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News tagged semiconductor equipment
  • Last update: Tuesday 16 December 2014 [307 news items]

Japan February 2012 chip-gear orders down 5.7%, says SEAJ

Mar 20, 14:28

Japan-based manufacturers of semiconductor equipment posted JPY99.8 billion (US$1.2 billion) in orders in February 2012 (three-month average basis), down 5.7% from a year earlier,...

ASML unseats Applied in semiconductor equipment ranking, says VLSI

Mar 16, 14:25

VLSI Research has released its 2011 top semiconductor equipment suppliers ranking. During the year, Advantest closed its acquisition of Verigy in July and Applied Materials acquired...

Fab equipment spending poised to hit record in 2013, says SEMI

Mar 12, 16:06

Semiconductor fab equipment spending will remain flat at US$38.85 billion in 2012, but climb to a record US$45.5 billion in 2013, according to estimates made by SEMI.

Topco sees February revenues up on month, down on year

Mar 9, 01:15

Topco Scientific, which distributes semiconductor materials and equipment, reported February revenues of NT$1.03 billion (US$35 million), up 7.49% on month but down 7.63% on year...

Topco

North America fab tool book-to-bill up in January 2012, says SEMI

Feb 24, 12:31

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...

Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ

Feb 20, 11:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...

KLA-Tencor shipping next-node wafer inspection tools

Feb 20, 10:55

Fab-tool vendor KLA-Tencor has announced the availability of its latest wafer defect inspection systems, and is shipping the products to its clients in the foundry, logic and memory...

SEMI book-to-bill ratio grows three months in a row

Jan 30, 10:25

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...

Japan fab tool book-to-bill nears 1.0, says SEAJ

Dec 20, 14:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

North America November chip-gear orders up 5%, says SEMI

Dec 16, 14:38

North America-based manufacturers of semiconductor equipment posted US$973.3 million in orders in November 2011 (three-month average basis), up 5% from the revised level of US$926.8...

Japan chip gear book-to-bill ratio rises in October, says SEAJ

Nov 21, 16:22

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...

North America October chip-gear orders up 1%, says SEMI

Nov 18, 14:51

North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...

Chip equipment makers conservative about 4Q11 business

Nov 15, 11:38

Taiwan-based semiconductor equipment suppliers generally hold a conservative business outlook for the fourth quarter of 2011, citing seasonal effects as well as macroeconomic uncertainties...

Applied Materials completes Varian takeover

Nov 14, 10:54

Applied Materials has completed its acquisition of Varian Semiconductor Equipment Associates. This takeover enhances Applied's portfolio with ion implantation technology, a market...

Laser Tek expects November, December revenues to fall

Nov 10, 16:14

Laser Tek, a supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment, expects to report on-month drops in revenues for November and December. Passive...

Topco sees 4Q11 sales decline

Nov 10, 13:49

Topco Scientific, which distributes semiconductor materials and equipment, as well as equipment and materials used in the production of LCD panels, LEDs and solar products, is cautious...

ACM Research reportedly lands equipment order from Samsung

Oct 31, 13:52

China's ACM Research has landed orders from Samsung Electronics to supply 12-inch, single-wafer megasonic cleaning tools, which would be installed as part of the chipmaker's advanced...

SEMI book-to-bill falls again in September

Oct 21, 15:12

North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.

Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ

Oct 20, 11:59

Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.

New ASML-IMEC deal demos move to EUV lithography

Oct 11, 10:33

IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...

ASML NXE:3100 for EUV litho at an IMEC cleanroom

IC capex to fall 19% in 2012, says Gartner

Oct 3, 11:55

Worldwide semiconductor capital equipment spending is expected to total US$35.2 billion in 2012, down 19.2% from the US$43.5 billion estimated for 2011, according to Gartner. Excess...

Japan fab-tool book-to-bill continues slide in August, says SEAJ

Sep 21, 15:48

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...

PCB equipment maker Chime Ball looking to strong sales in 4Q11

Sep 19, 11:45

Taiwan-based PCB manufacturing equipment maker Chime Ball Technology has revealed that its production capacity has been fully booked for the third quarter of 2011, and demand for...

SEMI book-to-bill ratio slips to 0.80 in August

Sep 16, 16:06

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...

450mm and EUV linked with uncertainty, says SEMI

Sep 9, 11:14

The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...

Chip equipment billings up 31% in 2Q11, says SEMI

Sep 7, 14:47

Worldwide semiconductor manufacturing equipment billings reached US$11.92 billion in the second quarter of 2011, according to SEMI. The billings figure is 1% lower than that in the...

IC testing capacity utilization drops to 50-60%, says KYEC president

Sep 7, 14:03

The semiconductor industry is working through excessive inventory coupled with unusual slowness in the third quarter of 2011, which has caused the average capacity utilization rate...

KYEC president and CEO Mike Liang

Intel investment reduction plans may affect PC and semiconductor players

Sep 1, 01:15

Intel, facing weak PC performance, reportedly is considering to temporarily halt its plans to upgrade to a 22nm process at Fab 24, and has decided to delay the launch of its next-generation...

Semiconductor output on 12-inch wafers to nearly double by 2015, says IHS

Aug 24, 09:42

Semiconductor manufacturing using 12-inch wafers will see production nearly double from 2010 to 2015 as chip producers increasingly employ them for older, more mature products, according...

Chip equipment book-to-bill lower in July 2011

Aug 19, 10:30

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...

Secondary equipment vendors expecting another good year, says Semico

Jul 21, 16:28

The market for secondary equipment grew 77% to US$6 billion in 2010, according to Semico Research. The research firm expects the size of the market to grow even bigger in 2011.

Equipment supplier TKK expects sales to rebound in 2H11

Jul 21, 01:20

Semiconductor equipment distributor Taiwan Kong King (TKK) has said that its sales performance during the first half of 2011 should have hit bottom, and the company expects a rebound...

North America chip-gear orders slip in June, says SEMI

Jul 21, 01:00

North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...

Strong growth for semiconductor equipment in advanced packaging market, says Information Network

Jul 20, 10:28

Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...

307 items [4/9]
  • KLA%2DTencor+VisEdge+CV300R%2DEP

    KLA-Tencor VisEdge CV300R-EP

    KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection and metrology systems. The VisEdge CV300R-EP introduces two edge-metrology capabilities...

    Photo: Company, Sep 1.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Applied+Reflexion+GT

    Applied Reflexion GT

    Applied Materials has launched its Applied Reflexion GT system for advanced metal CMP applications. Key to the new system is its dual-mode architecture, enabling two wafers to be...

    Photo: Company, Dec 4.

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Trends and forecasts for the China FPD industry, 2014-2017

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