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News tagged semiconductor equipment
  • Last update: Friday 22 September 2017 [418 news items]

NA semiconductor equipment industry posts November book-to-bill ratio of 0.96, says SEMI

Dec 16, 15:41

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2016, compared with 0.91 in the prior month and 0.96 a year ago, according...

Wafer carrier orders to boost Gudeng revenues and profits in 2017, says report

Dec 16, 10:24

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, has obtained new wafer carrier orders from...

China to join top-3 semiconductor equipment spenders for first time, says SEMI

Dec 14, 21:46

Worldwide sales of new semiconductor manufacturing equipment are projected to increase 8.7% to US$39.7 billion in 2016, according to SEMI. In 2017, another 9.3% growth is expected,...

Global 3Q16 semiconductor equipment billings rise, says SEMI

Dec 6, 14:14

Worldwide semiconductor manufacturing equipment billings reached US$11 billion in the third quarter of 2016, according to SEMI. The billings figure was 5% higher than the prior quarter,...

HMI 3Q16 profits fall

Nov 2, 11:50

Taiwan-based Hermes Microvision (HMI), a provider of electron beam (e-beam) inspection tools and solutions, has reported net profits fell 93.7% sequentially to NT$34.09 million (US$1.08...

North American semiconductor equipment industry posts September book-to-bill ratio of 1.05

Oct 24, 11:18

North America-based semiconductor equipment manufacturers posted US$1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...

ASML on track to post record 2016 sales

Oct 21, 10:10

ASML remains on track to post record sales for 2016, according to the lithography equipment supplier, which reported higher-than-expected sales for the three months ending Septembe...

HMI to delist from TSE on November 22

Stockwatch - Oct 7, 15:59

Hermes Microvision (HMI) will be delisted from the Taiwan Stock Exchange (TSE) on November 22, the date when its acquisition by ASML becomes effective, according to the electron beam...

TSMC spends NT$6.43 billion on equipment

Stockwatch - Oct 6, 15:35

Taiwan Semiconductor Manufacturing Company (TSMC) has spent NT$6.43 billion (US$204.8 million) on manufacturing equipment and facilities from eight suppliers, according to filings...

Global 2Q16 semiconductor equipment billings increase 26%, says SEMI

Sep 14, 14:57

Worldwide semiconductor manufacturing equipment billings reached US$10.5 billion in the second quarter of 2016, according to SEMI. The billings figure was 26% higher than the prior...

Entegris optimistic about equipment demand from Taiwan foundries

Sep 13, 21:23

Taiwan-based IC foundries including TSMC and UMC will continue to build additional capacity and advance their technologies for a larger pie of the foundry space, which will further...

Bertrand Loy, CEO for Entegris

Equipment maker GPM enters technical partnership with SPP

Sep 12, 21:00

Taiwan-based Gallant Precision Machining (GPM), which mainly makes equipment for the manufacture of display panels and semiconductors, has announced the signing of a technical cooperation...

Fab equipment spending trending upwards in 2016 and 2017, says SEMI

Sep 7, 13:44

SEMI has published an August update of its world fab forecast report, which shows increased equipment spending, reaching 4.1% on-year in 2016 and 10.6% in 2017.

Calitech breaks into Intel supply chain

Sep 5, 16:05

Taiwan-based Calitech, which provides key parts for semiconductor front-end equipment, has cut into the supply chain of Intel by shipping CMP retainer rings to Applied Materials'...

TOK steps up investment in Taiwan

Aug 29, 21:02

Tokyo Ohka Kogyo (TOK) is looking to expand its investment in Taiwan, which will become the Japan-based vendor's production hub for the East Asia market, according to the manufacturer...

TSMC spends NT$4.86 billion on equipment

Stockwatch - Aug 18, 10:14

Taiwan Semiconductor Manufacturing Company (TSMC) spent a total of NT$4.86 billion (US$154.2 million) on machinery equipment, manufacturing tools and facilities from ASML, Brooks...

HMI shareholders OK acquisition by ASML

Aug 3, 16:12

Shareholders of Hermes Microvision (HMI) have approved the proposed acquisition of the company by ASML, according to the Taiwan-based fab toolmaker.

Gudeng lands wafer carrier orders from SMIC, says paper

Newswatch - Jul 22, 16:06

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, has obtained wafer carrier orders from China-based...

Fab tool book-to-bill slips

Jul 22, 14:41

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.00 in June, down from 1.09 in May, according to SEMI.

Chip equipment spending to stay flat in 2016, says SEMI

Jul 13, 14:17

The worldwide semiconductor equipment market will register about flat growth in 2016, but is expected to rebound in 2017, according to SEMI.

North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09, says SEMI

Jun 20, 11:38

The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the sixth consecutive month in May 2016, according to industry association SEM...

HMI shareholders approve 2015 dividend of NT$16

Jun 8, 14:03

Shareholders of Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, have approved the distribution...

Global 1Q16 semiconductor equipment billings fall 13%, says SEMI

Jun 7, 16:05

Worldwide semiconductor manufacturing equipment billings reached US$8.3 billion in the first quarter of 2016, according to SEMI. The billings figure is 3% higher than the prior quarter,...

North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15

Apr 25, 10:31

North America-based manufacturers of semiconductor equipment posted US$1.38 billion in orders worldwide in March 2016 (three-month average basis) and a book-to-bill ratio of 1.15,...

Global 2015 semiconductor wafer-level manufacturing equipment market drops 1%, says Gartner

Apr 8, 12:22

Worldwide semiconductor wafer-level manufacturing equipment revenue totaled US$33.6 billion in 2015, a 1% decrease from 2014, according to final results by Gartner. The top 10 vendors...

TSMC orders equipment for NT$2.6 billion

Stockwatch - Mar 30, 16:26

Taiwan Semiconductor Manufacturing Company (TSMC) has purchased a batch of machinery and facility equipment from Jienshian Information Engineering, Lam Research International, Tokyo...

North American semiconductor equipment industry posts February 2016 book-to-bill ratio of 1.05, says SEMI

Mar 18, 14:21

North America-based manufacturers of semiconductor equipment posted US$1.26 billion in orders worldwide in February 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...

SEMI reports 2015 semiconductor equipment sales of US$36.5 billion

Mar 15, 21:48

SEMI has reported that worldwide sales of semiconductor manufacturing equipment totaled US$36.53 billion in 2015, representing an on-year decrease of 3%. Total equipment bookings...

Front-end fab equipment spending to rise 3.7% in 2016, says SEMI

Mar 14, 12:54

Front-end fab equipment spending (including new, used and in-house) is projected to increase 3.7% to US$37.2 billion in 2016, and will rise another 13% in 2017 to US$42.1 billion,...

North American semiconductor equipment industry posts January 2016 book-to-bill ratio of 1.08, says SEMI

Feb 25, 11:08

North America-based manufacturers of semiconductor equipment posted US$1.32 billion in orders worldwide in January 2016 (three-month average basis) and a book-to-bill ratio of 1.08,...

North American semiconductor equipment industry posts December book-to-bill ratio of 0.99, says SEMI

Jan 27, 15:25

North America-based manufacturers of semiconductor equipment posted US$1.34 billion in orders worldwide in December 2015 (three-month average basis) and a book-to-bill ratio of 0.99,...

HMI seeing weak 1Q16, but expects growth to restore starting 2Q

Stockwatch - Jan 26, 19:13

Electron beam (e-beam) inspection tool and solution provider Hermes Microvision (HMI) expects to post a weak first quarter of 2016, but sales will return to a sequential growth track...

Worldwide semiconductor capital spending to decline 4.7% in 2016, says Gartner

Jan 13, 11:05

Worldwide semiconductor capital spending is projected to decline 4.7% to US$59.4 billion in 2016, according to Gartner. This is down from the 3.3% growth predicted by Gartner previ...

TSMC on equipment buying spree

Stockwatch - Dec 23, 11:02

Taiwan Semiconductor Manufacturing Company (TSMC) has spent more than US$700 million on semiconductor capital equipment in recent weeks, according to filings issued by the pure-play...

North American semiconductor equipment industry posts November book-to-bill ratio of 0.96, says SEMI

Dec 18, 15:20

North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2015 (three-month average basis) and a book-to-bill ratio of 0.96,...

418 items [2/12]
  • KLA%2DTencor+VisEdge+CV300R%2DEP

    KLA-Tencor VisEdge CV300R-EP

    KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection and metrology systems. The VisEdge CV300R-EP introduces two edge-metrology capabilities...

    Photo: Company, Sep 1.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Applied+Reflexion+GT

    Applied Reflexion GT

    Applied Materials has launched its Applied Reflexion GT system for advanced metal CMP applications. Key to the new system is its dual-mode architecture, enabling two wafers to be...

    Photo: Company, Dec 4.

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Global AP demand forecast, 2017-2020

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