Bits + chips
TSMC, Samsung scaling up competition in advanced chips packaging
Monica Chen, Taipei; Willis Ke, DIGITIMES

TSMC and Samsung Electronics have seen their competition significantly heat up in advanced packaging technologies beyond foundry processes, which could eventually dent business opportunities for traditional backend houses such as ASE Technology, Siliconware...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.