Bits + chips
PTI, Elpida, UMC to collaborate to develop 3D IC logic+DRAM integration solution
Ingrid Lee, Taipei; Adam Hwang, DIGITIMES

Taiwan-based memory packaging/testing company Powertech Technology (PTI) and wafer foundry United Microelectronics (UMC) as well as Japan-based DRAM maker Elpida Memory on May 30 signed together for collaboration to develop 3D IC logic+DRAM integration...

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