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  • Last update: Tuesday 20 September 2016 [90 news items]

BOE reportedly sets up new R&D team for bio-sensors

Sep 20, 01:00

China-based BOE has teamed up at least 100 engineers engaged in R&D for bio-sensors, according to industry sources. A business unit has also been set up under BOE to focus on...

Himax, Nuviz team up for HUD products

Sep 13, 11:00

Taiwan-based fabless IC firm Himax Technologies has announced it is partnering with Nuviz to develop head-up display (HUD) products.

UMC, APM team up for MEMS foundry services

Sep 5, 21:01

Taiwan-based United Microelectronics (UMC) has announced it is teaming up with dedicated MEMS foundry Asia Pacific Microsystems (APM) to provide enhanced MEMS manufacturing services...

Renesas, TSMC team up for 28nm MCUs

Sep 1, 22:35

Renesas Electronics and TSMC have announced that they are collaborating on 28nm embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation...

ARM, Intel team up for 10nm

Aug 17, 20:13

At the Intel Developer Forum on August 16, Intel announced its 10nm design platform for foundry customers will now offer access to ARM Artisan physical IP, including POP IP, based...

Micron, Silicon Motion team up for UFS solutions

Aug 17, 11:07

Micron Technology is working with its controller partner Silicon Motion Technology to develop controller solutions for Universal Flash Storage (UFS) chips, according to industry sources...

ASRock expects growing performance in 2016

Jun 8, 10:58

ASRock had an unsatisfactory performance in 2015 due to decreased motherboard shipments in China and increased expenses on server and industrial PC (IPC) investments; however, the...

Brazil market: Xiaomi recalls handset team, to not introduce new models temporarily

Jun 1, 11:13

Xiaomi Technology reportedly has recalled its handset team stationed in Brazil back to China due to difficulty promoting smartphones in the country and will not introduce new models...

University team develops cloud-based symbiotic system for fish farms and hydroponics

Apr 18, 11:24

A team consisting of several professors from the Department of Electronic Engineering at the National Taipei University of Technology has developed a symbiotic ecosystem between fish...

President-elect vows to safeguard Taiwan semiconductor industry

Mar 4, 11:26

The Taiwan government must form a "national team" in cooperation with local enterprises to meet increasing challenges amid the rising supply chain from China, president-elect...

President elect Tsai Ing-wen visiting HSP

Smartphone AP suppliers to team up with TSMC to compete with Qualcomm-Samsung in 10nm chip market

Mar 4, 10:48

Smartphone-use application processor (AP) makers in Taiwan and China are teaming up closely with Taiwan Semiconductor Manufacturing Company (TSMC) to compete with Qualcomm-Samsung...

MediaTek expands R&D team within IoT BU

Jan 4, 23:00

MediaTek has expanded the R&D team within its IoT (Internet of Things) business unit to more than 200 engineers, and the number of its IoT R&D staff will continue to grow...

Asustek assigns new head of R&D team

Nov 19, 14:45

Asustek Computer has appointed its vice president Joe Hsieh to lead its R&D unit, the Da Vinci Laboratory, to focus on developing technology for Internet of Things (IoT) and Industry...

EC anti-circumvention probe team to visit Taiwan in October

Sep 11, 15:14

The European Commission, which in late May 2015 decided to launch an anti-circumvention investigation of Taiwan- and Malaysia-based solar cell and PV module makers as well as China-based...

TPK reportedly recruits LCM team from Wintek

Aug 10, 16:04

Touch panel maker TPK Holding has reportedly recruited an LCM (LCD module) team from fellow maker Wintek in an attempt to extend product development and production to LCM assembly,...

Toshiba develops 2 new process technologies for MCUs, wireless ICs

Jul 27, 15:48

Toshiba has announced the development of a flash memory embedded process based on 65nm logic process and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog...

ARM, UMC team to tape out Cortex-A based 14nm FinFET chip

Jun 22, 16:17

United Microelectronics (UMC) has announced that it is collaborating with ARM to tape out a process qualification vehicle (PQV) test chip on the foundry's 14nm FinFET technology to...

InnoDisk, Supermicro and Toshiba team up for SSD cloud storage

Jun 22, 11:32

Taiwan-based InnoDisk, which develops and manufactures industrial-class storage products, has disclosed the company is partnering with NAND flash chip vendor Toshiba and Super Micro...

China market: Qualcomm, Allwinner team up for 4G LTE tablets

Jun 3, 15:19

Qualcomm has followed in the footsteps of Intel, teaming up with China-based IC design houses to promote its entry-level and cost-effective platforms in the China market.

High-quality, long-lasting: Q&A with Gigabyte motherboard team

Jun 1, 19:41

As one of the top vendors in the desktop motherboard industry, Gigabyte Technology has grown its business to reach shipments of around 20 million motherboards per year, most of which...

Tony Liao, Senior Associate VP at Gigabyte

ASE and TDK team up for IC embedded substrates

May 15, 15:38

Advanced Semiconductor Engineering (ASE) and TDK have announced that the companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

Globalfoundries, IMEC to jointly develop RF solutions for IoT applications

Feb 24, 11:02

Globalfoundries has announced a partnership with IMEC for joint research on future radio architectures and designs for highly-integrated mobile devices and IoT applications.

SK Hynix, Toshiba team up for nanoimprint lithography

Feb 5, 21:01

SK Hynix and Toshiba have announced they have struck a deal to jointly develop nanoimprint lithography (NIL), a candidate for the next-generation lithography technology.

HTC sponsors eSports teams Cloud 9, Team Liquid, Team SoloMid

Jan 28, 22:21

HTC has made an entrance into the eSports arena sponsoring three teams: Cloud 9, Team Liquid and Team SoloMid (TSM).

Taiwan team announces SEMI PV57-1214 standards

Dec 24, 15:53

A Taiwan team has announced SEMI-recognized international standards of performance measurement for dye-sensitized solar cells and organic solar cells, coded SEMI PV57-1214.

Business software vendor SAP looks to team up with Taiwan cloud data centers

Dec 16, 22:09

Enterprise software and service provider SAP is looking to sign a number of strategic alliance agreements with Taiwan-based cloud data centers in 2005, driven by growing demand for...

SAP Taiwan general manager Janice Lai

Micron, Winbond team up for serial NOR flash

Nov 27, 14:25

Micron Technology has partnered with Winbond Electronics to jointly develop serial NOR flash memory for automotive and Internet of Things (IoT) applications, according to the US memory...

Soitec, SK Innovation team up for semiconductor materials

Nov 25, 16:11

France-based Soitec and SK Innovation of Korea have signed an agreement to establish an alliance focused on accelerating innovation in the area of semiconductor materials for information...

Eon reportedly to team up with China Sigma to develop NAND flash chips

Sep 1, 13:22

Taiwan-based flash chip supplier Eon Silicon Solution reportedly will team up with China Sigma to form a NAND flash joint venture in China, according to industry sources.

Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple

Jul 1, 13:53

The Samsung Electronics and Globalfoundries team reportedly has landed orders for its 14nm FinFET process from Qualcomm and Apple, with related foundry services to begin in early...

Notebook brand vendors to start RFQ in June; ODMs may see order reshuffling

May 27, 12:02

Notebook brand vendors will start their request for quotation (RFQ) processes for notebook orders for 2015 in June and ODMs are already preparing for the event, according to sources...

Toshiba, Canon team up for 15nm NAND flash, says report

Feb 27, 14:35

Toshiba, the world's second-largest maker of NAND flash memory behind Samsung Electronics, will work with fab-tool maker Canon to develop 15nm NAND chips with volume production slated...

Movea, Nuvoton team up to deliver motion-enabled embedded controllers for Windows 8.1 and Android devices

Dec 4, 15:18

Nuvoton Technology, a specialist in embedded controllers for the PC market, has incorporated Movea's SmartMotion technology into its NPCF204U stand-alone sensor hub family and the...

Qualcomm reportedly hopes Samsung and Globalfoundries can team up, sources say

Nov 18, 16:12

Qualcomm reportedly hopes Samsung Electronics and Globalfoundries can form an alliance, as the fabless IC vendor seeks to reduce its reliance on Taiwan Semiconductor Manufacturing...

90 items [1/3]
Realtime news
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    Before Going to Press | 9h 54min ago

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    Before Going to Press | 9h 57min ago

  • China to lower PV feed-in tariffs for 2017, say reports

    Before Going to Press | 9h 58min ago

  • LG Chem to launch 2nd-generation batteries for electric vehicles, says report

    Before Going to Press | 9h 59min ago

  • 25 million Ultra HD TV panels shipped globally in 1H16, says Sigmaintell

    Before Going to Press | 10h 1min ago

  • Oppo aims to ship 130-140 million smartphones in 2017

    Before Going to Press | 10h 2min ago

  • Taiwan semiconductor industry to increase 7.2% in 2016, says TSIA chairman

    Before Going to Press | 10h 5min ago

  • Quanta Cloud Technology opens marketing office in Germany

    Before Going to Press | 10h 6min ago

  • Taiwan market: About 660,000 smartphones shipped in August

    Before Going to Press | 10h 9min ago

  • TWTM 2016 taking place in Taipei

    Before Going to Press | 10h 11min ago

  • Semi equipment maker Foxsemicon vying for orders for OLED panel manufacturing

    Before Going to Press | 10h 12min ago

  • TAICS to cooperate with US TIA on 5G, IoT

    Before Going to Press | 10h 13min ago

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    MSI LA Dodgers version all-in-one PC

    The LA Dodgers and Micro-Star International (MSI) have announced that MSI will be supplying the Dodgers with Wind Top all-in-one PCs and notebooks for use by team executives and office...

    Photo: Company, Mar 17.

  • Team+Rainbow%2Dseries+USB+drives

    Team Rainbow-series USB drives

    Team, a Taiwan-based supplier of memory modules, memory cards, USB drives and solid state drives (SSDs), is showcasing a variety of products at Computex Taipei 2008, including its...

    Photo: Company, Jun 3.

  • Team+Supreme%2Dseries+USB+drives

    Team Supreme-series USB drives

    Among Team's USB disk drive offerings on display at Computex 2008 is its Supreme series, which offer drives in capacities ranging from 8-64GB. With a leather-felt shell and slide...

    Photo: Company, Jun 3.

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Intel strategies in the mobile device market

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The transition to 4k TV - UHD TV market forecast, 2014-2017
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