Taipei, Wednesday, August 16, 2017 21:34 (GMT+8)
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STATS ChipPAC introduces FlexLine wafer level packaging method - related content
Press release; Rodney Chan, DIGITIMES [Wednesday 12 March 2014]
Realtime news
  • ASE output hit by power outage

    Bits + chips | 9min ago

  • HTC to offer Vive VR training to UPS

    IT + CE | 11min ago

  • Getac shipping GVS products to US market

    Before Going to Press | 57min ago

  • HMD Global to unveil Nokia 8

    Before Going to Press | 1h 1min ago

  • Nvidia overtakes MediaTek as second largest IC design company

    Before Going to Press | 1h 4min ago

  • Brisk graphics card demand to buoy inductor firms in 3Q17

    Before Going to Press | 1h 7min ago

  • Global notebook shipments rise in 2Q17, says firm

    Before Going to Press | 1h 8min ago

  • UPS to use HTC Vive for VR training

    Before Going to Press | 1h 9min ago

  • Egistec to post brisk 3Q17 revenues

    Before Going to Press | 1h 10min ago

  • ASE production hit by power outage

    Before Going to Press | 1h 11min ago

  • Apple expected to launch Apple Watch 3 by year end

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16-Aug-2017 markets closed

 LastChange

TAIEX (TSE)10290.39-20.77-0.2% 

TSE electronic436.84-0.82-0.19% 

GTSM (OTC)133.78+0.71+0.53% 

OTC electronic194.71+1.14+0.59% 

UMC
China AMOLED panel capacity expansion forecast, 2016-2020
Global notebook shipment forecast, 2017 and beyond
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    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.