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News tagged 3D
  • Last update: Friday 17 November 2017 [453 news items]

Austria chipmaker ams partners with China firm to develop 3D sensing camera solutions

Nov 17, 13:17

Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...

More Android smartphone vendors to adopt 3D sensing for new models

Nov 17, 12:03

Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...

More smartphone vendors are to adopt 3D sensing technology

Samsung huge chip capex for 2017 shows move to defend its memory dominance

Nov 16, 11:20

After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...

China IC firm sets milestone with rollout of 3D NAND flash

Nov 15, 14:16

Yangtze River Storage Technology (YMTC) under the Tsinghua Unigroup has successfully developed 32-layer 3D NAND flash chips, marking a new milestone and major technological breakthrough...

YMTC has unveiled 3D NAND flash memory

Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion

Nov 14, 09:31

Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...

Product marketability hinges more on user experience, says Dassault CEO

Nov 13, 10:59

The market catering to personalized and diverse demand hinges on user experience rather than product functionality, Bernard Charles, president and CEO of Dassault Systemes, has remarked...

Dassault Systemes CEO Bernard Charles

Experience economy brings new challenges to manufacturers, says Delmia CEO

Nov 9, 13:57

The advent of the experience economy era has changed the essence of the manufacturing industry, and how to quickly respond to market demands by integrating digital and remote manufacturing...

Delmia CEO Guillaume Vendroux

Oppo, Xiaomi to adopt 3D sensors for smartphones in 2018

Nov 9, 11:40

China-based vendors Oppo and Xiaomi Technology will adopt 3D sensing solutions for smartphones to be launched in 2018, with such solutions to be developed by Himax Technologies via...

Robust 3D sensing module demand benefiting related suppliers

Nov 7, 11:49

Robust 3D sensing module demand has buoyed the performance of related suppliers, such as GaAs IC foundry Win Semiconductors and testing equipment supplier Chroma ATE.

Optical PCB inspection firm Machvision scores record net profits in 3Q17

Nov 3, 14:50

Automated optical inspection (AOI) equipment specialist Machvision saw its net profits climb to a record high of NT$116 million (US$3.84 million) in the third quarter of 2017, with...

Machvision likely to score record EPS of NT$9 in 2017

Micron intros industrial microSD cards for surveillance

Nov 1, 22:22

Micron Technology has announced a full portfolio of edge storage solutions for video surveillance that will enable new deployment models and reduce total cost of ownership for both...

Lite-On Tech looks to ship smartphone 3D sensing CCMs in 2Q18

Oct 31, 11:28

Lite-On Technology expects to ship smartphone-use 3D sensing CCMs to China-based vendors in second-quarter 2018 at the earliest. In the wake of Apple's adoption of facial recognition-enabled...

lite-on

Supply of high-density NOR flash to remain tight in 2018, says Macronix chairman

Oct 27, 13:52

The supply of high-density NOR flash memory will remain tight through 2018, while the low-density market segment will be affected by China-based suppliers' new capacities, according...

Macronix chairman Miin Wu

Innovative products, technologies take center stage at TPCA Show 2017

Oct 26, 16:16

Many Taiwan players in the PCB supply chain have debuted their newest products, technologies and solutions at the TPCA Show 2017 running October 25-27 at the Taipei Nangang Exhibition...

Machvision showcasing new optical inspection systems at TPCA Show 2017

Test solutions provider Chroma eyeing AI-based smart production

Oct 25, 19:51

Testing equipment and solutions supplier Chroma ATE is actively moving to incorporate AI (artificial intelligence) into its products and pursue smart manufacturing operations by investing...

PTI expects another quarter of record revenues in 4Q17

Oct 24, 13:51

Robust demand for flash memory chips will buoy further sales performance at Powertech Technology (PTI) in the fourth quarter of 2017, said the memory backend specialist at an October...

Smartphones and other mobile devices continue to boost memory chip demand

Xintec to swing to profit in 4Q17, says report

Oct 17, 15:05

Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...

Yield rates for iPhone X components improving

Oct 17, 11:00

Yield rates for certain iPhone X components have improved and become more stable, and shipments of the smartphone are set to grow substantially after October, according to sources...

iPhone X components supply has become stable

Toshiba discloses further investment in 3D NAND flash facility

Oct 16, 15:37

Toshiba announced recently its board of directors had approved a further investment by Toshiba Memory in production equipment for Fab 6 at its Yokkaichi operations in Mie (Japan).

Toshiba reportedly suspends NAND flash production in Japan

Oct 16, 12:37

Toshiba recently suspended NAND flash production at its Japan facilities for a few weeks due to ransomware attacks on its computer network, according to sources at channel distributors...

Largan developing 3D sensing solutions

Oct 13, 11:26

Lens module maker Largan Precision has been developing 3D sensing solutions for smartphones, according to company CEO Lin En-ping.

Largan Precision CEO

Himax reportedly supplying WLO chips for iPhone X face ID

Oct 12, 15:10

Fabless IC firm Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources. The solution is reportedly a...

XYZprinting unveils panchromatic FFF 3D printer

Oct 11, 13:28

XYZprinting has unveiled a panchromatic FFF (fused filament fabrication) 3D printer for sale in the Taiwan market. Target customers of the printer are startups, small- to medium-size...

Win Semiconductors reportedly enters iPhone X supply chain

Oct 6, 13:59

Win Semiconductors, one of Taiwan's top-3 GaAs PA (power amplifier) suppliers, has reported consolidated revenues of NT$4.395 billion (US$144.58 million) in the third quarter of 2017,...

Low yield rates for 3D sensing modules to blame for smartphone shipment delays

Oct 5, 10:55

Low yield rates during production for 3D sensing modules to be incorporated into Apple's iPhone X and other Android-based smartphone brands have forced major global vendors to postpone...

NAND flash to reach supply-demand balance in 2018, says DRAMeXchange

Sep 28, 10:39

The global NAND flash market will shift away from undersupply and reach a supply-demand balance in 2018, when supply bit growth is forecast to reach 42.9%, according to DRAMeXchang...

Aurora eyeing Taiwan educational 3D printing market

Sep 27, 15:04

Aurora, a distributor of office automation machines and office furniture in Taiwan and China, will start offering 3D printing promotional services at its outlets around Taiwan for...

Supply of 12-inch silicon wafers to stay tight through 2019

Sep 22, 11:11

The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.

12-inch wafer supply to remain tight through 2019

Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET

Sep 22, 10:32

Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...

Tokyo Electron eyeing larger share of global etching equipment market

Toshiba agrees to sell memory-chip unit to Bain Capital-led consortium

Sep 21, 10:33

Toshiba has agreed to sell its memory-chip business to KK Pangea, a special purpose acquisition company formed by a Bain Capital Private Equity-led consortium. The decision was made...

Intel provides 10nm updates, plan for 10nm FPGA

Sep 20, 10:49

Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...

iPhone X sets new trends for smartphones

Sep 15, 14:11

A number of new features that come along with Apple's newly released iPhone X such as 3D sensing are likely to become new standards for next-generation smartphones launched by Android-based...

iPhone X sets new trends for smartphone

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

China to enhance local memory industry development

Sep 13, 14:36

The China high-end IC Alliance (CHICA), which was set up by China's National Semiconductor Industry Investment Fund (known as the Big Fund) earlier in 2017, is looking to add another...

Solomon demonstrating 3D machine vision system

Sep 8, 12:08

Taiwan-based automation product maker Solomon Technology is showcasing its in-house developed artificial intelligence (AI) and 3D machine vision system at Taipei International Industrial...

Solomon showcasing 3D machine vision system
453 items [1/13]
Realtime news
  • Laster Tech to see 4Q17 revenues increase

    Before Going to Press | 39min ago

  • Global 3Q17 NAND flash market grows 14% on quarter, says DRAMeXchange

    Before Going to Press | 43min ago

  • Xiaomi appoints former MediaTek co-COO as investment partner

    Before Going to Press | 43min ago

  • Smartphone panel prices stay flat in November

    Before Going to Press | 45min ago

  • Asustek tops Taiwan-based global brand in 2017

    Before Going to Press | 46min ago

  • Digitimes Research: Global smartphone shipments to reach over 1.5 billion units in 2018

    Before Going to Press | 47min ago

  • Gemtek building up LoRa base stations in Beijing

    Before Going to Press | 48min ago

  • Car-use LED lighting demand to boom in China

    Before Going to Press | 50min ago

  • KYEC to enjoy ramp-up of orders from Nvidia, Intel

    Before Going to Press | 53min ago

  • OSE looks to swing back to profit in 2018

    Before Going to Press | 58min ago

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  • Samsung+1Tb+V%2DNAND

    Samsung 1Tb V-NAND

    Samsung has announced a 1Tb V-NAND chip that it expects to be available next year. Since first mentioning it in 2013, during unveiling of the industry's first 3D NAND, Samsung has...

    Photo: Company, Aug 11.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Apple+iPhone+6s+and+iPhone+6s+Plus

    Apple iPhone 6s and iPhone 6s Plus

    Apple has announced the iPhone 6s and iPhone 6s Plus, the latest iPhone models from the company. The new iPhones introduce 3D Touch, which senses force to access features and interact...

    Photo: Company, Sep 11.

  • Samsung+V%2DNAND+SSDs

    Samsung V-NAND SSDs

    Samsung Electronics has announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of...

    Photo: Company, Aug 27.

  • Intel+fifth%2Dgeneration+Core+%28Broadwell%2DH%29+processors

    Intel fifth-generation Core (Broadwell-H) processors

    The fifth-generation Intel Core family also now includes the first LGA socketed desktop processor with integrated Iris Pro graphics, Intel's most powerful client processor graphics...

    Photo: Company, Jun 4.

UMC
Global AP demand forecast, 2017-2020

21-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.