Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

IC testing firms post revenue drops in February

Mar 12, 15:35

King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments...

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Jan 29, 22:11

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

Spreadtrum adopts STATS ChipPAC eWLB packaging for smartphone ICs

Jan 24, 12:36

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

KYEC, Ardentec 1Q13 sales to drop up to 10%

Dec 24, 22:46

Taiwan-based IC testing firms King Yuan Electronics (KYEC) and Ardentec are expected to post sales decreases of up to 10% sequentially in the first quarter of 2013, in line with seasonal...

STATS ChipPAC Taiwan 1Q13 sales to buck seasonal trends

Dec 22, 14:34

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, is expected to enjoy a particularly strong first quarter of 2013 buoyed by strong...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...

STATS ChipPAC to sell stake in China joint venture

Oct 5, 14:01

STATS ChipPAC has announced plans to sell its 25% stake in a China-based joint venture to co-owner Wuxi China Resources Microelectronics, a wholly-owned subsidiary of China Resources...

Ardentec, STATS ChipPAC offer mixed outlook for 4Q12

Oct 4, 15:47

Ardentec has expressed caution about its sales performance during the fourth quarter of 2012, citing rising inventory levels among customers. Fellow wafer testing company STATS ChipPAC...

STATS ChipPAC receives compensation for damage caused by Thai flooding

Oct 2, 01:20

STATS ChipPAC has reached a property damage insurance settlement of US$26.7 million with its insurers as compensation for its plant and equipment damaged by flooding in Thailand.

STATS ChipPAC cuts 3Q12 outlook

Sep 21, 01:25

STATS ChipPAC, a semiconductor test and packaging service provider, now expects its third-quarter sales to decrease 3-5% on quarter. The firm previously estimated flat sequential...

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

Backend firms expect orders for 28nm chips to pick up

Aug 29, 16:10

Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...

STATS ChipPAC profits fall

Jul 27, 11:46

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits for the second quarter of its fiscal 2012 declined over 50% from...

STATS ChipPAC announces volume manufacturing of fcCuBE technology

Jul 9, 14:34

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...

IC testing firms see sales continue to rise in May-June

Jun 12, 01:30

Sales at major IC backend service companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Adventec, all continued to trend...

STATS ChipPAC looks to strong sales in 2Q12

Jun 6, 13:45

IC testing house STATS ChipPAC Taiwan Semiconductor has revealed that orders from its major clients have been steady in the second quarter of 2012, which will ensure its revenues...

STATS ChipPAC 1Q12 revenues up, KYEC down

Apr 27, 01:30

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw first-quarter 2012 revenues reach NT$330 million (US$11.3 million), up 25.7% on...

STATS ChipPAC Taiwan expects 1Q12 sales to rise 15-20%

Mar 30, 01:10

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, expects its revenues to increase 15-20% sequentially in the first quarter of 2012...

STATS ChipPAC revises guidance for 1Q12

Mar 20, 01:25

Semiconductor test and packaging service provider STATS ChipPAC now expects its revenues to register a 9-11% sequential decline in the first quarter of 2012, citing weaker-than-expected...

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

STATS ChipPAC Taiwan revenues pushed up by orders from TSMC, says report

Newswatch - Feb 14, 15:25

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its January revenues rise 9% sequentially buoyed by a pull-in of orders for logic...

STATS ChipPAC to shut Thailand plant

Feb 1, 14:34

STATS ChipPAC has announced that the company will not resume assembly operations in its Thailand plant due to extensive equipment and facility damage beyond economic restoration....

Taiwan IC testing houses to post single-digit sales drop in 1Q12

Jan 17, 01:05

Taiwan-based IC testing specialists including King Yuan Electronics (KYEC) and Ardentec are likely to see their first-quarter revenues decrease 5-10% sequentially affected by clients'...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

STATS ChipPAC Taiwan to post sales growth in 1Q12 on short lead-time orders, says report

Newswatch - Jan 5, 14:00

Revenues at STATS ChipPAC Taiwan Semiconductor are expected to register slight sequential growth in the first quarter of 2012, thanks to a pull-in of testing orders for logic ICs...

STATS ChipPAC says Thailand factory to resume partial operations in 1Q12

Dec 8, 01:15

STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...

STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan

Nov 17, 14:13

STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

Thai flooding affects IC backend units of multiple suppliers, says IHS

Nov 4, 11:26

Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...

STATS ChipPAC intros new fan-out WLP offering

Oct 6, 11:19

STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...