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News tagged STATS ChipPAC
  • Last update: Tuesday 21 April 2015 [82 news items]

Two STATS ChipPAC subsidiaries in Taiwan merge

Apr 21, 21:04

IC testing house STATS ChipPAC Taiwan Semiconductor (SCT), a 52%-hold subsidiary of STATS ChipPAC, will complete its acquisition of STATS ChipPAC Taiwan, a wholly-owned subsidiary...

STATS ChipPAC to relocate China plant

Jan 6, 15:48

STATS ChipPAC has announced plans to relocate the company's wholly-owned subsidiary, STATS ChipPAC Shanghai (SCC), to a new manufacturing site in China.

SMIC joins China group for STATS ChipPAC takeover

Dec 23, 14:19

Semiconductor Manufacturing International (SMIC) will be part of a group of China-based investors looking to buy STATS ChipPAC. The IC foundry has announced that its subsidiary SilTech...

China firm in talks to buy STATS ChipPAC

Nov 7, 10:49

Jiangsu Changjiang Electronics Technology has made a non-binding proposal to STATS ChipPAC to acquire all the shares in STATS ChipPAC on a fully diluted basis for an aggregate purchase...

STATS ChipPAC puts up for sale

Jun 25, 10:40

STATS ChipPAC, the world's fourth-largest IC backend service company, has put itself up for sale with Advanced Semiconductor Engineering (ASE), Changjiang Electronics Technology,...

STATS ChipPAC Taiwan posts EPS over NT$4 for 2013

Newswatch - Mar 14, 15:04

IC backend service company STATS ChipPAC Taiwan saw its net profits climb 11.2% to NT$547.62 million (US$18.04 million) in 2013. The earnings translated into an EPS of NT$4.02 for...

STATS ChipPAC introduces FlexLine wafer level packaging method

Mar 12, 16:07

STATS ChipPAC has designed and implemented a new manufacturing method for wafer level packaging (WLP). This new approach is known as FlexLine.

STATS ChipPAC fcCuBE technology achieves significant growth in 2013

Feb 26, 10:52

STATS ChipPAC has announced that unit shipments of semiconductor packages utilising its patented fcCuBE technology more than quadrupled in 2013 compared to 2012. The performance and...

Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources

Jan 27, 14:55

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

STATS ChipPAC, Sigurd look to sustained growth in 3Q13

Sep 10, 21:46

IC backend service companies STATS ChipPAC Taiwan and Sigurd Microelectronics have received a handful of orders that will help them sustain strong revenues in the third quarter of...

IC backend services firms to see revenues peak in 3Q13

Aug 21, 09:54

IC backend services companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Ardentec, are expected to see their revenues...

STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging

Aug 20, 11:44

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...

STATS ChipPAC Taiwan 2Q13 sales up over 15%

Jul 12, 12:03

Wafer probing service provider STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its second-quarter sales increase more than 15% sequentially...

STATS ChipPAC to close Malaysia plant

Jul 1, 14:21

STATS ChipPAC, which provides IC assembly and test services to semiconductor companies and electronics OEMs, has unveiled plans to consolidate manufacturing at its production units...

STATS ChipPAC to pump another US$500 million into expansion in Singapore

May 29, 11:19

STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

IC testing firms post revenue drops in February

Mar 12, 15:35

King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments...

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Jan 29, 22:11

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

Spreadtrum adopts STATS ChipPAC eWLB packaging for smartphone ICs

Jan 24, 12:36

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

KYEC, Ardentec 1Q13 sales to drop up to 10%

Dec 24, 22:46

Taiwan-based IC testing firms King Yuan Electronics (KYEC) and Ardentec are expected to post sales decreases of up to 10% sequentially in the first quarter of 2013, in line with seasonal...

STATS ChipPAC Taiwan 1Q13 sales to buck seasonal trends

Dec 22, 14:34

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, is expected to enjoy a particularly strong first quarter of 2013 buoyed by strong...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

STATS ChipPAC to sell stake in China joint venture

Oct 5, 14:01

STATS ChipPAC has announced plans to sell its 25% stake in a China-based joint venture to co-owner Wuxi China Resources Microelectronics, a wholly-owned subsidiary of China Resources...

Ardentec, STATS ChipPAC offer mixed outlook for 4Q12

Oct 4, 15:47

Ardentec has expressed caution about its sales performance during the fourth quarter of 2012, citing rising inventory levels among customers. Fellow wafer testing company STATS ChipPAC...

STATS ChipPAC receives compensation for damage caused by Thai flooding

Oct 2, 01:20

STATS ChipPAC has reached a property damage insurance settlement of US$26.7 million with its insurers as compensation for its plant and equipment damaged by flooding in Thailand.

STATS ChipPAC cuts 3Q12 outlook

Sep 21, 01:25

STATS ChipPAC, a semiconductor test and packaging service provider, now expects its third-quarter sales to decrease 3-5% on quarter. The firm previously estimated flat sequential...

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

Backend firms expect orders for 28nm chips to pick up

Aug 29, 16:10

Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...

STATS ChipPAC profits fall

Jul 27, 11:46

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits for the second quarter of its fiscal 2012 declined over 50% from...

STATS ChipPAC announces volume manufacturing of fcCuBE technology

Jul 9, 14:34

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...

IC testing firms see sales continue to rise in May-June

Jun 12, 01:30

Sales at major IC backend service companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Adventec, all continued to trend...

STATS ChipPAC looks to strong sales in 2Q12

Jun 6, 13:45

IC testing house STATS ChipPAC Taiwan Semiconductor has revealed that orders from its major clients have been steady in the second quarter of 2012, which will ensure its revenues...

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