Bits + chips
ASE to raise funds through issuing new shares, bonds
MOPS; Jessie Shen, DIGITIMES

Taiwan-based Advanced Semiconductor Engineering (ASE) has disclosed plans to issue new shares and unsecured corporate bonds. Proceeds from the share and bond issues will be used to repay bank loans, according to the packaging and testing company.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.