Taipei, Wednesday, September 3, 2014 16:21 (GMT+8)
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STATS ChipPAC introduces FlexLine wafer level packaging method - comments from readers
Press release; Rodney Chan, DIGITIMES [Wednesday 12 March 2014]
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3-Sep-2014 markets closed

 LastChange

TAIEX (TSE)9399.72-113.34-1.19% 

TSE electronic370.15-5.74-1.53% 

GTSM (OTC)140.9-1.13-0.8% 

OTC electronic179.05-1.00-0.56% 

Analysis of China revised domestic semiconductor industry goals
DIGITIMES Marketing Services
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