News tagged TSV
Last update: Monday 25 November 2013 [34 news items]
STATS ChipPAC breaks ground for new factory
Jan 6, 01:20
STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...
TSMC gearing up for via-first TSV
Dec 5, 15:38
While major IC packagers have already devoted resources on TSV (via-last) development, Taiwan Semiconductor Manufacturing Company (TSMC) is also eyeing the market with its front-end...
STATS ChipPAC expands TSV offering
Apr 19, 10:38
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
UMC buys equipment for 3D IC manufacturing
Apr 7, 01:25
United Microelectronics Corporation (UMC) has acquired NT$561 million (US$19 million) worth of production equipment from subsidiary Hong Bao Technology (transliterated from Chinese),...
Nanya, ITRI team up for 3D stacked DRAM
Jan 25, 14:57
Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...
ITRI sets up 3D IC experimental lab
Jul 1, 12:28
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...
TSMC unveils new reference flows
Jun 10, 09:39
Taiwan Semiconductor Manufacturing Company (TSMC) on June 9 introduced two reference flows - Reference Flow 11.0 and Analog/Mixed Signal (AMS) Reference Flow 1.0 - a day after announcing...
PTI to offer NAND flash backend services for SSD
May 28, 13:54
The Suzhou, China plant of Powertech Technology (PTI) has reportedly landed NAND flash backend orders for solid-state drives (SSD) from a Japan-based customer, most likely Toshiba,...
UMC focusing R&D on 28nm, 22nm processes
Sep 30, 14:23
United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
TSMC beefs up R&D, moving to 22nm by 2011
Apr 23, 11:06
Taiwan Semiconductor Manufacturing Company (TSMC) has said it is on track to increase manpower within its R&D and design service units by 30% and 15%, respectively, while proceeding...
TSV development picking up momentum
Apr 7, 10:34
Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...
Applied Materials looks to drive TSV adoption
Dec 2, 16:50
Applied Materials has announced that it is undertaking a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically...
Taiwan to mass produce TSV by 2010
Oct 15, 17:06
Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...