Bits + chips
Singapore IME, UMC team up to develop TSV for BSI sensors
Jessie Shen, DIGITIMES, Taipei

Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon via (TSV) technology for backside-illuminated CMOS image sensors (B...

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