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News tagged fab
  • Last update: Wednesday 25 November 2015 [304 news items]

Macronix allocates more capacity to flash production

Jul 28, 17:00

Macronix International has said that capacity at its newly-opened 12-inch fab has almost all shifted to NOR flash production to meet demand for new orders. The capacity was originally...

Samsung said to ramp new fab in September

Jul 14, 01:00

Samsung Electronics is expected to open a new memory semiconductor fabrication plant in September, according to industry sources. Dubbed Line-16, the facility will be focused on the...

VIS reportedly offers to buy ProMOS 12-inch fab

Jul 4, 11:46

Vanguard International Semiconductor (VIS), a Taiwan Semiconductor Manufacturing Company (TSMC) affiliate specializing in analog/mixed-signal and logic ICs, has offered to acquire...

ProMOS 12-inch fab at CTSP, central Taiwan

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

Rexchip revises 2011 capex

May 27, 01:15

Rexchip Electronics has budgeted NT$9 billion (US$311 million) in capex for 2011 to ramp a new 12-inch DRAM fab and upgrade to 30nm-class process technology, according to company...

Rexchip president Stephen Chen

ProMOS sells China subsidiary with 8-inch fab

May 24, 01:10

Taiwan-based DRAM maker ProMOS Technologies on May 23 announced the sale of ProMOS (Chongqing) Technologies, its wholly owned subsidiary semiconductor maker located in Xiyoung Micro-electronics...

ProMOS to liquidate China fab

May 18, 13:31

Taiwan's ProMOS Technologies has decided to sell off a 100%-owned subsidiary in Chongqing, western China, which has an 8-inch fab, in order to raise funds to finance its existing...


SMIC wraps up deal to share ownership of Wuhan fab

May 13, 01:35

Semiconductor Manufacturing International Corporation (SMIC) and Hubei Science & Technology Investment Group announced on May 12 the formal signing of a joint venture agreement...

TSMC to ramp new 12-inch fab ahead of schedule

May 6, 01:35

Taiwan Semiconductor Manufacturing Company (TSMC) has begun equipment move-in for the phase 1 facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products...

Big to grow bigger in fab tool market, says The Information Network

May 5, 13:42

Applied Materials' planned acquisition of Varian Semiconductor will strengthen its dominance of the global semiconductor equipment market, according to The Information Network.

UMC says Japan fab unaffected by aftershocks

Apr 13, 14:10

United Microelectronics Corporation's (UMC) 8-inch wafer plant in Chiba Prefecture has not been affected by the latest aftershocks that struck Japan, continuing to run at normal capacity,...

Aggressive LED fab investment drives 40% growth in equipment spending in 2011, says SEMI

Apr 6, 10:18

With the widespread adoption of LED technology in LCD backlight applications and growing interest in LEDs for general lighting purposes, LED manufacturers are poised to meet the soaring...

TSMC to start second phase of China fab construction, says paper

Newswatch - Mar 29, 13:51

Taiwan Semiconductor Manufacturing Company (TSMC) will soon break ground for the second phase construction of its 8-inch wafer plant in Songjiang, Shanghai (China), according to a...

Record capex leads to 28% fab equipment growth in 2011, says SEMI

Mar 3, 14:45

SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...

Taiwan analog IC prices affected by TI 12-inch fab going on-line

Mar 2, 01:00

With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected...

Japan fab tool book-to-bill slips below parity in January 2011

Feb 18, 15:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...

TSMC to ramp capacity at Fab 14, hire new staff

Feb 18, 11:24

Taiwan Semiconductor Manufacturing Company (TSMC) is currently equipping 12-inch tools at its Fab 14, Phase 4 facility located at the Southern Taiwan Science Park (STSP). Designed...

AUO Crystal sets up solar wafer fab in central Taiwan

Feb 11, 16:18

AU Optronics (AUO) subsidiary AUO Crystal Corp (ACC) will establish a solar wafer plant in Taiwan's Chungkang Export Processing Zone, under the Ministry of Economic Affairs (MOEA).

Powerchip sends 40nm process NAND flash samples to clients

Jan 12, 15:00

Powerchip Technology has already delivered samples of NAND flash chips built using a 40nm process to clients, according to the company, adding that its flash business will target...

TSMC spends more than NT$30 billion on fab gear in December

Stockwatch - Dec 31, 14:08

Taiwan Semiconductor Manufacturing Company (TSMC) has spent more than NT$30 billion (US$1.03 billion) on equipment procurement, cleanroom facilities and factory building construction...

Intel personnel change sparks speculation about future of Micron

Dec 30, 14:22

Michael Chen, director of Intel's Asia-Pacific embedded sales and ultra-mobility group, has reportedly resigned from the company. The news comes after comments were made by the CEO...

Gintech reportedly mulls joint venture fab for solar wafer production

Dec 23, 12:24

Solar cell maker Gintech Energy reportedly plans to team up with Taiwan Fertilizer, CTCI and a major Japanese solar company to set up a solar wafer manufacturing company capable of...

SAS semiconductor wafer subsidiary opens new wafer fab in US

Dec 22, 01:05

Globitech, a US-based subsidiary of Sino-American Silicon Production (SAS), has announced the inauguration of its second wafer fab on December 21. SAS chairman MK Lu indicated that...

New fab could be compatible with 18-inch production tools, says TSMC

Dec 20, 17:00

Taiwan Semiconductor Manufacturing Company (TSMC) has said it remains flexible on its yet-to-be-built "Fab 16" supporting equipment used to make chips on 18-inch wafers...

Taiwan government approves AUO 7.5G plan for China

Dec 17, 17:06

AU Optronics (AUO) announced today that it has obtained formal approval from the Investment Commission of the Ministry of Economic Affairs (MOEA) to establish a 7.5G TFT-LCD production...

North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI

Dec 17, 16:11

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2010 compared to 0.98 in October and 1.06 a year ago, according to SEMI...

Intel, Micron to ramp delayed fab in 2Q11

Dec 17, 01:30

Micron Technology has disclosed that a new NAND flash fabrication facility in Singapore, which it invests in with Intel, is scheduled to commence volume production in the second quarter...

Fab spending to climb 18% in 2011, but uncertain outlook for new fab construction, says SEMI

Dec 8, 15:17

Worldwide fab spending is expected to increase by 18.3% in 2011 and by 9.5% in 2012, as a result of ongoing technology upgrades and continued capacity growth, according to SEMI.

Most important fab for LCD TV panel production is 8G, says DisplaySearch

Dec 6, 14:30

As panel makers expand, they are increasingly utilizing 8G fabs for LCD TV panel production, and the production of LCD TV panels at 8G increased to 41% in the third quarter of 2010,...

Taiwan to pass Japan as largest source of IC wafer fab capacity, says IC Insights

Nov 15, 13:53

It was not long ago that Taiwan was considered just a provider of back-end (assembly and test) services for the semiconductor industry. However, over the past two decades the country...

SMIC to acquire part of Wuhan fab ownership

Oct 29, 11:54

China-based foundry chipmaker Semiconductor Manufacturing International Corporation (SMIC) has said it has reached an agreement with the Wuhan municipal government to share the ownership...

Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ

Oct 21, 14:35

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...

TI announces first wafer plant in China

Oct 15, 15:55

Texas Instruments (TI) has announced the opening of its first wafer plant in China, an 8-inch manufacturing facility located in the Chengdu High-tech Zone.

TSMC approved to produce on 0.13-micron in China

Sep 30, 02:10

An application by Taiwan Semiconductor Manufacturing Company (TSMC) to fabricate on 0.13-micron technology at its Songjiang 8-inch fab in Shanghai was approved by the Investment Commission...

TSMC expanding China 8-inch fab capacity, says company exec

Sep 23, 14:37

Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up the monthly capacity at its Songjiang 8-inch fab in Shanghai to 50,000 wafers by the end of 2010 compared to the current...

TSMC vice chairman FC Tseng
304 items [5/9]
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View more
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

Intel strategies in the mobile device market
Wireless broadband developments in Southeast Asia markets

25-Nov-2015 markets closed


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Analysis of China revised domestic semiconductor industry goals
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    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.