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  • Last update: Monday 1 September 2014 [61 news items]

Eon reportedly to team up with China Sigma to develop NAND flash chips

Sep 1, 13:22

Taiwan-based flash chip supplier Eon Silicon Solution reportedly will team up with China Sigma to form a NAND flash joint venture in China, according to industry sources.

Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple

Jul 1, 13:53

The Samsung Electronics and Globalfoundries team reportedly has landed orders for its 14nm FinFET process from Qualcomm and Apple, with related foundry services to begin in early...

Notebook brand vendors to start RFQ in June; ODMs may see order reshuffling

May 27, 12:02

Notebook brand vendors will start their request for quotation (RFQ) processes for notebook orders for 2015 in June and ODMs are already preparing for the event, according to sources...

Toshiba, Canon team up for 15nm NAND flash, says report

Feb 27, 14:35

Toshiba, the world's second-largest maker of NAND flash memory behind Samsung Electronics, will work with fab-tool maker Canon to develop 15nm NAND chips with volume production slated...

Movea, Nuvoton team up to deliver motion-enabled embedded controllers for Windows 8.1 and Android devices

Dec 4, 15:18

Nuvoton Technology, a specialist in embedded controllers for the PC market, has incorporated Movea's SmartMotion technology into its NPCF204U stand-alone sensor hub family and the...

Qualcomm reportedly hopes Samsung and Globalfoundries can team up, sources say

Nov 18, 16:12

Qualcomm reportedly hopes Samsung Electronics and Globalfoundries can form an alliance, as the fabless IC vendor seeks to reduce its reliance on Taiwan Semiconductor Manufacturing...

Globalfoundries, Samsung said to team up to vie for Apple chip orders

Nov 13, 12:23

Rumors have been circulated in the IC industry claiming that Globalfoundries and Samsung Electronics will team up to vie for A9-series chip orders from Apple. Under the reported tie-up,...

Dialog, Richtek team up for power management ICs

Nov 12, 11:56

Taiwan-based Richtek Technology has signed a cooperation agreement with Dialog Semiconductor for the development of power management ICs targeting the tablet and smartphone chipset...

ASE, Infineon team up for assembly of auto products

Nov 7, 15:42

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

Alchip, KnCMiner team up for Bitcoin mining machine with 28nm ASIC

Nov 5, 15:44

KnCMiner, a provider of Bitcoin mining devices, and fabless ASIC company Alchip Technologies, have announced the availability of what the companies claim is the world's first 28nm...

Imagination, MediaTek team up for heterogeneous multi-processing SoCs

Sep 4, 12:35

Imagination Technologies has recognized MediaTek for its deployment of heterogeneous processing. The new MediaTek MT8135 chip is a mobile SoC enabling heterogeneous multi-processing...

Huawei to team up with Compal to make smartphones, tablets in Brazil, says paper

Newswatch - Aug 26, 14:04

Huawei Technologies plans to team up with Taiwan-based Compal Electronics to produce smartphones and tablets in Jundiai, Brazil, according to a Chinese-language Economic Daily...

Synopsys, UMC team up for 14nm FinFET

Jun 27, 10:48

IC foundry United Microelectronics (UMC) has announced that its partnership with Synopsys, a provider of electronic design automation (EDA) software and services, resulted in the...

InnoDisk, Aptos team up for industrial embedded use SSDs

May 31, 14:55

InnoDisk, which specializes in flash storage devices for industrial applications and embedded systems, has teamed up with backend service provider Aptos Technology to develop a new...

Xilinx, TSMC team up for 16nm FinFET FPGAs

May 29, 15:44

Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.

Imec, Globalfoundries team up for STT-MRAM

May 22, 11:22

Globalfoundries has joined Imec's industrial research collaboration to develop spin-transfer torque magnetoresistive random access memory (STT-MRAM), according to the IC foundry.

Infineon, Globalfoundries team on 40nm embedded flash process

Apr 29, 21:58

Infineon Technologies and Globalfoundries have announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

TSMC, Altera team on 55nm embedded flash process

Apr 16, 12:08

Programmable logic supplier Altera is working with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on a 55nm embedded flash (EmbFlash) process technology tailored...

Sequans, Alcatel-Lucent team up for LTE broadcast

Feb 25, 11:53

Sequans Communications has successfully completed interoperability testing of Alcatel-Lucent's LTE infrastructure equipment with Sequan's eBMS-capable LTE chipsets, according to the...

Austrian research team develop a new flat, flexible, transparent, and potentially disposable polymer sheet for capturing images

Feb 22, 11:22

An Austrian research team has developed a new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The team describesd their new...

Samsung reportedly replaces management team in Brazil market

Jan 23, 22:34

Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...

MStar Semiconductor and Flingo Samba TV platform team up to provide smart TV solution

Jan 17, 15:13

Smart TV app publisher Flingo has announced that Samba, its new interactive TV platform, will be integrated into MStar Semiconductor Smart TV solution to synchronize TV, tablet, phone...

UMC restructures executive team

Nov 20, 13:47

Foundry chipmaker United Microelectronics has announced the appointment of Po-Wen Yen to the position of CEO, effective immediately. Former CEO Shih-Wei Sun has been promoted to company...

UMC, STMicro team up to develop BSI process for image sensors

Sep 7, 15:02

United Microelectronics (UMC) has teamed up with STMicroelectronics to develop 65nm CMOS image sensor technology using backside illumination (BSI).

ALi, Panasonic team up for DVB-T2 chipset

Aug 30, 01:00

ALi, a provider of set-top box (STB) system-on-chip (SoC) solutions, has announced that the company has teamed up with Panasonic's semiconductor business group to begin mass production...

BOE eyes team up with Formosa Epitaxy, Unity Opto to set up LED epitaxial wafer plant

Aug 17, 11:27

China-based LED firms have been producing low-priced LED chips causing oversupply in the upstream LED chip segment to continue. China-based panel maker BOE recently announced plans...

Foxconn refutes rumors about entering Taiwan cable TV channel market

Aug 2, 01:05

Foxconn Electronics (Hon Hai Precision Industry), commenting on a recent rumor that the company is preparing to enter Taiwan's cable TV channel market, has said it is aiming to work...

Fujitsu, DoCoMo and NEC team up for communications IC

Aug 1, 16:14

Fujitsu has announced that the company has reached an agreement with NTT DoCoMo and NEC to form a joint venture, which will focus on the development and sales of semiconductors used...

ARM, TSMC team up to deliver ARM cores on FinFET transistors

Jul 24, 14:06

TSMC and ARM have announced a multi-year agreement extending their collaboration beyond 20nm technology to deliver ARM processors on FinFET transistors, enabling the fabless industry...

UMC signs license deal with IBM to develop 20nm chips

Jul 2, 13:55

United Microelectronics (UMC) announced recently that the company has signed a license agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transi...

ECS passes 2011 finance report with growth of more than 7%

Jun 26, 01:10

Elitegroup Computer Systems (ECS) hosted a shareholder meeting on June 25, passing its finance report for 2011 with consolidated revenues reaching NT$72.7 billion (US$2.43 billion),...

Taiwan market: Yahoo! Kimo expanding marketing team for keyword search advertising

Jun 15, 15:36

Yahoo! Kimo (Yahoo! Taiwan) has expanded its agent workforce for marketing its online keyword search advertising service in the Taiwan market to 38 sales partners and about 300 sales...

Singapore IME, UMC team up to develop TSV for BSI sensors

Jun 6, 01:20

Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...

Spansion, SK Hynix team up for SLC NAND

Apr 3, 10:50

Spansion has announced an alliance with SK Hynix to introduce SLC NAND products at the 4x, 3x, and 2x nodes. As part of the relationship, the pair will enter into a patent cross-licensing...

Arakawa Chemical, Taimide team up on thin-film metallization process research

Jan 9, 14:14

Taiwan-based polyimide (PI) film supplier Taimide Technology has announced it will work with Japan's Arakawa Chemical Industries to develop a new process used for the manufacture...

61 items [1/2]
  • MSI+LA+Dodgers+version+all%2Din%2Done+PC

    MSI LA Dodgers version all-in-one PC

    The LA Dodgers and Micro-Star International (MSI) have announced that MSI will be supplying the Dodgers with Wind Top all-in-one PCs and notebooks for use by team executives and office...

    Photo: Company, Mar 17.

  • Team+Rainbow%2Dseries+USB+drives

    Team Rainbow-series USB drives

    Team, a Taiwan-based supplier of memory modules, memory cards, USB drives and solid state drives (SSDs), is showcasing a variety of products at Computex Taipei 2008, including its...

    Photo: Company, Jun 3.

  • Team+Supreme%2Dseries+USB+drives

    Team Supreme-series USB drives

    Among Team's USB disk drive offerings on display at Computex 2008 is its Supreme series, which offer drives in capacities ranging from 8-64GB. With a leather-felt shell and slide...

    Photo: Company, Jun 3.

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