Taipei, Wednesday, April 16, 2014 20:18 (GMT+8)
mostly cloudy
News tagged semiconductor equipment
  • Last update: Wednesday 19 March 2014 [297 news items]

ASML to ship 10 EUV tools in 2012

May 16, 11:40

ASML has received 10 orders for its next-generation ultraviolet (EUV) lithography system – the NXE:3300 – with deliveries starting in 2012, according to the Dutch fab...

Packaging material supplier Chang Wah sees growth in 2Q11 sales

May 9, 16:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects sales to grow sequentially in the second quarter...

Big to grow bigger in fab tool market, says The Information Network

May 5, 13:42

Applied Materials' planned acquisition of Varian Semiconductor will strengthen its dominance of the global semiconductor equipment market, according to The Information Network.

Semiconductor metrology/inspection equipment continues to underperform overall market, says Information Network

Apr 28, 16:31

The market for semiconductor metrology/inspection equipment grew 98% in 2010 while overall semiconductor front-end wafer processing equipment rose 143%, according to The Information...

SEMI book-to-bill ratio rises to 0.95 in March

Apr 22, 10:45

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for March 2011, up from 0.87 in February, according to new figures from SEMI.

Intel names preferred quality supplier award winners for 2010

Apr 20, 11:21

Intel has announced 16 recipients of the Preferred Quality Supplier (PQS) award, which is part of a company program that encourages suppliers to strive for excellence and continuous...

2011 finally the year of low-k deployment, says Information Network

Apr 19, 14:40

The recent announcement by Intel and Micron Technology of a new 20nm process technology for manufacturing NAND flash memory could signal the end of the low-k hiatus, according to...

Secondary equipment market reaches US$6 billion in 2010, say SEMI and Semico

Apr 14, 16:41

Secondary market equipment sales reached US$6 billion in 2010, a 77% increase over 2009, according to a joint research study conducted by SEMI and Semico Research.

Equipment supplier Csun says orders brisk

Apr 13, 15:21

Csun Manufacturing, which mainly makes equipment used in the production of PCBs and LCD panels, has seen its capacity fully loaded for the first half of 2011. The company is also...

Japan fab-tool book-to-bill back above parity in February 2011, says SEAJ

Mar 24, 01:00

Japan-based manufacturers of semiconductor equipment posted JPY105.79 billion (US$1.31 billion) in orders in February 2011 (three-month average basis) and a book-to-bill ratio of...

SEMI book-to-bill ratio stays below parity in February 2011

Mar 18, 15:49

North America-based manufacturers of semiconductor equipment posted US$1.58 billion in orders in February 2011 (three-month average basis) and a book-to-bill ratio of 0.87, according...

TSMC reiterates 2011 sales growth target

Mar 17, 01:00

Taiwan Semiconductor Manufacturing Company's (TSMC) target of 20% growth in 2011 sales remains unchanged, chairman and CEO Morris Chang said on March 16. TSMC expects no material...

Chip equipment sales reach record growth in 2010, says SEMI

Mar 11, 14:21

Worldwide sales of semiconductor manufacturing equipment totaled US$39.54 billion in 2010, representing a record year-over-year increase of 148%, according to SEMI.

SEMI book-to-bill ratio slips again

Feb 23, 14:48

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January 2011, compared to 0.90 in December 2010 and 0.97 in November, according...

Japan fab tool book-to-bill slips below parity in January 2011

Feb 18, 15:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.99 in January 2011, down from 1.07 in December and the lowest since May 2009, according to the...

SEMI, SEAJ book-to-bill ratios slip in December 2010

Jan 21, 14:06

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.90 in December, down from 0.97 in November, according to SEMI. Meanwhile, data gathered...

Equipment maker GPTC debuts on Taiwan OTC market

Jan 17, 11:33

Grand Plastic Technology (GPTC), which makes semiconductor equipment, debuted on Taiwan's OTC (over-the-counter) stock market at an initial price of NT$62 (US$2.14) per share today...

Laser Tek reportedly to buy SMT equipment provider

Jan 4, 11:15

Market sources have speculated that Taiwan's Laser Tek will soon announce plans to acquire a small- to medium-sized company specializing in surface-mount-technology (SMT) equipment,...

TSMC spends more than NT$30 billion on fab gear in December

Stockwatch - Dec 31, 14:08

Taiwan Semiconductor Manufacturing Company (TSMC) has spent more than NT$30 billion (US$1.03 billion) on equipment procurement, cleanroom facilities and factory building construction...

Spirox says distribution deal with Accretech to end

Dec 24, 11:46

Spirox has announced that the company will discontinue distributing products from Accretech Tokyo Seimitsu, a Japan-based supplier of chip-manufacturing equipment and measuring tools...

North America fab tool book-to-bill slips to 0.96 in November 2010, says SEMI

Dec 17, 16:11

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2010 compared to 0.98 in October and 1.06 a year ago, according to SEMI...

Chip equipment spending to slip 1% in 2011, says Gartner

Dec 16, 16:27

Worldwide semiconductor capital equipment spending is on pace to reach US$38.4 billion in 2010, a 131.2% jump from 2009, according to Gartner. In 2011, spending is forecast to total...

Chip gear billings and bookings rise in 3Q10, says SEMI

Dec 15, 16:21

Chip manufacturing equipment billings and bookings worldwide enjoyed both sequential and on-year growth in the third quarter of 2010, according to SEMI.

Cleanroom constructor UIS seeing orders extend to June 2011, says paper

Stockwatch - Dec 3, 12:05

United Information Systems (UIS) has seen its backlog of cleanroom and equipment orders reach close to NT$8 billion (US$264 million), with visibility on orders clear through June...

Applied rolls out new etcher for advanced memory and logic production

Dec 1, 12:10

Applied Materials has launched a silicon etch system - the Centris AdvantEdge Mesa Etch - for the high-throughput production of advanced memory and logic chips.

Chip equipment sales to reach US$37.5 billion in 2010, says SEMI

Nov 30, 15:28

Worldwide semiconductor equipment sales are set to reach US$37.54 billion in 2010, a 136% jump from US$15.92 billion in 2009, according to SEMI. It previously estimated a 104% rise...

Japan chip gear book-to-bill continues to slide on-month

Nov 22, 13:41

The book-to-bill ratio for Japan-based semiconductor equipment manufacturers slipped to 1.12 in October 2010 from 1.14 in the prior month, according to the Semiconductor Equipment...

SEMI book-to-bill ratio drops below parity in October 2010

Nov 19, 16:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.98 in October 2010 from 1.03 in the prior month.

IC capacity utilization drops to 95.2% in 3Q10, SICAS figures show

Nov 19, 12:15

Global IC industry capacity utilization dropped to 95.2% in the third quarter of 2010 from 95.6% in the second, according to the latest data from Semiconductor Industry Capacity Statistics...

Verigy, LTX-Credence to merge

Nov 19, 01:00

Verigy and LTX-Credence on November 18 announced that they have entered into a definitive merger agreement. The combined company, to be called Verigy, will feature a portfolio of...

Chip equipment bubble bursts, says Information Network

Oct 26, 11:27

SEMI's dismal book-to-bill points to imminent pushouts in the semiconductor equipment market, The Information Network pointed out in its recent report.

SEMI book-to-bill ratio drops to 1.03 in September 2010

Oct 22, 14:07

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 1.03 in September 2010, compared to 1.17 in August and 1.23 in July.

Japan September 2010 fab tool book-to-bill slips to 1.14, says SEAJ

Oct 21, 14:35

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.14 in September 2010, down from 1.38 in August, according to new figures from the Semiconductor...

Chip equipment makers conservative over 2011 business outlook

Sep 29, 14:37

Most semiconductor equipment makers are conservative about the business outlook for 2011 as wafer foundry houses have not yet set capex budgets for the coming year after they substantially...

TSMC spends almost US$1.7 billion so far in 3Q10

Stockwatch - Sep 24, 12:30

For the third quarter of 2010, Taiwan Semiconductor Manufacturing Company (TSMC) has so far disclosed to the Taiwan Stock Exchange (TSE) 47 items of spending on production equipment...

297 items [5/9]
Realtime news
  • Taiwan solar cell makers see surging orders from China

    Green energy | 1min ago

  • China white-box tablet vendors gaining foothold

    Before Going to Press | 20min ago

  • China market: Local smartphone vendors accelerating LTE launches

    Before Going to Press | 21min ago

  • O-Film expected to produce for 35% of handset touch panels in 2014

    Before Going to Press | 1h 40min ago

View more
  • KLA%2DTencor+VisEdge+CV300R%2DEP

    KLA-Tencor VisEdge CV300R-EP

    KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection and metrology systems. The VisEdge CV300R-EP introduces two edge-metrology capabilities...

    Photo: Company, Sep 1.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Applied+Reflexion+GT

    Applied Reflexion GT

    Applied Materials has launched its Applied Reflexion GT system for advanced metal CMP applications. Key to the new system is its dual-mode architecture, enabling two wafers to be...

    Photo: Company, Dec 4.

Global tablet tracker
China touch tracker

16-Apr-2014 markets closed


TAIEX (TSE)8923.82+7.11+0.08% 

TSE electronic340.02+0.12+0.04% 

GTSM (OTC)144.01+0.41+0.29% 

OTC electronic179.21+0.17+0.09% 

2014 global notebook demand forecast
  • China flat panel display industry outlook, 2013-2016

    This Digitimes Research Special Report outlines and analyzes the key trends and players that are influencing the continued development of China large-size and small-to medium size TFT LCD panel industry, while providing related growth forecasts for the industry through 2016.

  • TD-LTE market developments and forecast, 2014-2016

    TD-LTE has become the mainstream global choice for the construction of 4G asymmetric frequency spectrum networks. This Digitimes Research Special Report examines the current global status of TD-LTE, and forecasts developments in the TD-LTE supply chain in China and worldwide through 2016.