafer production

Dec 23, 12:24

Solar cell maker Gintech Energy reportedly plans to team up with Taiwan Fertilizer, CTCI and a major Japanese solar company to set up a solar wafer manufacturing company capable of...

SAS semiconductor wafer subsidiary opens new wafer fab in US

Dec 22, 01:05

Globitech, a US-based subsidiary of Sino-American Silicon Production (SAS), has announced the inauguration of its second wafer fab on December 21. SAS chairman MK Lu indicated that...

281 items [4/9]
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

How China is shaping the LTE/TD-LTE market in 2015
Trends and forecasts for the China FPD industry, 2014-2017

17-Apr-2015 markets closed

 LastChange

TAIEX (TSE)9570.93-85.94-0.89% 

TSE electronic375.03-5.22-1.37% 

GTSM (OTC)144.63-1.25-0.86% 

OTC electronic188.79-2.03-1.06% 

Demand and supply trends in the global sapphire industry, 2014-2015
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.