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News tagged 3D
  • Last update: Tuesday 25 July 2017 [401 news items]

SK Hynix delivers another quarter of record results

Jul 25, 13:19

SK Hynix saw its revenues, operating profits and net profits reach record-high levels for the second consecutive quarter in the second quarter of 2017.

NOR flash supply to remain tight in 2018, says Macronix president

Jul 24, 21:56

Supply of NOR flash memory is expected to remain tight in 2018, as demand will continue to outpace supply, according to Macronix International president CY Lu.

Macronix president CY Lu

Toshiba develops 3D flash memory with TSV technology

Jul 14, 15:48

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...

Toshiba 3D NAND flash with TSV

Brewer Science, Arkema partner to develop high-chi DSA materials for advanced node patterning

Jul 12, 22:35

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copo...

Supply of NAND flash for new iPhone falling short

Jul 5, 22:17

SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according...

3D printing may sharply alter production mode, says HP executive

Jul 5, 11:18

Extensive application of 3D printing technologies is very likely to trigger a drastic change in the manufacturing sector in the foreseeable future, with customized production of personalized...

HP 3D printing

Tong Hsing starts shipments for 3D sensing products

Jun 30, 15:56

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...

Micron posts profit growth on record revenues in fiscal 3Q17

Jun 30, 14:30

Micron Technology has announced revenues for its third quarter of fiscal 2017 climbed to a record US$5.57 billion, 20% higher compared to the second quarter and 92% higher compared...

Talks to sell Toshiba Memory continue; announces new products

Jun 30, 11:01

Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...

Digitimes Research: Japan government boosts development of high-precision 3D maps

Jun 29, 13:48

The Japan government, in line with the goal of realizing autonomous driving in Japan before the 2020 Tokyo Olympic Games, is promoting development and production of high-precision...

CMOS image sensor sales to reach another record high in 2017, says IC Insights

Jun 28, 22:22

CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...

Intel intros 64-layer, 3D NAND SSD

Jun 28, 14:24

Intel has announced the delivery of what the company claims is the world’s first commercially available 64-layer, TLC 3D NAND SSD.

Intel 64-layer, 3D NAND SSD

Samsung ramps up 64-layer V-NAND memory production

Jun 20, 15:54

Samsung Electronics has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications,...

Global Unichip rolls out HBM2 total solution

Jun 19, 19:38

Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

Fifteen chipmakers to spend more than US$1 billion on capex, says IC Insights

Jun 2, 10:29

There are 15 companies forecast to have semiconductor capital expenditures of more than US$1 billion in 2017, up from 11 in 2016 and only eight in 2013, according to IC Insights.

3S teaming up with Marvell to develop 28nm controller chips

May 23, 22:40

Solid State System (3S) has announced it is teaming up with Marvell to develop DRAM-less SSD controller solutions.

TPK hikes 3D Touch price for iPhone with OLED, says paper

Newswatch - May 19, 11:43

Touch panel maker TPK Holdings has quoted US$18-22 for 3D Touch solution for use in a new iPhone equipped with OLED panel to be launched later in 2017 and Apple has accepted the quote,...

Sumco says new capacity to arrive in 2019

May 15, 21:59

Sumco expects its additional new capacity to come online in 2019 at the earliest, according to the Japan-based silicon wafer vendor, adding that it will enhance and optimize its existing...

Sumco lowering wafer shipments to XMC, say sources

May 11, 11:01

Sumco has reportedly cut its wafer shipments to Wuhan Xinxin Semiconductor Manufacturing (XMC), and given priority to Taiwan Semiconductor Manufacturing Company (TSMC), Intel and...

YMTC 64-layer 3D NAND technology ready for mass production in 2019, says acting chairman

May 8, 15:52

Yangtze River Storage Technology's (YMTC) 64-layer 3D NAND technology will be ready for mass production in 2019, according to Charles Kau, company acting chairman and executive VP...

Charles Kau, executive VP of Tsinghua Unigroup and acting chairman of YMTC

Semiconductor wafer-level manufacturing equipment revenues up 11% in 2016, says Gartner

May 3, 11:13

Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenues totaled US$37.4 billion in 2016, an 11.3% increase from 2015, according to final results by Gartner. The...

ITRI unveils PBF 3D large-size printing platform

Apr 28, 15:44

The Laser and Additive Manufacturing Technology Center under the government-sponsored Industrial Technology Research Institute (ITRI) has unveiled an in-house-developed PBF(powder...

LMD 3D large-size printing platform developed by the Laser and Additive Manufacturing Technology Cen

Macronix developing 3D NAND technology for SSDs

Apr 28, 15:19

Macronix International has been engaged in the development of 3D NAND technology, and expects to enter volume production of chips built using the technology for SSDs in 2018, according...

Macronix chairman Miin Wu

Micron talks about its integrated global operations

Apr 26, 15:37

Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Wayne Allan, VP of global manufacturing at Micron

PTI looks to sequential revenue growth through 4Q17

Apr 26, 11:09

Packaging and testing company Powertech Technology (PTI) expects to post mid single-digit sequential growth in revenues for the second quarter of 2017, said company president JY Hung...

SK Hynix posts record revenues and profits for 1Q17

Apr 25, 11:46

SK Hynix has reported operating profits of KRW2.47 trillion (US$2.2 billion) on consolidated revenues of KRW6.29 trillion for the first quarter of 2017, with both results hitting...

Silicon wafer suppliers seeking long-term contracts

Apr 25, 11:18

Silicon wafer suppliers have advised their semiconductor customers to sign long-term contracts amid tight supply, according to industry sources.

Samsung completes qualification of 2nd-gen 10nm process technology

Apr 21, 13:57

Samsung Electronics has announced that its second-generation 10nm FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement...

PTI to enjoy robust demand for NAND flash

Apr 20, 10:25

Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.

3D NAND flash output set to expand in 2H17

Apr 18, 21:16

The global output of 3D NAND flash memory chips is set to expand substantially in the second half of 2017, and will exceed that of 2D NAND chips in the fourth quarter of the year,...

SK Hynix intros 72-layer 3D NAND flash

Apr 10, 15:00

SK Hynix has introduced 72-layer 256Gb 3D NAND flash memory chips based on its triple-level cell (TLC) arrays and own technologies.

Himax reportedly cuts into supply chain for iPhone

Mar 30, 21:09

Taiwan-based Himax Technologies will be among the component suppliers of Apple for its OLED iPhone that will feature a built-in 3D-sensing module to enable augmented reality (AR)...

Yangtze River Storage 3D NAND flash development on track

Mar 15, 09:54

Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab...

YMTC CEO
401 items [1/12]
  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

  • Samsung+850+EVO+M%2E2+and+850+EVO+mSATA+SSD

    Samsung 850 EVO M.2 and 850 EVO mSATA SSD

    Samsung Electronics has unveiled the 850 EVO M.2 and 850 EVO mSATA solid state drive (SSD) lineups. The 850 EVO M.2 and mSATA SSDs are new form factors of the 850 EVO SSD that launched...

    Photo: Company, Apr 14.

WCIT
Global AP demand forecast, 2017-2020

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The transition to 4k TV - UHD TV market forecast, 2014-2017
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