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News tagged semiconductor equipment
  • Last update: Monday 27 April 2015 [318 news items]

SEMI book-to-bill ratio slips to 0.80 in August

Sep 16, 16:06

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...

450mm and EUV linked with uncertainty, says SEMI

Sep 9, 11:14

The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...

Chip equipment billings up 31% in 2Q11, says SEMI

Sep 7, 14:47

Worldwide semiconductor manufacturing equipment billings reached US$11.92 billion in the second quarter of 2011, according to SEMI. The billings figure is 1% lower than that in the...

IC testing capacity utilization drops to 50-60%, says KYEC president

Sep 7, 14:03

The semiconductor industry is working through excessive inventory coupled with unusual slowness in the third quarter of 2011, which has caused the average capacity utilization rate...

KYEC president and CEO Mike Liang

Intel investment reduction plans may affect PC and semiconductor players

Sep 1, 01:15

Intel, facing weak PC performance, reportedly is considering to temporarily halt its plans to upgrade to a 22nm process at Fab 24, and has decided to delay the launch of its next-generation...

Semiconductor output on 12-inch wafers to nearly double by 2015, says IHS

Aug 24, 09:42

Semiconductor manufacturing using 12-inch wafers will see production nearly double from 2010 to 2015 as chip producers increasingly employ them for older, more mature products, according...

Chip equipment book-to-bill lower in July 2011

Aug 19, 10:30

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...

Secondary equipment vendors expecting another good year, says Semico

Jul 21, 16:28

The market for secondary equipment grew 77% to US$6 billion in 2010, according to Semico Research. The research firm expects the size of the market to grow even bigger in 2011.

Equipment supplier TKK expects sales to rebound in 2H11

Jul 21, 01:20

Semiconductor equipment distributor Taiwan Kong King (TKK) has said that its sales performance during the first half of 2011 should have hit bottom, and the company expects a rebound...

North America chip-gear orders slip in June, says SEMI

Jul 21, 01:00

North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

SMT equipment to buoy revenues for Laser Tek

Jul 18, 12:13

Taiwan-based Laser Tek is expected to enjoy revenue growth of about 40% sequentially in the third quarter of 2011, buoyed by strong shipments of surface-mount-technology (SMT) inspection...

Chip equipment sales to grow 12% in 2011, says SEMI

Jul 12, 13:56

Worldwide sales of semiconductor manufacturing equipment will reach US$44.33 billion in 2011, representing growth of 12.1% on year, according to SEMI's mid-year forecast.

Laser Tek June sales up 60%

Jul 8, 01:30

Laser Tek, a supplier of surface-mount-device (SMD) packaging materials and semiconductor equipment, has reported NT$325 million (US$11.3 million) in consolidated revenues for June...

CMP slurry set to grow 15% in 2011, says Information Network

Jun 29, 10:43

With a slowdown in IC sales not expected until the third quarter of 2012, demand for slurries to planarize IC surfaces will grow 15% in 2011 on top of a 36% growth in 2010, according...

Japan May chip-gear orders up 4% on-month, says SEAJ

Jun 24, 13:49

Japan-based manufacturers of semiconductor equipment posted JPY119.15 billion (US$1.48 billion) in orders in May 2011 (three-month average basis), up 4.4% from the revised level of...

TSMC, UMC likely to lower capex budgets for 2011, says paper

Newswatch - Jun 22, 13:45

Taiwan's two foundry giants are likely to revise downward their capex goals for 2011 due to worries that orders in the second half of the year may not be large enough to fill their...

SEMI book-to-bill ratio slips to 0.97 in May

Jun 17, 16:07

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for May 2011, down from 0.98 in April, according to new figures from SEMI.

Semiconductor equipment spending to grow 10% in 2011, says Gartner

Jun 16, 14:08

Worldwide semiconductor capital equipment spending is on track to reach US$44.8 billion in 2011, a 10.2% increase from 2010 spending of US$40.6 billion, according to Gartner. However,...

Chip equipment billings up 61% in 1Q11, says SEMI

Jun 15, 16:12

SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$12 billion in the first quarter of 2011. The billings figure is 1% higher than that in the...

North America chip gear book-to-bill up in April

May 20, 11:05

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.98 for April 2011, up from 0.95 in March, according to new figures from SEMI.

ASML to ship 10 EUV tools in 2012

May 16, 11:40

ASML has received 10 orders for its next-generation ultraviolet (EUV) lithography system – the NXE:3300 – with deliveries starting in 2012, according to the Dutch fab...

Packaging material supplier Chang Wah sees growth in 2Q11 sales

May 9, 16:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects sales to grow sequentially in the second quarter...

Big to grow bigger in fab tool market, says The Information Network

May 5, 13:42

Applied Materials' planned acquisition of Varian Semiconductor will strengthen its dominance of the global semiconductor equipment market, according to The Information Network.

Semiconductor metrology/inspection equipment continues to underperform overall market, says Information Network

Apr 28, 16:31

The market for semiconductor metrology/inspection equipment grew 98% in 2010 while overall semiconductor front-end wafer processing equipment rose 143%, according to The Information...

SEMI book-to-bill ratio rises to 0.95 in March

Apr 22, 10:45

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for March 2011, up from 0.87 in February, according to new figures from SEMI.

Intel names preferred quality supplier award winners for 2010

Apr 20, 11:21

Intel has announced 16 recipients of the Preferred Quality Supplier (PQS) award, which is part of a company program that encourages suppliers to strive for excellence and continuous...

2011 finally the year of low-k deployment, says Information Network

Apr 19, 14:40

The recent announcement by Intel and Micron Technology of a new 20nm process technology for manufacturing NAND flash memory could signal the end of the low-k hiatus, according to...

Secondary equipment market reaches US$6 billion in 2010, say SEMI and Semico

Apr 14, 16:41

Secondary market equipment sales reached US$6 billion in 2010, a 77% increase over 2009, according to a joint research study conducted by SEMI and Semico Research.

Equipment supplier Csun says orders brisk

Apr 13, 15:21

Csun Manufacturing, which mainly makes equipment used in the production of PCBs and LCD panels, has seen its capacity fully loaded for the first half of 2011. The company is also...

Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ

Mar 24, 01:00

Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...

SEMI book-to-bill ratio stays below parity in February 2011

Mar 18, 15:49

North America-based manufacturers of semiconductor equipment posted US$1.58 billion in orders in February 2011 (three-month average basis) and a book-to-bill ratio of 0.87, according...

TSMC reiterates 2011 sales growth target

Mar 17, 01:00

Taiwan Semiconductor Manufacturing Company's (TSMC) target of 20% growth in 2011 sales remains unchanged, chairman and CEO Morris Chang said on March 16. TSMC expects no material...

Chip equipment sales reach record growth in 2010, says SEMI

Mar 11, 14:21

Worldwide sales of semiconductor manufacturing equipment totaled US$39.54 billion in 2010, representing a record year-over-year increase of 148%, according to SEMI.

SEMI book-to-bill ratio slips again

Feb 23, 14:48

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January 2011, compared to 0.90 in December 2010 and 0.97 in November, according...

318 items [5/10]
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  • KLA%2DTencor+VisEdge+CV300R%2DEP

    KLA-Tencor VisEdge CV300R-EP

    KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection and metrology systems. The VisEdge CV300R-EP introduces two edge-metrology capabilities...

    Photo: Company, Sep 1.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Applied+Reflexion+GT

    Applied Reflexion GT

    Applied Materials has launched its Applied Reflexion GT system for advanced metal CMP applications. Key to the new system is its dual-mode architecture, enabling two wafers to be...

    Photo: Company, Dec 4.

2015 China IC design market forecast
Wireless broadband developments in Southeast Asia markets

27-Apr-2015 markets closed

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