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- 21 Jul 2009:Chip equipment maker ASM International (ASMI) has announced that it is accelerating its cost reduction and restructuring of worldwide front-end operations.
- 15 Jul 2009:Semiconductor equipment maker Novellus Systems has posted disappointing margins and a wider-than-expected loss, but a robust forecast helped limit share losses in late trade.
- Dutch semiconductor equipment maker ASML has reported a narrower second quarter net loss than in the first quarter as sales jumped, and said it expects to reach break-even by the end of 2009.
- While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing profitability for leading-edge chipmakers is still Moore's Law...
- 13 Jul 2009:VLSI Research has revealed its Top-10 PV manufacturing equipment supply companies for 2008, with Applied Materials leading the pile.
- The global semiconductor equipment book-to-bill-ratio rose above parity in June for first time in 11 months, according to VLSI Research.
- 6 Jul 2009:With few tools in development for the EUV mask infrastructure, Sematech has said it will convene a meeting during SEMICON West to garner financial support from companies and government sources. The goal is to entice commercial suppliers to develop EUV mask blank inspection, mask defect review, and mask pattern inspection tools.
- 30 Jun 2009:
- 11 Jun 2009:Aviza Technology announced that is has filed for Chapter 11 bankruptcy as it goes ahead with efforts to sell certain of its assets to Sumitomo Precision Products.
- 8 Jun 2009:This expansion includes a 50% increase in floor space, and a multi-million dollar investment in facilities and equipment.
- 1 Jun 2009:Nikon has said it will reorganize its lithography operations, cutting 800 production workers in Japan and 200 marketing and support staff worldwide. By October, Nikon plans to combine four production subsidiaries into two, focused on IC and display equipment.
- 21 May 2009:Axcelis Technologies, a supplier of ion implantation and cleaning systems, has announced a global workforce reduction of approximately 235, or 20% of its employees, since year end 2008.
- Nanometrics ships follow-on Lynx system to leading memory manufacturer - Semiconductor InternationalNanometrics has begun shipping its Lynx cluster metrology systems, as a follow-on order to a leading memory manufacturer as part of its plan for high-volume manufacturing of its latest DRAM and flash memory technologies.
- 14 May 2009:Applied Materials executives said customer confidence is improving, but cautioned that the company is seeing "a very dynamic environment" in all of its major segments. China's stimulus plans may continue to support cellphone and PC consumption there, said CEO Mike Splinter following release of fiscal Q2 financial results.
- 13 May 2009:Semiconductor equipment maker Applied Materials swung to a loss in the fiscal second-quarter as sales plunged a less-than-feared 53% in a tough environment for the chip sector.
- 28 Apr 2009:KLA-Tencor has announced operating results for its third quarter of fiscal 2009 (ended on March 31, 2009). KLA-Tencor reported a GAAP net loss of US$83 million and a GAAP loss per share of US$0.49 on revenues of US$310 million for the third quarter of fiscal 2009.
- 25 Apr 2009:Lam Research has revealed its third quarter financial results, indicating a swing to loss as revenues plunged 72% during the three-month period.
- Novellus Systems Chief Executive Richard Hill said the chip equipment market may have reached a bottom and provided second-quarter guidance above Wall Street estimates.
- MEMC Electronic Materials shares jumped on Friday after the silicon wafer maker posted a first-quarter profit helped mainly by a hefty tax gain.
- 23 Apr 2009:Equipment supplier EV Group said that strong equipment orders in the last quarter have led to plans to increase production capacity with an extra working shift, starting near the end of April. New orders have exceeded the equipment suppliers forecasts, with demand coming from 3D IC through-silicon via (TSV) and nanoimprint lithography markets.
- 8 Apr 2009:KLA-Tencor has introduced the TeraScanXR, bringing high-resolution reticle-, aerial-, and wafer-plane inspection capability to the 32-nm node.
- 7 Apr 2009:Applied Materials said on Monday the value of a sales agreement to supply solar production equipment to a private buyer has been slashed to US$250 million from US$1.9 billion due a worsening global economy.
- 1 Apr 2009:KLA-Tencor will reduce its global workforce by a further-10% as part of an effort to reduce its quarterly operating expenses to US$140 million to US$145 million by the end of calendar year 2009, down from the previously announced target of US$165-170 million per quarter.
- 27 Mar 2009:Agilent Technologies has announced a 2700 employee layoff and a major restructuring of its electronic measurement business in response to what the company described as the "most severe global downturn" in its history.
- 25 Mar 2009:Lam Research is cutting 375 jobs or 10% of its workforce as part of a restructuring effort the company estimates will save it up to US$95 million a year.
- 18 Mar 2009:VLSI Research said ASML overtook TEL for the second spot in its annual ranking of equipment suppliers. Applied Materials remained on top, while KLA-Tencor and Lam Research were in the fourth and fifth spots. The Top 10 declined slightly faster than the total IC manufacturing equipment industry, which dwindled 25.1% to $41.8 billion.
- 13 Mar 2009:Deposition equipment maker Aixtron AG of Aachen, Germany has reported revenue of £á274.4m for full-year 2008, up 28% on 2007¡¦s £á214.8m (and the third consecutive year of growth).
- 9 Mar 2009:
- 20 Feb 2009:Global semiconductor equipment maker Analog Devices on Wednesday reported better-than-expected earnings for its first quarter after a bout of cost-cutting, and forecast earnings in line with estimates for the current quarter.
- Chipmaking equipment orders received by Japanese manufacturers fell to the lowest level in more than seven years in January, according to preliminary figures released by an industry group on Wednesday. The book-to-bill ratio, which stands for orders divided by billings, came to 0.55, the Semiconductor Equipment Association of Japan said.
- 12 Feb 2009:Applied Materials, the world's largest manufacturer of semiconductor production equipment, posted its first quarterly loss since 2003 and said it would cut back production, sending its shares sliding 3.2%.
- 3 Feb 2009:Applied Materials lowered its earnings forecast Monday, saying it expects sales at the low end of its projected range for the first quarter as the chip-tools maker struggles through what it described as "unprecedented business conditions."
- 16 Jan 2009:ASML Holding NV, a key equipment supplier to Intel and other chip makers, swung to a fourth-quarter net loss, hurt by a slumping semiconductor market as customers struggled to get credit.
- 15 Jan 2009:EV Group (EVG) and Brewer Science have announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers localized support in the Asia-Pacific region for 3D IC and other advanced process development programs.
- 13 Jan 2009:KLA-Tencor, a microchip manufacturing equipment maker, slashed its sales estimate for the fiscal second quarter, citing economic turmoil and the ongoing decline of the semiconductor industry.
- 9 Jan 2009:Unlike the SEMI Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data, the World Fab Forecast and its related Fab Database reports track any equipment needed to ramp the fab, upgrade, expand, or change its wafer size regardless if it is new equipment, used equipment, or transferred equipment, while WWSEMS tracks only new equipment.
- 19 Dec 2008:"Never before have we witnessed such a sharp and sudden fall-off in lithography system demand, triggered by an unprecedented mix of falling end-demand for semiconductors, weak memory prices and restricted access to capital for our customers," said Eric Meurice, President and Chief Executive Officer of ASML. "This steep decline in our business activity is forcing us to adjust our organization in order to lower our cost base significantly."
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