- 6 Jun 2012:Wieberneit has spent more than twenty years in the consumer and communication semiconductor space, serving in different R&D, CTO and GM positions at Trident Microsystems, Micronas and Infineon Technologies.
- 19 Apr 2012:ASML dropped the most in six months after Europe's biggest semiconductor equipment maker didn't provide guidance for future orders in its first-quarter results.
- 26 Mar 2012:Australia bans China's Huawei from bidding for work on Internet network amid security worries (Mar 26) - AP (via Washington Post)Australia's government has banned Chinese technology giant Huawei from bidding to help build a high-speed Internet network amid concerns about cyber attacks traced to China. Australian Prime Minister Julia Gillard said Monday the move was among "prudent decisions" her government had to make to ensure the planned network functions properly.
- 15 Feb 2012:Atomic Precision Systems (APS), a little-known semiconductor equipment vendor specializing in deposition technology, has filed a patent infringement suit against Intel, IBM and Micron Technology claiming that they willfully infringed on an atomic layer deposition (ALD) patent held by APS, according to a statement issued by the company's law firm Tuesday.
- 30 Jan 2012:Leading electronic equipment manufacturers remained the center of the semiconductor world in 2011, accounting for US$105.6 billion of semiconductors on a design total available market basis - 35% of semiconductor vendors' worldwide chip revenue, according to Gartner.
- 20 Jan 2012:Dutch semiconductor equipment maker ASML said Wednesday it expects a healthy start to 2012, as its customers invest in chip production to drive faster and more powerful smartphones and tablets.
- 6 Jan 2012:After several years of rapid capacity expansion driven by high-brightness LED used in TV backlighting applications, a 40% decline in world metal organic chemical vapor deposition (MOCVD) purchases in 2012 will reduce overall LED equipment spending for the first time in over five years.
- 17 Nov 2011:
- 1 Nov 2011:Order Focus: Polysilicon Technology places US$47.7M order for reactors from GT Advanced Technologies (October 28) - PV-TechGT Advanced Technologies and Saudi Arabia-based Polysilicon Technology (PTC) have signed a US$47.7 million deal, which will see GT supply its SDR 400 reactors to PTC.
- 21 Oct 2011:Many next generation products from the display industry designed to overcome the recession, caught the attention of the spectators. Components and equipment manufacturers also were busy enthusiastically showing their new technology to foreign buyers.
- 17 Oct 2011:"Michael Woodford has largely diverted from the rest of the management team in regard to the management direction and method and it is now causing problems for decision-making by the management team," the company said in a statement.
- 13 Oct 2011:Linear, which makes semiconductors for industrial equipment and luxury cars, ranked above Microsoft and Apple - two companies with market valuations that are 30 to 50 times larger.
- 8 Sep 2011:Verigy, an Advantest Group company, has announced that the company has reached a major milestone with the installation of its 2,500th V93000 system-on-chip (SoC) test platform. The milestone shipment is part of a multi-system order from Advanced Semiconductor Engineering (ASE).
- 25 Aug 2011:Applied Materials CEO Mike Splinter told analysts on a conference call that he is now expecting chipmakers to spend US$1 billion less on new equipment than the company forecast in July. "We've seen demand from our foundry customers soften significantly in the past six weeks," Splitner said.
- 24 Aug 2011:The price of polysilicon, the main raw material in photovoltaic panels, rose in August for the first time in five months, and Goldman Sachs Group Inc. said solar-equipment makers are poised for recovery.
- 29 Jul 2011:"We are seeing significant near term declines in wafer fab equipment spending, and as result our September quarter shipments, revenues and earnings per share will be well below our June quarter results," Lam Research CEO Steve Newberry said.
- 14 Jun 2011:Several large sapphire furnace orders have helped GT Solar to almost double its equipment order backlog guidance from approximately US$1 billion to US$1.6 billion. However, technical upgrades offered to existing customers of DSS650 furnaces are tracking ahead of schedule, enabling GT Solar to raise revenue guidance for the current quarter to approximately, US$225 million, up from previous guidance of between US$140 million - US$150 million.
- 31 May 2011:GT Solar International Inc of Merrimack, NH, USA (a provider of polysilicon production technology as well as sapphire and silicon crystalline growth systems and materials for the solar, LED and other specialty markets) has reported revenue for its fiscal fourth quarter (ended 2 April) of $271.6m, up 3.3% on $262.9m last quarter and 40% on $194.7m a year ago. Revenue by business segment was $79.2m in polysilicon, $186m in photovoltaic (PV), and $6.4m in sapphire (all of which was sapphire materials revenue).
- 25 May 2011:Applied Materials reported a fiscal second-quarter profit that nearly doubled from the year-earlier period, as the company saw stronger sales of semiconductor capital equipment. But shares of the company slipped nearly 2% in after-hours trading after it posted a weaker-than-anticipated outlook.
- 23 May 2011:
- 12 May 2011:
- 6 May 2011:Applied Materials's US$4.9 billion purchase of Varian Semiconductor may trigger a round of acquisitions in the chip-machinery industry, making companies such as Novellus Systems possible targets.
- 4 May 2011:Applied Materials and Varian Semiconductor Equipment Associates have announced the signing of a definitive merger agreement under which Applied will acquire Varian for US$63 per share in cash. The acquisition will extend Applied's leadership in wafer fabrication equipment with the addition of the technology leader in ion implantation.
- 6 Apr 2011:The worldwide semiconductor equipment market grew 143% in 2010 to nearly US$41 billion as the market recovered from the industry slowdown of the previous two years, according to Gartner.
- 30 Mar 2011:
- 9 Mar 2011:Hynix Semiconductor will collaborate with engineers in Sematech's 3D Interconnect program at CNSE's Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product-related issues for high-volume adoption of through-silicon-vias (TSV).
- 23 Feb 2011:Toshiba has developed a new flip-flop circuit using 40nm CMOS process that the company claims will reduce power consumption in mobile equipment. Measured data verifies that the power dissipation of the new flip-flop is up to 77% less than that of a conventional flip-flop and that it achieves a 24% reduction in total power consumption when applied to a wireless LAN chip.
- 21 Feb 2011:CSR and Zoran have entered into a merger agreement under which Zoran will merge with CSR for an equity value equivalent to approximately US$679 million. The merged company will provide differentiated, integrated technology that addresses the rapidly-growing market for connected, location-aware multimedia devices including handsets, digital cameras and home entertainment equipment.
- 26 Jan 2011:Huawei Technologies Co., China's largest telecommunications equipment maker, won a court order barring Motorola Solutions Inc. from disclosing confidential information about Huawei's technology to Nokia Siemens Networks, which plans to buy Motorola's wireless networks business.
- 30 Dec 2010:The pending acquisition of Motorola's mobile telecom equipment arm by Nokia Siemens Networks (NSN), which is pending approval by China's Ministry of Commerce, would make it more difficult for domestic rivals Huawei Technologies and ZTE to enter the US market, an analyst said.
- 8 Dec 2010:Texas Instruments has narrowed its fourth-quarter financial forecasts that match analysts' projection, citing higher demand for communications equipment.
- 15 Nov 2010:Citigroup analyst Timothy Arcuri asserted in a research note that Samsung is pushing out US$750 million to US$1 billion of equipment orders targeted at DRAM capacity expansion. Lam is the company most exposed to the move, Arcuri said.
- 28 Oct 2010:ZTE, one of China's largest network equipment and phone suppliers, is set to buy US$3 billion worth of semiconductor components from five US technology vendors. It has signed the purchase agreements with Qualcomm, Texas Instruments, Freescale Semiconductor, Altera and Broadcom.
- 26 Oct 2010:Toshiba made 48% of its products in Japan in the period from April to September 2009 and bought 45% of its components from Japan-based suppliers. By the same period this year, the ratios were down to 44% and 42%, respectively. The change added 4.2 billion yen to Toshiba's operating profits in the half to September, or 700 million yen for each one-yen increase in the Japanese currency's value against the dollar.
- But shares of Veeco, which makes precision manufacturing equipment for the LED and data storage markets, slipped after hours as the company predicted some revenue slated for the fourth quarter may not come in until early next year.
- 14 Oct 2010:"Beceem's talented teams of engineers in India and the US have been focused on enabling a 4G ecosystem of operators and equipment manufacturers to drive the deployment of 4G networks," said Scott Bibaud, Broadcom's Executive VP & GM of the Mobile Platforms Group. "We look forward to adding their innovative technologies to our product portfolio and providing these technologies to our customers."
- 16 Sep 2010:"We have put on hold the purchase of copper wire bonders," said Byron Chiang, spokesperson for Siliconware Precision Industries (SPIL), on the phone. "Orders are not coming along as strong as we originally thought."
- Rudolph Technologies has received an order for its multiple PrecisionWoRx VX4 probe card test and analysis systems from a customer in Taiwan to facilitate capacity expansion.
- 9 Sep 2010:Arm Holdings has taken the wraps off its next major chip design, promising a five-fold increase in performance that the company hopes will take it beyond smartphones and into new types of equipment such as high-performance routers and servers.
- 20 Aug 2010:ZTE Corp., China's second-biggest maker of telephone equipment, is expanding in the US with an agreement to sell a handset through Verizon Wireless.
- Innodisk's latest SSD hits the sweet spot
- Microtips pioneers wireless charging platform development to jointly create an industry ecosystem
- Celebrating its 20th anniversary, Microtips focuses on continuing revenue growth rather than rapid expansion
- QSAN Launches QCache 2.0 for XCubeSAN
- Hua Hong Semiconductor's power discrete platform crosses the shipment mark of 5-million wafers
- Unisys IT Implementation of Unisys Stealth Solution for Data Center Segmentation
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Perforce Software Wins Develop Industry Excellence Award for the Second Year in a Row
- Perforce Teams with Leading Git Client Developer fournova
- Perforce Introduces Helix GitSwarm: Flexible Git Ecosystem Mirrored to a Powerful Mainline Repository
- Perforce Helix Distributed Version Control System Brings Greater Flexibility While Maintaining Enterprise-class Security, Auditability and Control
- Perforce Powers Development of Legacy Quest for iOS and Android
- Taiwan market: Paypal enhances service by disabling domestic payment processing
- Digitimes Research: Samsung Note 7 issues may help Apple to regain number-1 crown in 4Q16
- Digitimes Research: 4 million 9.7-inch iPad Pros to ship in 1H16
- Digitimes Research: Global all-in-one PC shipments to drop 3.9% on year in 2015
- Mentor Graphics Veloce VirtuaLAB adds protocols for networking designs
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