Taipei, Friday, October 20, 2017 06:11 (GMT+8)
cloudy
Taipei
23°C
Lanner releases FW-8650 Unified Communication Appliance
Press release, December 4; Ricky Morris, DIGITIMES [Tuesday 4 December 2007]

Lanner Electronics has announced the release of the FW-8650, a Unified Communication Appliance designed for a broad array of network service applications, network security, QoS, bandwidth management, load balancing and VoIP.

"The Intel Q965 Express chipset offers features that specifically address key requirements in network service applications, such as increased memory bandwidth, faster system bus and low-power processor support," said Rose Schooler, director of marketing, embedded and communication processor division, Intel. "When combined with the Intel Core 2 Duo processor, it delivers a host of benefits that enable Lanner's customers to deploy more responsive network service appliances with increased energy-efficient performance, flexibility and scalability."

The system design focuses on scalable architecture with support for 1066/800/533 system bus processors, including Intel Core 2 Duo, Pentium 4 and Celeron D processors. The inclusion of six Gigabit LAN ports with three pairs supporting segment bypass results in a ramp up in network traffic throughput performance, highlighted Lanner.

System performance is increased through the integration of dual-channel DDR2 SDRAM with 64-bit memory addressing, providing shorter access time for data while dual expansion slots offer the ability to choose between two PCI or two PCI Express slots, giving a valuable advantage when designing an appliance for multitasking applications, said Lanner.

The FW-8650 will be available starting this month in small quantities. Further product information is available on the Lanner website.

Lanner FW-8650

Lanner FW-8650
Photo: Company

Realtime news
  • Asustek, Gigabyte reorganization efforts to bear fruit in 1Q18

    IT + CE | Oct 19, 17:43

  • White-box smartphone vendors highlight innovation in their new products

    Before Going to Press | 7h 58min ago

  • ProLogium, WM Motor partner to develop LCB-powered vehicle

    Before Going to Press | 8h 6min ago

  • Leadframe maker SDI resumes production at China plant

    Before Going to Press | 8h 7min ago

  • Backend houses expect rising memory demand for servers and datacenters

    Before Going to Press | 8h 8min ago

  • UREC seeking partnerships with local silicon wafer suppliers

    Before Going to Press | 8h 11min ago

  • Taiwan foundries enjoying rising orders from fabless firms

    Before Going to Press | 8h 14min ago

  • White-box notebook makers showcasing ultra-thin and 2-in-1 devices in Hong Kong

    Before Going to Press | 8h 18min ago

  • Taiwan analog IC firms to enjoy strong 4Q17

    Before Going to Press | 8h 19min ago

  • Epistar sues All Star Lighting Supplies for patent infrigement

    Before Going to Press | 8h 20min ago

  • TSMC raises IC market forecast for 2017

    Before Going to Press | 8h 22min ago

Pause
 | 
View more
UMC
China AMOLED panel capacity expansion forecast, 2016-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.