ASE to buy Toshiba backend plant in China

May 16, 11:34

IC packager Advanced Semiconductor Engineering (ASE) announced on May 15 that the company has reached a deal with Toshiba Semiconductor (Wuxi) in China to acquire its chip assembly...

Walton generates more revenues from specialty DRAM, says report

Newswatch - May 7, 10:16

Packaging and testing company Walton Advanced Engineering, which long focused on the PC DRAM market, has seen sales generated from the orders for specialty DRAM (SDRAM) chips account...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

ASE expects 11-14% growth in 2Q13 shipments

Apr 29, 10:32

IC packaging and testing house Advanced Semiconductor Engineering (ASE) expects shipments to increase 11-14% sequentially and gross margin to rise to 23.2% in second-quarter 2013,...

ChipMOS subsidiary begins trading on Taiwan emerging stock board

Apr 22, 15:39

ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies, on April 19 started trading on the Emerging Stock Board of the Taiwan Stock...

ASE breaks ground for new factory buildings in southern Taiwan

Apr 12, 11:55

Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

ASE to issue NT$15 billion convertible bonds

Stockwatch - Apr 9, 12:23

Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...

PTI-Greatek deal probed for possible insider trading

Mar 21, 22:07

The Taipei Prosecutor's Office on March 21 began an investigation into possible insider trading before Powertech Technology (PTI) made its acquisition of a controlling stake in Greatek...

Memory IC backend firms seeing demand pick up

Mar 21, 14:55

Upcoming roll-outs of new smartphones and other mobile devices are set to drive demand for NAND flash and mobile DRAM chips, according to Taiwan-based memory IC packaging and testing...

Packaging material supplier Chang Wah to post double-digit revenue growth in 2Q13

Mar 20, 14:19

Packaging material supplier Chang Wah Electromaterials is expected to post a double-digit growth in revenues in the second quarter of 2013, powered by increasing orders for flip chip...

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

IC testing firms post revenue drops in February

Mar 12, 15:35

King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments...

PTI expects recovery starting 2Q13

Feb 6, 22:22

Packaging and testing firm Powertech Technology (PTI) expects business to pick up in the second quarter, and continue to recover for the rest of 2013. said company chairman DK Tsai...

Renesas, J-Devices sign MoU on transfer of backend facilities

Jan 31, 16:44

Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

ASE, SPIL 1Q13 sales likely to drop 10% or more

Jan 28, 20:58

Sales at IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely register sequential decreases of 10% or more...

Walton to cut 2013 capex, provides cautious outlook

Jan 22, 21:50

Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

Chipbond posts record sales in 4Q, 2012

Jan 14, 20:19

Consolidated revenues at Taiwan-based Chipbond Technology, a packaging and testing house specializing in LCD driver ICs, climbed to an all-time high of NT$4.17 billion (US$144.1 million)...

ASE, SPIL 4Q12 sales miss guidance

Jan 10, 14:09

Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their core business revenues miss their guidance of 2-5%...

Sigurd posts profit growth in 2012

Jan 9, 15:26

Taiwan-based testing company Sigurd Microelectronics has reported pre-tax profits of NT$1.12 billion (US$38.5 million) for 2012, representing a 25% increase.

Seasonal factors push KYEC revenues down in 4Q12

Jan 8, 13:58

IC testing firm King Yuan Electronics (KYEC) has announced that revenues for the fourth quarter of 2012 slipped 7.8% sequentially to NT$3.28 billion (US$112.9 million), citing seasonal...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

Sigurd plans flat capex in 2013

Dec 27, 22:14

IC packaging and testing house Sigurd Microelectronics expects to maintain its 2013 capex at the same level as 2012. The expenditures will be spent on expanding capacity and R&...

IC backend services firms to ride high as TSMC ramps capex for 2013, say sources

Dec 17, 21:37

Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...

Sigurd posts record monthly sales

Dec 13, 16:14

Taiwan-based Sigurd Microelectronics, a packaging and testing company specializing in consumer and mature logic ICs, has announced that consolidated revenues for November 2012 climbed...

Chipbond to post better-than-expected 4Q12 sales

Dec 6, 15:31

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report an up to 5% sequential increase in consolidated revenues for the fourth quarter of 2012, bucking...

MPI November sales up 20%

Dec 5, 11:46

MJC Probe (MPI), which specializes in the manufacture of probe cards for wafer testing, has announced that revenues for November 2012 increased 20.9% sequentially to NT$292 million...

Taiwan IC backend production value to dip in 4Q12, says IEK

Nov 20, 13:45

The production value of Taiwan's IC packaging and testing industry sectors registered sequential growth of 2% and 2.3%, respectively, in the third quarter of 2012, according to data...

STATS ChipPAC to expand operations in Korea

Nov 20, 13:42

STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...