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News tagged fab
  • Last update: Thursday 13 June 2013 [230 news items]

SMIC Wuhan fab to expand foundry services

Dec 30, 16:45

Wuhan Xinxin Semiconductor Manufacturing, a 12-inch fab managed by Semiconductor Manufacturing International Corporation (SMIC), has revealed plans to expand from memory chip manufacturing...

Fab tool supplier Gudeng gears up for 450mm wafer transition

Dec 28, 11:23

Taiwan's Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, has been involved in the industry's efforts in...

SMIC will not give up Chengdu, Wuhan fabs, says CEO

Dec 22, 14:27

Semiconductor Manufacturing International Corporation (SMIC) CEO David NK Wang has denied reports saying the foundry is considering giving up two government-invested wafer fabs located...

Macronix mulling plans to buy 12-inch fab from ProMOS, say sources

Dec 8, 15:32

Mask ROM and NOR flash maker Macronix International Company (MXIC) is planning to purchase an existing 300mm (12-inch) fab, possibly from DRAM maker ProMOS Technologies, and invest...

Aptina adds Micron 8-inch fab in Japan to its production line

Nov 20, 16:45

Aptina Imaging plans to use Micron Technology's 8-inch fab in Japan as a CMOS image sensor (CIS) production site since it is still unable to immediately support short lead-time orders...

Aptina CEO David Orton

SMIC completes construction on multiple fabs in Shenzhen

Nov 20, 10:45

Semiconductor Manufacturing International (SMIC) has completed construction of its new and separate 200mm (8-inch) and 300mm (12-inch) fabs in Shenzhen, China. David NK Wang made...

SMIC headquartered in Shanghai

TSMC board approves US$2.5 billion for 12-inch capacity expansion

Nov 11, 12:05

Taiwan Semiconductor Manufacturing Company (TSMC) has announced its board of directors on November 10 approved a budget of around US$2.24 billion to expand advanced technology capacity...

TSMC to pour US$6 billion into 12-inch fab expansion, say equipment suppliers

Oct 28, 12:09

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to invest up to US$6 billion in the fifth- and fourth-phase capacity expansion at its 12-inch Fab 12 and Fab 14, respectively,...

CSMC inks licensing deal with IBM for 0.18-micron RF CMOS process

Oct 21, 15:57

CSMC Technologies, a China-based specialty foundry provider, has signed an agreement with IBM to license its proprietary 0.18-micron radio frequency (RF) CMOS process. The process...

UMC ramping 45/40nm at Fab 12i

Oct 9, 10:33

United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...

TI opens 300mm analog fab in US

Oct 6, 14:46

Texas Instruments (TI) has announced the opening of its manufacturing facility in Richardson, Texas. The chipmaker said it expects to begin moving equipment into the facility in Oc...

TSMC to ramp capacity at Fab 14 for Intel Atom opportunity

Sep 25, 17:09

Taiwan Semiconductor Manufacturing Company (TSMC) has scheduled a ramp up of monthly capacity at its 300mm (12-inch) wafer fab (Fab 14) located in southern Taiwan at the Tainan Science...

BOE Tech ups investment in China 6G LCD fab

Sep 18, 14:46

China's BOE Technology has more than quintupled its investment to nine billion yuan (US$1.32 billion) in a 6G LCD panel fab project in the China city of Hefei, according to a company...

Chip equipment bookings up for fifth consecutive month, says SEMI

Sep 18, 10:28

North America-based manufacturers of semiconductor equipment posted US$599 million in orders in August 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Monitor panel production moving to 6G and larger fabs, says DisplaySearch

Sep 17, 15:46

As panel manufacturers increase production of 16:9 aspect ratio and larger LCD monitor panels, their third-quarter 2009 plans indicate that 56% of LCD monitor panels are expected...

Analysts see chip recovery encouraging fab spending and ASPs

Sep 10, 11:27

IC Insights in its recent research forecast wafer fab capacity utilization will soon return to pre-crisis levels, signaling an upcoming rise in IC ASPs. In addition, SEMI has revised...

Macronix not yet decided on 12-inch fab, says chairman

Sep 9, 14:51

Taiwan-based mask ROM and NOR flash maker Macronix International Company (MXIC) is still evaluating alternative ways to establish a 300mm (12-inch) wafer fab, according to company...

Macronix' chairman Miin Wu

Commentary: Chartered takeover price is almost TSMC capex for 2 years

Sep 8, 16:38

Morris Chang might have been surprised to learn that Chartered Semiconductor Manufacturing will be sold to Advanced Technology Investment Company (ATIC) for a high price of US$3.9...

Taiwan LCD panel makers worried by government ban on China fabs

Sep 4, 16:52

Competitors' latest plans to set up next-generation LCD fabs in China have worried Taiwan makers, who are still forbidden by the island nation's government to invest in front-end...

LCD panel makers gearing up fab construction in China, says Displaybank

Sep 3, 14:29

Leading TFT-LCD panel makers including LG Display (LGD), Sharp and Samsung Electronics are actively seeking advancement into China. Displaybank said that the trend can be seen as...

Spansion says partnership with SMIC remains unchanged

Sep 2, 15:06

Spansion has claimed its foundry agreement with Semiconductor Manufacturing International Corporation (SMIC) is still valid, though the schedule to ramp 65nm production at SMIC's...

Spansion production line

Macronix mulling NT$160 billion investment in fab construction, says paper

Newswatch - Aug 31, 14:34

Taiwan-based mask ROM and NOR flash chipmaker Macronix International (MXIC) has proposed plans to build two 12-inch fabs with a total investment of NT$160 billion (US$4.86 billion),...

Samsung plans to add an 8-inch wafer plant to CIS production

Newswatch - Aug 11, 11:43

Samsung Electronics plans to allocate one more 8-inch fab (Line 8) for CMOS image sensor (CIS) production, as it expects CIS demand will grow significantly, according to market sou...

IDT to go fabless, transfers chip production to TSMC

Aug 7, 09:39

Integrated Device Technology (IDT) and Taiwan Semiconductor Manufacturing Company (TSMC) on August 6 announced they have entered into an agreement to transfer product fabrication...

HHNEC and GSMC proposed 12-inch fab placed on hold again

Aug 6, 12:16

Long-proposed plans for China-based wafer foundries Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corporation (GSMC) to jointly set up a 300mm (12-inch) fab has reportedly...

Tzu-Yin Chiu, president and CEO of HHNEC

Samsung and Toshiba affect memory spot pricing, says inSpectrum

Jul 31, 16:26

Spot prices of both DRAM and NAND flash enjoyed a big sequential jump this week (July 27-31) upon news that Samsung Electronics raised its DDR2 prices and Toshiba suffered from a...

Taiwan government denies report of relaxed rules on fab investment in China

Jul 30, 10:10

Officials from the Industrial Development Bureau (IDB) under Taiwan's Economics Ministry have denied a recent Chinese-language Economic Daily News (EDN) report that indicated...

Pure-play foundry to underperform market in 2009, says iSuppli

Jul 27, 09:46

For 2009, the global pure-play foundry business is expected to underperform the total semiconductor industry, according to iSuppli. The current forecast is for the pure-play foundry...

AUO raises capex budget for 2009

Jul 24, 14:16

AU Optronics (AUO) has revised upward its capex for 2009 from NT$50-60 billion (US$1.52-1.83 billion) to NT$70-75 billion as its is ramping up output at fab L8A, plans to start up...

Winbond remains cautious about expansion

Jul 16, 14:45

Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...

TSMC 8-inch fab to offer turnkey MEMS manufacturing process

Jul 14, 10:52

Taiwan Semiconductor Manufacturing Company (TSMC) next week will announce that its manufacturing process for MEMS ICs can be wholly completed at its 8-inch fab (Fab3). The development...

Chip fab spending to grow 61% in 2010, says SEMI

Jul 9, 16:20

Total fab spending worldwide is poised to grow 61.5% in 2010, following a 50.7% drop in 2009, according to SEMI. The association previously predicted the overall fab spending would...

Winbond completes transition to 300mm fab production

Jul 8, 14:09

Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...

SMIC strengthens deployment in MEMS segment

Jun 25, 16:01

China-based Semiconductor Manufacturing International Corporation (SMIC) has upgraded its MEMS department to an independent business unit. The company stated that it will begin volume...

ProMOS to sign supply agreement with Elpida, sources say

Jun 17, 11:53

ProMOS Technologies will sign a DRAM supply agreement with Elpida Memory soon, forming a partnership that may be key to success of the Taiwan government-led Taiwan Memory Company...

ProMOS facilities at CTSP
230 items [5/7]
Realtime news
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    IT + CE | 11h 31min ago

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    IT + CE | 11h 36min ago

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    Bits + chips | 11h 58min ago

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    Displays | Jun 19, 21:05

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    Displays | Jun 19, 20:49

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    Before Going to Press | 11h 52min ago

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    Before Going to Press | Jun 19, 21:51

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    Before Going to Press | Jun 19, 20:47

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    Before Going to Press | Jun 19, 20:21

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    Before Going to Press | Jun 19, 19:16

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  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

  • Applied+Materials+Solar+Technology+Center+in+China

    Applied Materials Solar Technology Center in China

    Applied Materials has opened an advanced solar research and demonstration facility in Xian, China. The Solar Technology Center is comprised of laboratory and office buildings covering...

    Photo: Company, Oct 30.

  • KLA%2DTencor+8900+inspection+system

    KLA-Tencor 8900 inspection system

    KLA-Tencor has extended its product offerings in the CMOS image sensor (CIS) market by announcing the 8900 defect inspection system. The new 8900 offers selectable illumination...

    Photo: Company, Oct 19.

Development and commercialization of Thunderbolt technology
Smartphone industry and market, 2013 forecast

19-Jun-2013 markets closed

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Trends in China LED chip and packaging sector
  • Trends and shipment forecast for 2H 2012 tablet market

    Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.

  • Trends in the China video market

    In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.

  • Trends in Asia LED chip manufacturing industry

    Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.