- 2 Jun 2015:Rohm has moved to acquire a 200mm wafer fab from Renesas Electronics for JPY450 million (US$3.7 million).
- A new low-power, high-speed memory technology on the horizon could replace solid-state drives, hard drives and DRAM in PCs, and bring higher levels of storage capacity to mobile devices and wearables.
- But company officials and market experts say if the two raise their production capacity, the long-term supply growth will remain constrained due to technological complexity.
- Altera has been a key customer at TSMC for years, especially at the advanced tech node, accounting for around 3% of TSMC's revenue at 20/28 nodes.
- The Helio P10 is built using TSMC's 28nm HPC+ process.
- 28 May 2015:Daimler and Qualcomm announce strategic collaboration on connected car technologies (May 24) - Company releaseIn the first phase of the collaboration, the companies will focus on transforming future vehicles with mobile technologies that enhance in-car experiences and vehicle performance such as 3G/4G connectivity, wireless charging technology for in-vehicle use and implementation of the Qualcomm Halo Wireless Electric Vehicle Charging (WEVC) technology.
- Chip maker Avago Technologies is in advanced talks to buy rival Broadcom in a deal worth about US$35 billion, the latest in a wave of takeovers for the companies that supply parts to power smartphones, tablets and other gadgets.
- 27 May 2015:NVIDIA reiterates for the second time in three months that TSMC is their primary manufacturing partner as they head towards 16nm, and even 10nm production.
- China's Spreadtrum Communications will use Intel's 14nm FinFET process technology for both the low- and high-end mobile chips the company plans to launch in 2016, according to Spreadtrum chairman and CEO Leo Li.
- 26 May 2015:The next-generation iPhone will reportedly sport a camera with a 12-megapixel Sony sensor that makes use of the firm's RGBW technology to help with low-light photography.
- 25 May 2015:Globalfoundries offers new low-power 28nm solution for high-performance mobile and IoT applications (May 20) - Company releaseGlobalfoundries has announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices.
- Samsung was shy on specs, but said the process node will be in full production by the end of 2016, about the same time as its rival TSMC.
- 21 May 2015:Huawei and Qualcomm jointly complete CAT11-based 3CC CA+256QAM test, reaching 600 Mbit/s rate - Company releaseHuawei and Qualcomm Technologies, a subsidiary of Qualcomm, have jointly announced the completion of tests using LTE CAT11 terminals.
- 20 May 2015:The US has charged six Chinese nationals over the alleged theft of technology used in mobile phones. The six, including three university professors, are accused of using the technology to benefit universities and companies controlled by Beijing.
- 19 May 2015:A new leaked roadmap slide purportedly showing Intel's plans through to the end of 2016 has been published by a Finnish computer technology website. If the slide is genuine we will likely see Intel release its first 10nm Cannonlake CPUs sometime around the second and third quarters of next year.
- As Apple basks in the unprecedented demand for its latest iPhones, suppliers from Tokyo to Taipei are sharing in the spoils.
- Xiaomi wants its own custom-designed processors to differentiate its products and control its destiny, an executive of Leadcore Technology told EE Times.
- 18 May 2015:Fujitsu and Intel have reached an agreement to combine Fujitsu Laboratories' distributed service platform technology with the Intel IoT Gateway to build out comprehensive IoT solutions.
- The recent earnings season turned out to be largely good news for the companies that make semiconductor manufacturing gear. But investors haven't quite come around yet.
- Silicon Storage Technology and Globalfoundries announce qualification of auto grade 55nm embedded flash memory technology (May 5) - Company releaseMicrochip Technology through its Silicon Storage Technology (SST) subsidiary and Globalfoundries have announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on Globalfoundries' 55nm Low Power Extended (LPx)/ RF enabled platform.
- 15 May 2015:With the adoption rate of the ARM mbed IoT Device Platform increasing rapidly, the company has announced a new assurance standard, the ARM mbed Enabled program.
- Avago Technologies, looking to acquire a fellow chipmaker, has reached out to potential targets including Xilinx, Renesas Electronics and Maxim Integrated Products, according to people familiar with the matter.
- 13 May 2015:Samsung on Tuesday revealed a new chip family to power the Internet of Things, putting it in more direct competition with Intel, Qualcomm and others in the quest to connect everything.
- The world's most expensive semiconductor fabrication plant - at over US$14 billion - was announced at the ground breaking ceremony Thursday (May 7) by Samsung. Located in the Godeok Industrial Complex at Pyeongtaek City Gyeonggi-do Province - called "Samsung Semiconductor Valley" - in South Korea, Samsung will be building 10-nanometer FinFET semiconductors there.
- 12 May 2015:Recently Mediatek came up with Helio X which is going to be a premium lineup from MediaTek where they will be competing with processors from Qualcomm & Exynos. With the debut of Helio X20 which is the first deca-core processor, Qualcomm and Exynos might have got to think about the number count which Mediatek is rushing with. But now it looks Qualcomm is also working with the same strategy and is running with the same.
- 7 May 2015:eMemory Technology's One-Time Programmable (OTP) NeoFuse technology has been successfully verified in 16nm FinFET process, with full silicon IP development and customer application deployment expected to be completed by the end of 2015.
- Foxconn's Terry Guo says he lobbied Apple to choose TSMC over Samsung for 'A9' (April 28) - Apple InsiderFoxconn boss Terry Guo said he pushed Apple to choose TSMC because Taiwanese companies must stick together against the "Korean Wave."
- 4 May 2015:The Samsung Galaxy S6 and S6 Edge have recently been plagued by serious memory problems, as poor memory management is leading to massive slowdowns and random app crashes, including force closes.
- 29 Apr 2015:Qualcomm has announced that its subsidiary, Qualcomm Technologies, is powering LG's latest flagship smartphone, the LG G4. The new smartphone is the first to feature the Qualcomm Snapdragon 808 processor with X10 LTE.
- 28 Apr 2015:ASML reaches agreement for delivery of minimum of 15 EUV lithography systems (April 22) - Company releaseASML has signed an agreement with one of its major US customers to deliver a minimum of 15 ASML EUV lithography systems to support increased development activity and pilot production of future-generation manufacturing processes.
- Cramer said competitors like Intel, Samsung, Qualcomm, ARM and Nvidia will fight the deal in Washington because it has the potential to crunch their gross margins by bringing up costs. He also pointed out that Washington has been relatively unfriendly to larger mergers this year.
- Samsung Electronics has inked an agreement to produce its 3D NAND solid state drives for Google, in a deal deemed to beef up the South Korean manufacturer's gameplay against its global competitors.
- 24 Apr 2015:Qualcomm's second-quarter profit dropped 46%, mainly because of a large fine the company had to pay in China for settling antitrust issues. The company also cut its revenue outlook for 2015, citing loss of business for its Snapdragon processor from key customer Samsung Electronics and a concentration of the premium market around two players - Apple and Samsung, among other factors.
- Samsung Electronics is set to spend at least another 10 trillion won (US$9.2 billion) to boost capacity at a new South Korean chip plant, a 64% increase over announced investment plans, domestic online news service MoneyToday reported.
- 23 Apr 2015:Texas Instruments has forecast current-quarter revenue below analysts' expectations, citing weak demand for its chips from communication equipment and consumer electronics markets and a strong dollar.
- Xilinx has reported that revenue fell 8.2%, missing expectations for the quarter ended in March and the chip maker's sales guidance for the current period missed analysts' estimates.
- Broadcom has reported solid results for the first quarter of 2015, with revenue driven by high-end smartphone and broadband access markets.
- Intel will adopt quantum well FETs (QWFETs) at the 10nm node (most likely), which will probably go into production in late 2015 or early 2016 (alternatively at 7nm in 2017 or 2018).
- 20 Apr 2015:Cavendish Kinetics adopts STATS ChipPAC's wafer level technology for its SmarTune RF MEMS tuners (April 7) - Company releaseSTATS ChipPAC has announced that Cavendish Kinetics, a provider of RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technology to deliver Cavendish's SmarTune RF MEMS tuners in the smallest possible form factor, as a 2mm2 chip scale package.
- 16 Apr 2015:China's biggest chipmaker's possible tie-up with HP values unit at up to US$5 billion (April 15) - Wall Street JournalTsinghua Unigroup is in talks to buy a controlling stake in Hewlett-Packard's China data-networking operations. Discussions are still taking place over the 51% stake in HP subsidiary, H3C Technologies.
- Digitimes Research: Intel 28nm SoFIA 4G AP delayed to early 2016; may face overlap issue with 14nm version
- Digitimes Research: Korea-based LCD driver IC companies revenues fall for second straight year
- Digitimes Research: Avago ready for competitive IoT field with acquisition of Broadcom
- Digitimes Research: South Korea memory-IC industry output value rises 31% in 1Q15
- Indium Corporation's patented BiAgX: A drop-in replacement for high-Pb solders
- NANIUM enables WLCSP without UBM
- Shaping the future of SoCs: Interview with Socionext CEO Yasuo Nishiguchi
- A leading Taiwan IC fabless crafts versatile RF technology: Interview with Peter Chen, product marketing manager of AMICCOM
- Indium Corporation receives SMT China Vision Award
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Perforce Software Introduces Perforce Swarm
- Perforce Unveils Git Fusion, Improving Git Experience
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Digitimes Research: Intel 28nm SoFIA 4G AP delayed to early 2016; may face overlap issue with 14nm version
- Is Japan losing its influence in global semiconductor market?, asks IC Insights
- Digitimes Research: Samsung to adopt MediaTek APs for smartphones
- Digitimes Research: Smartphone AP suppliers looking to offload inventory to tablet market
- Digitimes Research: Intel simplifies Atom product lines for mobile devices
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