500 news items tagged fab
PTI to enjoy particularly strong 1Q17Wednesday 14 December 2016
Packaging and testing company Powertech Technology (PTI) is expected to enjoy a particularly strong first quarter of 2017 thanks to robust demand for DRAM and NAND flash chips, and...
SMIC opens JV fab for analog and specialty IC manufacturingFriday 25 November 2016
Semiconductor Manufacturing International (SMIC) has announced the official inauguration of Ningbo Semiconductor International (NSI), established by China IC Capital - a wholly-owned...
Spreadtrum places 40nm chip orders with UMC Xiamen fabWednesday 23 November 2016
Spreadtrum Communications has placed 40nm chip orders with United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China, according to industry sources.
US fab tool book-to-bill ratio slips below parityWednesday 23 November 2016
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.91 in October 2016 after having stayed above parity for 10 straight months.
UMC unveils 12-inch fab in ChinaThursday 17 November 2016
United Microelectronics (UMC) on November 16 held an opening ceremony for a 12-inch wafer fab in Xiamen, China, according to the Taiwan-based pure-play foundry.
HLMC to break ground for new 12-inch fab in early DecemberFriday 11 November 2016
Shanghai Huali Microelectronics (HLMC) is scheduled to hold a groundbreaking ceremony in early December for its second 12-inch fab in Shanghai, according to the China-based pure-play...
Toshiba to build new fab for 3D flash memoryWednesday 9 November 2016
Toshiba has announced the outline schedule for the construction of a state-of-the-art fabrication facility at Yokkaichi Operations in Mie, Japan, for expanded production of BiCS FLASH,...
Globalfoundries China fab put on holdFriday 21 October 2016
The government of Chongqing has put on hold a deal with Globalfoundries for a joint venture 12-inch fab, according to industry sources.
China to produce 3D NAND chips as early as end-2017Tuesday 18 October 2016
Yangtze River Storage Technology (YRST) will start operating China's first 12-inch fab for the manufacture of NAND flash and DRAM memory at the end of 2016, and is expected to produce...
SMIC breaks ground for new 12-inch fab in ShanghaiFriday 14 October 2016
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) on October 13 held a groundbreaking ceremony for a new 12-inch wafer fab in Shanghai.
Installed 200mm fab capacity rising, says SEMIThursday 13 October 2016
Installed 200mm fab capacity has increased since 2009. By 2020, capacity is expected to reach 5.5 million wafers per month (wpm), although this is still less than the 2007 peak, according...
China HLMC to build new 12-inch fabMonday 26 September 2016
Shanghai Huali Microelectronics (HLMC) is expected to announce by the end of 2016 the construction of its second 12-inch plant, which will directly enter 28nm production, according...
China SITRI 8-inch fab ready for MEMS manufacturingWednesday 21 September 2016
The government-sponsored Shanghai Industrial Technology Research Institute (SITRI) has its 8-inch wafer fab targeted specifically at the manufacture of MEMS parts with volume production...
Fab equipment spending trending upwards in 2016 and 2017, says SEMIWednesday 7 September 2016
SEMI has published an August update of its world fab forecast report, which shows increased equipment spending, reaching 4.1% on-year in 2016 and 10.6% in 2017.
Fingerprint sensor orders filling 8-inch fab capacityWednesday 10 August 2016
Foundries have seen a ramp-up of orders for fingerprint-recognition sensor chips which are filling their 8-inch fab capacity, according to industry sources.
Intel Dalian fab put into operation, says reportTuesday 26 July 2016
Intel's 12-inch fab in Dalian has been put into operaton for the manufacture of non-volatile random-access memory (NVRAM) chips, according to a ChinaNews website report.
Fab tool book-to-bill slipsFriday 22 July 2016
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.
Toshiba, Western Digital open new flash memory fab in JapanMonday 18 July 2016
Toshiba and Western Digital have jointly announced the opening of a new fab in Yokkaichi, Mie Prefecture, Japan, which will support the conversion of the companies' 2D NAND capacity...
Fujian Jin Hua to break ground for new DRAM fab in mid-July, say reportsMonday 11 July 2016
Fujian Jin Hua Integrated Circuit will break ground for a new 12-inch wafer fab on July 16, according to media reports in China. The facility will be engaged in the manufacture of...
Taiwan Semiconductor Manufacturing Company (TSMC) has spent NT$4.4 billion (US$136.7 million) on factory building construction with China Construction First Division Group Construction...
UMC orders equipment for Xiamen fabThursday 30 June 2016
United Microelectronics (UMC) has purchased NT$562.88 million (US$17.42 million) worth of equipment from ASML for its 12-inch wafer fab in Xiamen, according to a company filing with...
Fab toolmakers seeing significant 12-inch fab expansion in ChinaMonday 27 June 2016
Capacity expansions are expected to take place at more than 10 12-inch wafer fabs in China over the next five years, according to sources at semiconductor equipment providers, which...
NAND flash supply to fall short in 3Q16, says DRAMeXchangeTuesday 21 June 2016
Prices of TLC (triple-level-cell) wafers and spot prices of mainstream memory cards have been on a steady rise for three consecutive months since April 2016. The uptrend will continue...
Samsung fab outage raises flash supply concernsTuesday 21 June 2016
A recent power outage at Samsung's Xian, China fab has disrupted the company's flash production raising concerns that supply of the memory might fall short of demand in the second...
Globalfoundries to expand presence in China with 300mm fabWednesday 1 June 2016
Globalfoundries has announced the signing of a memorandum of understanding to drive its next phase of growth in China. Through a joint venture with the government of Chongqing, the...
3D NAND die with M.2 SSD
Photo: Company, Tuesday 7 April 2015
KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool
Photo: Company, Thursday 18 July 2013
KLA-Tencor Surfscan SP3
Photo: Company, Monday 18 July 2011