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News tagged fab
  • Last update: Monday 16 October 2017 [469 news items]

China foundries striving for more dummy wafer supplies

Jun 26, 15:14

China-based logic IC and memory foundries including Nexchip Semiconductor and Rui-Li (transliterated from Chinese) Integrated Circuit have offered 20% higher prices than what their...

China foundries demanding more 12-inch test wafers

NOR flash prices to rise 20% in 3Q17, says DRAMeXchange

Jun 22, 16:11

Increasing demand for AMOLED panels from brand-name smartphone vendors and the industry's rising output for TDDI (touch with display driver) solutions have propelled the NOR flash...

Powerchip to restart NOR flash manufacturing

Jun 20, 14:23

Powerchip Technology has restarted its NOR flash production line amid tight supply of the memory.

SEMI sees record fab spending for 2017, 2018

Jun 15, 22:45

SEMI has predicted record spending for fab construction and fab equipment in 2017 and 2018. Korea, Taiwan and China will all see large investments, and spending in Europe will also...

Globalfoundries launches 7LP FinFET process

Jun 14, 20:56

Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...

Winbond to expand 12-inch fab capacity

Jun 14, 20:27

Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...

winbond

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

New Micron president and CEO Sanjay Mehrotra visits Taiwan

Jun 8, 15:47

Sanjay Mehrotra, the newly appointed president and CEO of Micron Technology, commenced an overseas tour of Micron's manufacturing sites after the first month in his new role, with...

Faraday announces automotive ASIC qualified for AEC-Q100 and AEC-Q006

Jun 5, 10:28

Taiwan-based Faraday Technology has announced an automotive ASIC device qualified for AEC-Q100 and AEC-Q006 as defined by the Automotive Electronics Council (AEC).

Fifteen chipmakers to spend more than US$1 billion on capex, says IC Insights

Jun 2, 10:29

There are 15 companies forecast to have semiconductor capital expenditures of more than US$1 billion in 2017, up from 11 in 2016 and only eight in 2013, according to IC Insights.

TSMC to start equipment move-in at Nanjing plant in September

May 30, 15:51

Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...

TSMC installed capacity for 2017 to rise 10%

Hefei Chang Xin keeps low profile but DRAM ambition remains unchanged

May 24, 16:11

Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...

Globalfoundries and Chengdu partner to expand FD-SOI ecosystem in China

May 23, 22:37

Globalfoundries and the Chengdu municipality have announced an investment to spur innovation in China's semiconductor industry. The partners plan to build a FD-SOI ecosystem including...

Win Semi expands GaAs wafer manufacturing capacity by more than 20%

May 17, 21:38

Win Semiconductors, the world’s largest pure-play compound semiconductor foundry, has completed phase 2 expansion at its newest wafer fab, Fab C. This operation is now fitted...

VIS seeking 8-inch fab equipment from memory chipmakers

May 9, 20:43

Specialty IC foundry Vanguard International Semiconductor (VIS) is looking to expand its 8-inch fabs, and has approached several memory makers to buy their second-hand equipment,...

Winbond planning new 12-inch fab

May 2, 14:16

Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.

UMC to roll out 22nm process as early as 2018

Apr 28, 11:46

Foundry chipmaker UMC has disclosed plans to roll out 22nm process technology as early as 2018. UMC has started IP development for its 22nm process, and expects to introduce the node...

UMC planning 22nm process technology

UMC expects flat performance in 2Q17

Apr 27, 11:08

United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...

Ardentec breaks ground for new plant in Nanjing

Apr 25, 15:05

Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...

Silicon wafer suppliers seeking long-term contracts

Apr 25, 11:18

Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.

Several China 12-inch fabs put construction on hold

Apr 21, 11:42

Several 12-inch fab projects implemented by China-based emerging chipmakers have been put on hold raising speculation about the country's overambitious plans to revamp the local chipmaking...

Powerchip chairman expects long-term DRAM shortage

Apr 20, 22:20

The supply of DRAM memory is likely to stay tight for a substantial period of time, according to Frank Huang, chairman for Taiwan-based pure-play foundry Powerchip Technology.

ASML secures pull-in of EUV equipment orders

Apr 20, 13:52

ASML has landed a pull-in of EUV lithography equipment orders with its backlog reaching 21 units, according to the company.

PTI to enjoy robust demand for NAND flash

Apr 20, 10:25

Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.

UMC Xiamen fab obtains orders from MediaTek, Spreadtrum

Apr 17, 11:40

United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China has obtained 40nm chip orders from MediaTek and Spreadtrum Communications, according to industry...

China fab toolmakers targeting advanced-node production

Apr 12, 11:32

Naura Technology (formerly Beijing Sevenstar Electronics) has started shipping ion etch equipment for the manufacture of 14nm chips to chipmakers, while Advanced Micro-Fabrication...

Powerchip JV fab in China ready for trial production in June

Apr 7, 10:57

Powerchip Technology's joint venture fab in Hefei, China will be ready for trial production in June 2017, according to Frank Huang, CEO for the Taiwan-based pure-play foundry.

TSMC Nanjing fab gearing up for opening

Apr 6, 11:14

Taiwan Semiconductor Manufacturing Company (TSMC) will soon strike deals with a number of equipment, materials and components companies that will support production at its new 12-inch...

VIS mulling fab tools purchases

Stockwatch - Mar 31, 09:58

Vanguard International Semiconductor (VIS) is considering acquiring production equipment from its fellow foundry companies, according to the Taiwan-based 8-inch IC foundry.

New Wafer Works China plant to come online in 2018, says report

Newswatch - Mar 29, 22:53

Taiwan-based silicon wafer supplier Wafer Works is expected to start operating its new plant in Zhengzhou, China which will be dedicated to producing 8-inch wafers in the first quarter...

TSMC to start installing equipment at Nanjing fab in 2H17

Mar 24, 10:31

Equipment move-in will take place at Taiwan Semiconductor Manufacturing Company's (TSMC) Nanjing plant in the second half of 2017, according to Roger Luo, president for TSMC Nanjing...

tsmc

UMC Xiamen fab gearing up for 28nm chip production

Stockwatch - Mar 22, 11:13

United Microelectronics' 12-inch foundry subsidiary in Xiamen, China will be ready for 28nm chip production in the second quarter of 2017 vying for orders from China's local handset...

Gudeng seeing robust 12-inch fab equipment orders from China

Mar 20, 21:44

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...

HLMC 12-inch fab running at full capacity, says company VP

Mar 15, 15:41

China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...

HLMC VP Jack Shu

Yangtze River Storage 3D NAND flash development on track

Mar 15, 09:54

Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab...

YMTC CEO
469 items [3/14]
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  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

19-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.