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NEWS TAGGED PACKAGING
Friday 9 June 2023
TSMC opens new advanced backend fab
TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...
Wednesday 7 June 2023
CWTC likely to report higher-than-anticipated 2Q23 revenue
IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely...
Wednesday 7 June 2023
Apple UltraFusion relies on TSMC 3DFabric packaging technology
Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources.
Tuesday 6 June 2023
TSMC: advanced packaging demand surpasses current capacity, expansion is speeding up
TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...
Tuesday 6 June 2023
TSMC rushes to increase packaging capacity for Nvidia AI chips
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.
Tuesday 30 May 2023
Advanced packaging demand for AI and HPC processors to rise
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Friday 26 May 2023
LED firm Ledtech returns to profitability
LED packaging service provider Ledtech Electronics swung back to profitability in April, buoyed by a pick-up in demand for low-temperature lighting devices.
Wednesday 24 May 2023
Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia...
Wednesday 24 May 2023
SEMI: global semiconductor packaging materials market to reach US$29.8b by 2027
SEMI, TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May 24, predicting that the size of global semiconductor...
Tuesday 23 May 2023
Bright LED, Harvatek still see customers adjust inventory
LED packaging houses Bright LED Electronics and Harvatek continue to see customers adjusting their inventories in the second quarter, putting pressure on their operations. The firms...
Tuesday 23 May 2023
Micron could lose US$3 billion in revenue injection from China
Micron Technology could lose an estimated US$3 billion in revenue from China as a result of the country's ban on Chinese enterprises working on critical infrastructure projects procuring...
Monday 22 May 2023
AUO Digitech transforms semiconductor assembly and packaging plants with smart upgrades
The semiconductor assembly and packaging industry has long struggled with labor-intensive processes. AUO Digitech (a subsidiary of AUO), specializing in smart industrial services,...
Monday 22 May 2023
Leadframe supplier CWTC opens new factory in southern Taiwan
Chang Wah Technology (CWTC) has inaugurated a new facility in Kaohsiung, southern Taiwan, where it will manufacture leadframes for advanced quad flat no-lead (aQFN) packaging, third-generation...
Tuesday 16 May 2023
China LED packagers raise quotes by 10%
China-based LED packaging houses, including MLS and DSBJ, have raised their contract quotes by up to 10% starting May, according to industry sources.
Tuesday 16 May 2023
Backend firms see slow adoption of FC packaging among handset APs
The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses.