Bits + chips
ASE ready to enter volume production of fan-out wafer-level packaging
Julian Ho, Taipei; Jessie Shen, DIGITIMES

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set to kick off by the end of 2016, according to industry sources.

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