- 13 Jan 2017:Two senior China executives defended the country's big bet on its semiconductor industry here a week after a White House report called for international action against practices it called unfair. Executives from fab and capital equipment companies said the China government is not being unfair in the way it supports its still-infant industry.
- 19 Nov 2016:Applied Materials, the biggest maker of machinery used to produce chips and displays, predicted a jump in sales as customers spend on equipment needed to modernize production. The stock fell on concern that orders may have peaked.
- 4 Nov 2016:Zeiss SMT has been a supplier to ASML for 30 years. It makes lenses and other equipment needed to focus the energy beams ASML uses to help companies such as Intel and Samsung create the circuitry of semiconductor chips.
- 14 Oct 2016:Tokyo Electron and Disco appear to have logged record sales in China in the six months through September.
- 5 Oct 2016:Hitachi is preparing to unload operations in power tools and semiconductor fabrication equipment, further narrowing its focus and resources with the aim of bolstering earning power in an uncertain global economy.
- 12 Sep 2016:Tech giant Samsung Electronics is gearing up to fully operate a production line for 3D NAND flash memory at its plant in Hwaseong City, Gyeonggi Province. Considering the one-month period to build the equipment and tools, it is expected that the facility will likely be in full operation around the end of 2016.
- 29 Aug 2016:Apple invents sapphire coating equipment to strengthen glass for future OLED displays (Aug 26) - Patently AppleThe US Patent and Trademark Office has published a patent application from Apple titled "Electronic Devices with Sapphire-Coated Substrates." The invention is designed to add a sapphire coating to future OLED displays like those that will begin shipping in 2017 and beyond.
- Orders for semiconductor-manufacturing equipment are picking up at seven major Japanese producers, underpinned by brisk demand for 3D memory and ravenous investment in chip miniaturization.
- 17 Aug 2016:Cisco Systems is laying off about 14,000 employees, representing nearly 20 percent of the network equipment maker's global workforce, technology news site CRN reported, citing sources close to the company.
- 29 Jun 2016:Samsung Display is reportedly planning to sell its liquid-crystal display equipment at its L7 manufacturing line in Tangjeong-myeon, South Chuncheong Province.
- 13 Jun 2016:Samsung agreed with Dutch-based ASML to deploy extreme ultraviolet (EUV) equipment for mass production in their 7 nanometer processes.
- 22 May 2016:Nokia is cutting 1,032 jobs in Finland as part of a cost-cutting program following its acquisition of Alcatel-Lucent, the telecom network equipment maker said in a statement on Friday.
- 19 May 2016:Nokia, which has refashioned itself into a maker of wireless and Internet network equipment, won't make or sell cellphones and tablets directly. Rather, the company said Wednesday that it has entered a series of licensing pacts with Finnish and Asian partners.
- 28 Apr 2016:Buoyed by strong sales of automotive chips and improved sales of devices for communications and industrial equipment, Texas Instruments Wednesday (April 27) reported higher than expected first quarter sales and profit and delivered a forecast for the second quarter that was within range of Wall Street's estimates.
- 19 Apr 2016:Samsung Electronics is co-developing EMI shielding process that uses spray method with Protec, which is a South Korean company specializing in dispenser, Asymtek from the US, Hansol Chemical and Ntrium. While Protec and Asymtek are developing equipment, Hansol Chemical and Ntrium are developing EMI masking material that is in a form of ink. Samsung is planning to supply NAND-flash package with EMI shield to Apple when equipment and material are developed. It is predicted that supply will be possible starting from 2017.
- 9 Mar 2016:Toshiba has granted Canon exclusive negotiating rights for its medical equipment unit after a hotly contested auction, with a report putting Canon's offer at more than $6 billion.
- 23 Apr 2015:Texas Instruments has forecast current-quarter revenue below analysts' expectations, citing weak demand for its chips from communication equipment and consumer electronics markets and a strong dollar.
- 16 Jan 2015:Shares of chip equipment makers Applied Materials, KLA-Tencor, and Lam Research are all up in after-market trading, following a Q4 report from Intel in which it projected capital spending to be flat this year with last year's level.
- 13 Nov 2014:Spansion has launched a family of industrial-grade e.MMC NAND memory products for the consumer, communication and industrial equipment markets.
- 4 Mar 2014:Amtech Systems, a supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, has received approximately US$10 million in new solar orders.
- 22 Jan 2014:Nokia is expected to show a steep fall in network equipment sales in its results this week, highlighting the challenge facing management after selling its once mighty handset division to Microsoft for EUR5.4 billion (US$7.3 billion).
- 1 Oct 2013:Samsung Electronics has begun commissioning equipment orders for its newly constructed semiconductor plant in Xian, China.
- 22 Jul 2013:Nova Measuring Instruments, the Israeli maker of equipment for semiconductor manufacturing, rebounded in New York after the chief executive officer said he's confident its largest customer won't pare back orders.
- 12 Jul 2013:Applied Materials demonstrates momentum for profitable growth in mobile era (July 8) - Company releaseConsumer demand for sophisticated mobile devices creates profitable growth opportunities for Applied's semiconductor and display equipment businesses.
- 25 Jun 2013:The China-based company already has a manufacturing base in Sorocaba (92km from São Paulo city) which produces telecommunications equipment and employs about 3,000 staff.
- 16 Apr 2013:Altera has agreed to acquire TPACK, a wholly-owned subsidiary of Applied Micro Circuits. TPACK delivers complete FPGA-based OTN (optical transport network) products targeting packet and optical networking equipment suppliers.
- Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by Globalfoundries will create new opportunities for equipment and materials suppliers in Southeast Asia.
- 15 Apr 2013:After strong gains in 2010 and 2011, power transistor sales fell more than 8% in 2012 to US$12.3 billion primarily due to weak economic growth and high levels of uncertainty, which caused equipment makers to rein in semiconductor purchases, according to IC Insights.
- 18 Mar 2013:
- 12 Mar 2013:Fab equipment spending for front-end facilities is expected to be flat in 2013, remaining around US$31.7 billion, increasing to US$39.3 billion in 2014 - a 24% increase.
- 19 Feb 2013:Wireless is set to be the leading growth segment for semiconductor spending among original equipment manufacturers (OEMs) in 2013, with expenditures rising by a double-digit margin to support the burgeoning markets for smartphones, tablets and mobile infrastructure gear, according to IHS iSuppli.
- 26 Oct 2012:KLA-Tencor posted fiscal first-quarter revenue below expectations and said current-quarter revenue would fall more as chipmakers, worried about the economy, hold off on new orders of manufacturing equipment.
- 18 Oct 2012:Dutch semiconductor-manufacturing equipment maker ASML said Wednesday it sees weak demand in memory chips, and adjusted its second half net sales guidance to the lower end of its earlier EUR2.2 billion-EUR2.4 billion range.
- 16 Oct 2012:French telecom vendor Alcatel-Lucent will cut about 1,000 jobs in India as part of its global restructuring effort to cope with dwindling demand for network equipment among telcos in the country.
- 13 Aug 2012:Globalfoundries, Applied Materials sign service agreement for Fab 1 in Germany (August 13) - Company releaseApplied Materials has has signed an enhanced two-year contract with Globalfoundries to service all Applied Materials equipment at its Fab 1 in Dresden, Germany.
- 8 Aug 2012:The Nikkei Shimbun, Japan's economic newspaper, reported that Nikon is going to work with Intel to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers.
- 12 Jul 2012:Applied Materials revises FY2012 business outlook on lower foundry equipment demand (July 10) - Company releaseThe company also revised its calendar year 2012 industry forecast for wafer fab equipment spending to US$30-33 billion, compared to its previous expectation of US$32-35 billion, in line with the market changes.
- 6 Jun 2012:Wieberneit has spent more than twenty years in the consumer and communication semiconductor space, serving in different R&D, CTO and GM positions at Trident Microsystems, Micronas and Infineon Technologies.
- 19 Apr 2012:ASML dropped the most in six months after Europe's biggest semiconductor equipment maker didn't provide guidance for future orders in its first-quarter results.
- 26 Mar 2012:Australia bans China's Huawei from bidding for work on Internet network amid security worries (Mar 26) - AP (via Washington Post)Australia's government has banned Chinese technology giant Huawei from bidding to help build a high-speed Internet network amid concerns about cyber attacks traced to China. Australian Prime Minister Julia Gillard said Monday the move was among "prudent decisions" her government had to make to ensure the planned network functions properly.
- Digitimes Research: December 7W LED light bulb prices in China market fall
- Digitimes Research: SAE TIR J2954 paves way for commercializing PHEV/EV wireless power transfer
- Digitimes Research: Global production value for high-brightness LED chips to reach US$13.179 billion in 2017
- Digitimes Research: All-in-one PC shipments drop 4.8% in 2016
- TUV NORD launches SECURITY 4 SAFETY service to build Industry 4.0 foundation for customers
- ABB wins $100 million order to upgrade historic HVDC link in the U.S.
- Supermicro introduces latest SUPERO desktop and gaming solutions at CES 2017
- Wanshih Electronic will exhibit USB3.1 cable assemblies with type C in 2017 Consumer Technology Association (CES)
- Toshio Maruyama of Advantest receives SEMI Marketing Excellence Award
- Unisys IT Implementation of Unisys Stealth Solution for Data Center Segmentation
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Perforce Software Wins Develop Industry Excellence Award for the Second Year in a Row
- Perforce Teams with Leading Git Client Developer fournova
- Perforce Introduces Helix GitSwarm: Flexible Git Ecosystem Mirrored to a Powerful Mainline Repository
- Perforce Helix Distributed Version Control System Brings Greater Flexibility While Maintaining Enterprise-class Security, Auditability and Control
- Perforce Powers Development of Legacy Quest for iOS and Android
- Digitimes Research: Samsung Note 7 issues may help Apple to regain number-1 crown in 4Q16
- Digitimes Research: 4 million 9.7-inch iPad Pros to ship in 1H16
- Digitimes Research: Global all-in-one PC shipments to drop 3.9% on year in 2015
- Mentor Graphics Veloce VirtuaLAB adds protocols for networking designs
- Mouser Electronics undergoing expansion
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