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News tagged semiconductor equipment
  • Last update: Tuesday 14 April 2015 [317 news items]

3D IC to bring business opportunities for Taiwan semiconductor equipment makers

Jun 20, 01:05

3D IC is expected to afford business opportunities for Taiwan-based makers of semiconductor production equipment because processes and corresponding equipment for 3D ICs have not...

Chairman Hsu Chin-jung for Taiwan-based Hermes Microvision

Chip equipment billings down 9% in 1Q12, says SEMI

Jun 13, 16:55

SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$10.61 billion in the first quarter of 2012, down 9% from a year ago.

Fab tool supplier Gudeng posts 20% sales growth in May

Jun 11, 15:18

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, saw its May revenues increase about 20% sequentially...

Fab equipment spending to rise in 2012 and hit record in 2013, says SEMI

Jun 7, 11:26

Semiconductor fab equipment spending will enjoy positive growth in 2012, and climb further to hit an all-time high in 2013, according to SEMI.

North America fab tool book-to-bill slips in April 2012, says SEMI

May 23, 14:56

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.

Japan semiconductor equipment firms gain share in 2011, says The Information Network

Apr 25, 14:08

Japan-based semiconductor equipment suppliers gained share against US manufacturers in 2011 despite a weak Japanese Yen, The Information Network has observed.

SEMI book-to-bill rises for sixth straight month

Apr 23, 16:10

The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment rose to 1.13 in March 2012, up for the sixth consecutive month, according...

Chip inventories to decline slightly in 1Q12, says IHS

Mar 26, 10:24

Average semiconductor days of inventory (DOI) held by chip suppliers are expected to decline by 0.5% in the first quarter, after rising 3.4% and hitting an 11-year high in the fourth...

North America fab tool book-to-bill climbs above parity

Mar 26, 10:22

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.01 in February 2012, above parity for the first time in 17 months, according to figures...

IC manufacturing equipment spending to decline in 2012, says Gartner

Mar 22, 16:41

Worldwide semiconductor manufacturing equipment spending is projected to total US$38.9 billion in 2012, an 11.6% decline from 2011 spending of US$44 billion, according to Gartner.

Japan February 2012 chip-gear orders down 5.7%, says SEAJ

Mar 20, 14:28

Japan-based manufacturers of semiconductor equipment posted JPY99.8 billion (US$1.2 billion) in orders in February 2012 (three-month average basis), down 5.7% from a year earlier,...

ASML unseats Applied in semiconductor equipment ranking, says VLSI

Mar 16, 14:25

VLSI Research has released its 2011 top semiconductor equipment suppliers ranking. During the year, Advantest closed its acquisition of Verigy in July and Applied Materials acquired...

Fab equipment spending poised to hit record in 2013, says SEMI

Mar 12, 16:06

Semiconductor fab equipment spending will remain flat at US$38.85 billion in 2012, but climb to a record US$45.5 billion in 2013, according to estimates made by SEMI.

Topco sees February revenues up on month, down on year

Mar 9, 01:15

Topco Scientific, which distributes semiconductor materials and equipment, reported February revenues of NT$1.03 billion (US$35 million), up 7.49% on month but down 7.63% on year...

Topco

North America fab tool book-to-bill up in January 2012, says SEMI

Feb 24, 12:31

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...

Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ

Feb 20, 11:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...

KLA-Tencor shipping next-node wafer inspection tools

Feb 20, 10:55

Fab-tool vendor KLA-Tencor has announced the availability of its latest wafer defect inspection systems, and is shipping the products to its clients in the foundry, logic and memory...

SEMI book-to-bill ratio grows three months in a row

Jan 30, 10:25

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...

Japan fab tool book-to-bill nears 1.0, says SEAJ

Dec 20, 14:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

North America November chip-gear orders up 5%, says SEMI

Dec 16, 14:38

North America-based manufacturers of semiconductor equipment posted US$973.3 million in orders in November 2011 (three-month average basis), up 5% from the revised level of US$926.8...

Japan chip gear book-to-bill ratio rises in October, says SEAJ

Nov 21, 16:22

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.83 for October 2011, up from 0.75 in September, according to new figures from the Semiconductor...

North America October chip-gear orders up 1%, says SEMI

Nov 18, 14:51

North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...

Chip equipment makers conservative about 4Q11 business

Nov 15, 11:38

Taiwan-based semiconductor equipment suppliers generally hold a conservative business outlook for the fourth quarter of 2011, citing seasonal effects as well as macroeconomic uncertainties...

Applied Materials completes Varian takeover

Nov 14, 10:54

Applied Materials has completed its acquisition of Varian Semiconductor Equipment Associates. This takeover enhances Applied's portfolio with ion implantation technology, a market...

Laser Tek expects November, December revenues to fall

Nov 10, 16:14

Laser Tek, a supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment, expects to report on-month drops in revenues for November and December. Passive...

Topco sees 4Q11 sales decline

Nov 10, 13:49

Topco Scientific, which distributes semiconductor materials and equipment, as well as equipment and materials used in the production of LCD panels, LEDs and solar products, is cautious...

ACM Research reportedly lands equipment order from Samsung

Oct 31, 13:52

China's ACM Research has landed orders from Samsung Electronics to supply 12-inch, single-wafer megasonic cleaning tools, which would be installed as part of the chipmaker's advanced...

SEMI book-to-bill falls again in September

Oct 21, 15:12

North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.

Japan fab-tool book-to-bill slips to 0.75 in September, says SEAJ

Oct 20, 11:59

Japan-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September, declining for the third month in a row.

New ASML-IMEC deal demos move to EUV lithography

Oct 11, 10:33

IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...

ASML NXE:3100 for EUV litho at an IMEC cleanroom

IC capex to fall 19% in 2012, says Gartner

Oct 3, 11:55

Worldwide semiconductor capital equipment spending is expected to total US$35.2 billion in 2012, down 19.2% from the US$43.5 billion estimated for 2011, according to Gartner. Excess...

Japan fab-tool book-to-bill continues slide in August, says SEAJ

Sep 21, 15:48

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.76 in August 2011, compared to 0.84 in July and 0.96 in June, according to new figures from the...

PCB equipment maker Chime Ball looking to strong sales in 4Q11

Sep 19, 11:45

Taiwan-based PCB manufacturing equipment maker Chime Ball Technology has revealed that its production capacity has been fully booked for the third quarter of 2011, and demand for...

SEMI book-to-bill ratio slips to 0.80 in August

Sep 16, 16:06

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...

317 items [4/10]
  • KLA%2DTencor+VisEdge+CV300R%2DEP

    KLA-Tencor VisEdge CV300R-EP

    KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection and metrology systems. The VisEdge CV300R-EP introduces two edge-metrology capabilities...

    Photo: Company, Sep 1.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Applied+Reflexion+GT

    Applied Reflexion GT

    Applied Materials has launched its Applied Reflexion GT system for advanced metal CMP applications. Key to the new system is its dual-mode architecture, enabling two wafers to be...

    Photo: Company, Dec 4.

Taiwan server shipment forecast and industry analysis, 2015
2015 global tablet demand forecast

17-Apr-2015 markets closed

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2015 global notebook demand forecast
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