TSMC may move 6th-gen CoWoS to production in 2023

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 26 October 2020 0

TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that can integrate HPCs and 12 cubes of HBM (high-bandwidth memory), according...

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