- 7 Mar 2017:In an attempt to regain its mojo, Toshiba will double down on traditional products that are seen as part of promising growth segments.
- Evan Blass is back with information on the Galaxy S8. According to Blass, the device will now release on April 28th. This sets the date back by one week. Reasons for the delay include alleged quality control and production delays for the Snapdragon 835, on both Samsung and Qualcomm's ends. Blass isn't sure about the exact reason though, only that the rumored release will now take place a week later.
- Industry watchers predicted SK Hynix may join hands with Taiwanese company Foxconn, also known as Hon Hai Precision Industry, to acquire Toshiba's chip business. Foxconn's Chairman Terry Gou has been "very serious" about bidding for Toshiba's memory chip business.
- 6 Mar 2017:Under the terms of the deal, Cypress will sell a subsidiary that owns the fab to a startup foundry, SkyWater Technology Foundry, backed by a Minnesota-based holding company. SkyWater will operate the fab, manufacturing wafers for Cypress and for other chip firms, Cypress said.
- 3 Mar 2017:Apple's next-generation 3D iPhone camera could 'reinvent the user experience' (Feb 24) - Business InsiderApple is developing a new camera with "3D sensing and modeling capabilities" that could "reinvent the user experience" to be included in a redesigned iPhone expected to launch later this year, according to new research from KGI Securities analyst Ming-Chi Kuo seen by Business Insider.
- We are hearing that Intel is still struggling with defect/yield issues with this advanced process for High Volume Manufacturing (HVM) release and have not locked down the complete process of records (PORs) to date. While the production ramp target at Fab 28 is 2H17, there are concerns that this ramp could be delayed by 2-3 months.
- 2 Mar 2017:"We don't expect many projects on our latest high-end chip," Mediatek Co-Chief Operating Officer Jeffrey Ju told reporters in a press briefing Monday at the Mobile World Congress here. "For now, we think less than 10 smartphone models will adopt this high-end X30 chip."
- 1 Mar 2017:Despite a turbulent past, Windows PCs with ARM are making a grand return later this year, but only with Qualcomm chips. Another big ARM chipmaker, MediaTek, is sitting out the opportunity to put its ARM-based chips in Windows PCs because the company sees it as a limited opportunity.
- Lattice Semiconductor has moved a step closer to being acquired by an investment firm backed by China's central government, announcing Tuesday (Feb. 28) that its shareholders have approved the terms of the $1.3 billion deal.
- Nexperia has been officially launched as an independent supplier of discrete, logic, and MOSFET devices.
- Xiaomi has managed to secure itself a decent shipment of Snapdragon 835 chipsets for use in the company's upcoming high-end smartphone, Mi6.
- 28 Feb 2017:Intel split the Cyclone 10 into the performance-oriented GX and low-power optimized LP series. The GX series uses TSMC's 20nm process and is geared for a number of uses in the industrial, automotive, and broadcast markets. These include machine vision, robotics, infotainment, Advanced Driver Assistance Systems, and audiovisual applications.
- Despite the rumors that Samsung was hogging all the Snapdragon 835s for itself, Sony has brought a device with Qualcomm's top-of-the-line 2017 SoC to MWC.
- According to industry sources, SK Hynix is planning to triple its investment in foundry business this year. To this end, SK Hynix recently organized a task force at its M8 foundry plant located in Cheongju, North Chungcheong Province.
- 23 Feb 2017:Samsung will sell modified versions of the Galaxy Note 7 in emerging markets, including India and Vietnam, according to Hankyung, which claims the move is designed to help Samsung minimise losses and avoid a potential environmental fine.
- Intel's modems aren't as good as Qualcomm's, but the company scored a major victory last year when some of its modems began shipping in some models of Apple's iPhone 7.
- Beijing's Tsinghua Unigroup seeks 2018 IPO for chip unit: sources (Feb 23) - Nikkei Electronics AsiaChina's state-backed Tsinghua Unigroup is pushing for an initial public offering of its mobile chip unit, Unigroup Spreadtrum RDA, in 2018, sources told Nikkei Asian Review.
- Most of the hand-wringing over the fate of Moore's Law focuses on the ever-shrinking silicon transistor. But increasingly researchers are concerned with another critical part of the infrastructure: the copper wires that connect individual transistors to form complex circuits.
- 22 Feb 2017:How will this affect Samsung's businesses? For the time being, they seem to flourish or flounder no matter who the company's titular leader is.
- Toshiba wants to pick the preferred bidder or bidders for a majority stake in its chip unit by the end of May and will hold the first round of bids next month, a source with knowledge of the plan said.
- Toshiba has asked potential bidders for its memory chip business to peg the operations' value at JPY2 trillion (US$17.6 billion) or more, aiming to maximize income from the sale of its crown jewel.
- 21 Feb 2017:Toshiba is looking to raise at least JPY1 trillion (US$8.8 billion) from the sale of its memory chip business and will aim to complete the transaction by March 2018, according to a person familiar with the matter.
- 20 Feb 2017:Despite the calamities surrounding Samsung's heir apparent Lee Jae-Yong right now, the shareholders of Harman International have voted to approve the company's merger with Samsung Electronics.
- 18 Feb 2017:Samsung hopes to avoid another disastrous recall by adding a third battery supplier for its new smartphone.
- Apple has teamed up with Broadcom to build wireless charging for iPhone, says JPMorgan analyst (Feb 17) - CNBCAn upcoming Apple iPhone is likely to have a customized wireless charging system made with Broadcom, according to JPMorgan analyst Harlan Sur.
- Infineon does not expect to be able to salvage its $850 million purchase of Cree's Wolfspeed Power, which is under US scrutiny over unspecified government security concerns, the German chipmaker said on Thursday.
- TetraVue raises $10 million from Samsung, Foxconn, others to give autonomous cars better eyesight (Feb 17) - VenturebeatTetraVue, a company setting out to arm autonomous cars with ultra high-resolution 3D image-capturing smarts, announced it has raised $10 million from Robert Bosch Venture Capital, Nautilus Venture Partners, Samsung Catalyst Fund, and Foxconn.
- Apple will in the coming months start assembling its lower-priced iPhone SE models at a contract manufacturer's plant in the southern Indian technology hub of Bengaluru, an industry source with direct knowledge of the matter said on Friday.
- 17 Feb 2017:Apple's widely expected 5.8-inch iPhone with an edge-to-edge OLED display will feature a front-facing 3D laser scanner for facial recognition, corroborating previous rumors, according to JPMorgan analyst Rod Hall.
- 16 Feb 2017:For what Intel's data center chief Diane Bryant called the upcoming "10nm+" node, as well as the 7nm manufacturing node to follow, Intel's data center chips will be first on those lines.
- Toshiba may delay the sale of its prized flash-memory chip unit after the conglomerate said it would consider selling most, even all, of the marquee business, a person with direct knowledge of the matter said.
- Micron no longer expects DRAM prices to increase in H2 of this year and 2018.
- 15 Feb 2017:This amended complaint also expands the accused products to include the Apple iPhone 7 and iPhone 7 Plus which use Intel's PMB5750 transceiver chip, which is based on Intel's SMARTi architecture.
- Apple patents screen tech capable of reading fingerprints without dedicated sensor (Feb 14) - Apple InsiderAn Apple patent grant on Tuesday suggests the company is looking to leverage its LuxVue acquisition to integrate display technology capable of reading a user's fingerprint without a dedicated sensor, a design feature rumored to see release with "iPhone 8."
- Intel's Atom C2000 processor family has a fault that effectively bricks devices, costing the company a significant amount of money to correct. But the semiconductor giant won't disclose precisely how many chips are affected nor which products are at risk.
- New chip from MIT could mean power-efficient AI in all your electronics (Feb 14) - Andorid AuthorityResearchers at MIT have developed a low-power chip specialized for automatic speech recognition that could result in a power savings of up to 99%.
- Apple is in discussions with China's BOE Technology to supply next-generation displays for future iPhones, a key component that's being provided by a Samsung Electronics unit, people familiar with the matter said.
- 14 Feb 2017:After a day of delays and confusion, Japan's Toshiba said on Tuesday it expected to book a $6.3 billion hit to its US nuclear unit, a writedown that wipes out its shareholder equity and will drag the group to a full-year loss.
- Toshiba has delayed its earnings announcement, planned for Tuesday, after it was not able to immediately secure the approval of its auditor, a source briefed on the matter said.
- Sony has announced the development of the industry's first 3-layer stacked CMOS image sensor with DRAM for smartphones.
- Advantest VOICE 2017 U.S. and China keynote speakers announced
- UMC and Synopsys collaboration speeds 14-nm custom design
- UMC Enters Mass Production for 14nm Customer ICs
- Entegris announces higher-purity gas purification system platform with expanded manufacturing in Asia
- Spirox resolved to propose termination of exclusive distributor agreement with Xcerra Corporation
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Wins Develop Industry Excellence Award for the Second Year in a Row
- Perforce Teams with Leading Git Client Developer fournova
- Perforce Introduces Helix GitSwarm: Flexible Git Ecosystem Mirrored to a Powerful Mainline Repository
- Perforce Helix Distributed Version Control System Brings Greater Flexibility While Maintaining Enterprise-class Security, Auditability and Control
- Perforce Powers Development of Legacy Quest for iOS and Android
- Mentor Graphics Veloce VirtuaLAB adds protocols for networking designs
- Mouser Electronics undergoing expansion
- Digitimes Research: Shrinking tablet market prompts China touch panel supply chain to look for growth elsewhere
- Digitimes Research: Tsinghua Unigroup acquisition of Micron faces difficulties, but is a must for China for further development
- Digitimes Research: Qualcomm to push inexpensive mobile device market with Microsoft and Allwinner solutions
TSMC and Samsung have been competing for clients for the 10nm node.
DRAM prices have been rising amid tight supply.
A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) has yet to receive approval from the US...
Earthquakes in Japan often cause huge damage. They have had strong impacts on the country's electronics industry.
Qualcomm agreed in late 2016 to buy NXP Semiconductor for about US$47 billion in the biggest-ever deal...
With 2015 being the 50th anniversary of Moore's Law, one of the hottest topics that has continued to...
Gary Patton, a 30-year veteran in the semiconductor industry, joined Globalfoundries as CTO in July...
Qualcomm president Derek Aberle spared his time with Digitimes for an exclusive interview...
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