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News tagged semiconductor equipment
  • Last update: Thursday 24 July 2014 [298 news items]

Semiconductor equipment maker Gudeng to post another record sales quarter

Nov 1, 14:45

Revenues at IC front-end tool supplier Gudeng Precision Industrial are likely to register another sequential increase in the fourth quarter of 2012, after climbing to record high...

Testing solution provider Chroma Ate posts profit drop in first three quarters

Oct 31, 10:59

Chroma Ate, which provides integrated and customized solutions for test and measurement instruments, has announced that net profits for the first three quarters of 2012 declined 44%...

SEMI, SEAJ book-to-bill ratios continue slide

Oct 19, 16:41

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 0.65 in September 2012, hitting the lowest level since May 2009, according to the Semiconductor...

Applied Materials plans job cuts

Oct 4, 14:19

Semiconductor equipment vendor Applied Materials has announced a plan to realign its global workforce. The plan is expected to complete by the end of the third quarter of fiscal 2013,...

Wafer fab equipment spending to decline 13.3% in 2012, says Gartner

Oct 2, 15:56

Global wafer fab equipment spending is on pace to total US$31.4 billion in 2012, a decline of 13.3% from 2011 spending of US$36.2 billion, according to Gartner. The research firm...

North America IC equipment industry book-to-bill ratio hits 9-month low, says SEMI

Sep 25, 10:43

The book-to-bill ratio of North American semiconductor equipment makers slid to 0.84 for August 2012, hitting the lowest level since November 2011, according to data compiled by SE...

Scientech sees increasing 1H12 gross margin due to sales growth of in-house produced equipment

Sep 21, 10:32

Equipment maker Scientech noted that the firm's share in high-end LED wet bench processes has exceeded 50%. The firm expects the LED market to continue expanding. Scientech's new...

Testing solution provider Chroma Ate to post sales growth in 3Q12

Sep 19, 10:34

Chroma Ate, which provides integrated and customized solutions for test and measurement instruments, saw its revenues increase 2.7% sequentially in August 2012. Revenues for September...

SPTS announces dry etch process technology for via reveal applications

Sep 6, 13:50

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

Wafer foundry houses to drive semiconductor equipment demand in 2H12

Sep 6, 01:35

Demand for semiconductor manufacturing equipment in the second half of 2012 will come mainly from the needs of wafer foundry houses to push advanced manufacturing processes into commercial...

Scientech positive about growth for semiconductor, LED equipment

Aug 23, 14:50

As the semiconductor industry moves to 28nm, 20nm and below process technologies, demand for equipment used to make more advanced chips is set to boom allowing Scientech to work toward...

Scientech president Ming-chi Hsu

North America book-to-bill ratio slips again, says SEMI

Aug 20, 14:13

Having slid below parity in June 2012 , the SEMI book-to-bill ratio for US manufacturers of semiconductor equipment continued to slip in July.

Marketech sales to rebound in 2H12

Aug 14, 11:38

Automation equipment specialist Marketech International will see its sales in the second half of 2012 rebound to the high levels of 2011 driven mainly by glass-thinning equipment...

Acter reports profit and revenue drops in 1H12

Aug 13, 14:54

Cleanroom and turn-key equipment supplier Acter has reported decreases of 3% and 10%, respectively, in consolidated revenues and net profits for the first half of 2012. Gross margin...

Marketech to post revenues of almost NT$11 billion for 2012

Jul 12, 12:14

Automation equipment specialist Marketech International has posted revenues of NT$5.72 billion (US$190.76 million) for the first six months of 2012, down 30.1% on year. Despite the...

North America fab tool book-to-bill continues slide, says SEMI

Jun 22, 14:29

The book-to-bill ratio for North America-made semiconductor equipment slipped for the second consecutive month but remained above one, according to SEMI.

3D IC to bring business opportunities for Taiwan semiconductor equipment makers

Jun 20, 01:05

3D IC is expected to afford business opportunities for Taiwan-based makers of semiconductor production equipment because processes and corresponding equipment for 3D ICs have not...

Chairman Hsu Chin-jung for Taiwan-based Hermes Microvision

Chip equipment billings down 9% in 1Q12, says SEMI

Jun 13, 16:55

SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$10.61 billion in the first quarter of 2012, down 9% from a year ago.

Fab tool supplier Gudeng posts 20% sales growth in May

Jun 11, 15:18

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer mainly specializing in mask solution products, saw its May revenues increase about 20% sequentially...

Fab equipment spending to rise in 2012 and hit record in 2013, says SEMI

Jun 7, 11:26

Semiconductor fab equipment spending will enjoy positive growth in 2012, and climb further to hit an all-time high in 2013, according to SEMI.

North America fab tool book-to-bill slips in April 2012, says SEMI

May 23, 14:56

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.

Japan semiconductor equipment firms gain share in 2011, says The Information Network

Apr 25, 14:08

Japan-based semiconductor equipment suppliers gained share against US manufacturers in 2011 despite a weak Japanese Yen, The Information Network has observed.

SEMI book-to-bill rises for sixth straight month

Apr 23, 16:10

The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment rose to 1.13 in March 2012, up for the sixth consecutive month, according...

Chip inventories to decline slightly in 1Q12, says IHS

Mar 26, 10:24

Average semiconductor days of inventory (DOI) held by chip suppliers are expected to decline by 0.5% in the first quarter, after rising 3.4% and hitting an 11-year high in the fourth...

North America fab tool book-to-bill climbs above parity

Mar 26, 10:22

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.01 in February 2012, above parity for the first time in 17 months, according to figures...

IC manufacturing equipment spending to decline in 2012, says Gartner

Mar 22, 16:41

Worldwide semiconductor manufacturing equipment spending is projected to total US$38.9 billion in 2012, an 11.6% decline from 2011 spending of US$44 billion, according to Gartner.

Japan February 2012 chip-gear orders down 5.7%, says SEAJ

Mar 20, 14:28

Japan-based manufacturers of semiconductor equipment posted JPY99.8 billion (US$1.2 billion) in orders in February 2012 (three-month average basis), down 5.7% from a year earlier,...

ASML unseats Applied in semiconductor equipment ranking, says VLSI

Mar 16, 14:25

VLSI Research has released its 2011 top semiconductor equipment suppliers ranking. During the year, Advantest closed its acquisition of Verigy in July and Applied Materials acquired...

Fab equipment spending poised to hit record in 2013, says SEMI

Mar 12, 16:06

Semiconductor fab equipment spending will remain flat at US$38.85 billion in 2012, but climb to a record US$45.5 billion in 2013, according to estimates made by SEMI.

Topco sees February revenues up on month, down on year

Mar 9, 01:15

Topco Scientific, which distributes semiconductor materials and equipment, reported February revenues of NT$1.03 billion (US$35 million), up 7.49% on month but down 7.63% on year...

Topco

North America fab tool book-to-bill up in January 2012, says SEMI

Feb 24, 12:31

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...

Japan chip gear book-to-bill ratio at 1.06 in January 2012, says SEAJ

Feb 20, 11:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.06 in January 2012, down from 1.20 in December but up from 0.99 a year earlier, according to...

KLA-Tencor shipping next-node wafer inspection tools

Feb 20, 10:55

Fab-tool vendor KLA-Tencor has announced the availability of its latest wafer defect inspection systems, and is shipping the products to its clients in the foundry, logic and memory...

SEMI book-to-bill ratio grows three months in a row

Jan 30, 10:25

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...

Japan fab tool book-to-bill nears 1.0, says SEAJ

Dec 20, 14:33

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for November 2011, up from 0.83 in October, according to new figures from the Semiconductor...

298 items [3/9]
Realtime news
  • Phison reports strong earnings for 1H14

    Bits + chips - Newswatch | 8h 13min ago

  • Hermes Microvision to see revenues stay flat in 3Q14

    Before Going to Press | 7h 24min ago

  • Delta Electronics 2Q14 gross margin, net profit hit records

    Before Going to Press | 7h 25min ago

  • Huawei ships 34 million smartphones in 1H14

    Before Going to Press | 7h 37min ago

  • Taiwan market: BenQ 1H14 LCD TV sales up 20% due to low-blue-light models

    Before Going to Press | 7h 38min ago

  • Commentary: China antitrust probe could affect Qualcomm performance

    Before Going to Press | 7h 39min ago

  • Demand for tablet touch panels decreasing, say Taiwan makers

    Before Going to Press | 8h 1min ago

  • Adlink develops 3D intelligent vision-aided positioning system in cooperation with ITRI

    Before Going to Press | 8h 15min ago

  • Digitimes Research: Smartphone AP shipments grow over 13% sequentially in China in 2Q14

    Before Going to Press | 8h 32min ago

  • China market: Colorful Technology poses competitive threat to MSI, ASRock

    Before Going to Press | 8h 33min ago

  • UMC to post single-digit revenue growth in 3Q14

    Before Going to Press | 8h 34min ago

  • Taiwan notebook ODMs to benefit from HP, Dell sales in North America

    Before Going to Press | 8h 34min ago

  • Huawei Device sees high growth in 1H14 handset shipments

    Before Going to Press | 8h 35min ago

  • Sales for mini versions of flagship smartphones short of expectations

    Before Going to Press | 8h 36min ago

  • Digitimes Research: Taiwan digital camera shipments in 2Q14 up 43.3% sequentially

    Before Going to Press | 8h 37min ago

  • Global market share for iPad may slip to below 25% in 2H14

    Before Going to Press | 8h 38min ago

  • Acer tops US LCD monitor retail market in 1H14

    Before Going to Press | 8h 39min ago

  • Huawei Device to launch Ascend Mate 3 4G smartphone, says report

    Before Going to Press | 8h 40min ago

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  • KLA%2DTencor+VisEdge+CV300R%2DEP

    KLA-Tencor VisEdge CV300R-EP

    KLA-Tencor has announced the latest addition to its VisEdge family of wafer edge inspection and metrology systems. The VisEdge CV300R-EP introduces two edge-metrology capabilities...

    Photo: Company, Sep 1.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Applied+Reflexion+GT

    Applied Reflexion GT

    Applied Materials has launched its Applied Reflexion GT system for advanced metal CMP applications. Key to the new system is its dual-mode architecture, enabling two wafers to be...

    Photo: Company, Dec 4.

Analysis of China revised domestic semiconductor industry goals

29-Jul-2014 markets closed

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