LED module and packaging service provider Edison Opto has stepped up its deployment in the automotive segment, with plans to add a new LED automotive lighting product line in June,...

Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.

Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production...

Backend houses' production utilization rates for COF packaging have increased, boosted by a recovery in display driver IC (DDI) demand, according to industry sources.

The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year,...