- 24 Dec 2009:
- 11 Dec 2009:The Korean government and private sector will jointly inject 58.4 billion won (US$50.5 million) over the next three years into building up the local semiconductor manufacturing equipment sector, according to government officials.
- 23 Nov 2009:Loss-making foundry Tower Semiconductor, which trades as TowerJazz, has announced it plans to transfer "manufacturing know-how and certain equipment" to support an un-named Asian company ramp up production.
- 19 Nov 2009:
- 11 Nov 2009:"The problem for Applied and the problem for semi equipment in general is that it's highly unlikely that we're going back to 2007 capital spending levels..."
- 29 Oct 2009:Renesas Technology has reached a preliminary agreement to transfer its semiconductor manufacturing equipment business to Hitachi High-Technologies.
- 26 Oct 2009:Allvia, a through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. Over the next several months Allvia will proceed with manufacturing equipment tool selection for TSV production, and expects the facility to be operational in 2010.
- 13 Oct 2009:Tokyo Electron, the world's No.2 supplier of machines used to make microchips after Applied Materials, has said orders were 83 billion yen (US$931.5 million) in July-September, nearly double from the previous quarter's 48.7 billion yen.
- 27 Aug 2009:The potential sale of Qimonda's 300mm assets in Virginia to Texas Instruments (TI) confirms the opportunities in used 300 mm equipment identified in a study from Semico Research.
- 24 Aug 2009:Dutch semiconductor equipment maker ASM International will eliminate 106 jobs as it shutters its manufacturing facility in Phoenix and shifts those operations to Singapore.
- Texas Instruments has placed a bid of US$172.5 million on used 300mm equipment from the now-shuttered Qimonda fab near Richmond, Va. The Dallas-based company plans to use the equipment for 300mm analog production.
- 18 Aug 2009:Although the overall semiconductor market is expected to drop by 46% in 2009, it shows signs of rapid recovery, according to The Information Network market research company.
- 13 Aug 2009:Applied Materials said orders for wafer fab equipment spiked in the final month of its third fiscal quarter, ending July 26. Foundries increased spending sharply, and display manufacturers are also looking at better times driven by flat panel TV sales, according to company CEO Mike Splinter.
- 12 Aug 2009:Demand for semiconductor equipment is showing signs of a return, but it remains too early to say that a broad-based recovery is at hand, said Applied Materials CEO Mike Splinter.
- 7 Aug 2009:China is on its way to becoming a solar power - with financial incentives coming from every corner of the country - but a lack of experienced project developers and equipment installers may cast a shadow over the growing industry.
- 30 Jul 2009:ASM International saw its net loss for second-quarter 2009 widen to 55.7 million euro (US$78.3 million), from a loss of 9.6 million euro a year ago. The Dutch chip equipment maker recognized an inventory impairment charge of 20.6 million euro in the quarter.
- 21 Jul 2009:Chip equipment maker ASM International (ASMI) has announced that it is accelerating its cost reduction and restructuring of worldwide front-end operations.
- 15 Jul 2009:Semiconductor equipment maker Novellus Systems has posted disappointing margins and a wider-than-expected loss, but a robust forecast helped limit share losses in late trade.
- Dutch semiconductor equipment maker ASML has reported a narrower second quarter net loss than in the first quarter as sales jumped, and said it expects to reach break-even by the end of 2009.
- While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing profitability for leading-edge chipmakers is still Moore's Law...
- 13 Jul 2009:VLSI Research has revealed its Top-10 PV manufacturing equipment supply companies for 2008, with Applied Materials leading the pile.
- The global semiconductor equipment book-to-bill-ratio rose above parity in June for first time in 11 months, according to VLSI Research.
- 6 Jul 2009:With few tools in development for the EUV mask infrastructure, Sematech has said it will convene a meeting during SEMICON West to garner financial support from companies and government sources. The goal is to entice commercial suppliers to develop EUV mask blank inspection, mask defect review, and mask pattern inspection tools.
- 30 Jun 2009:
- 11 Jun 2009:Aviza Technology announced that is has filed for Chapter 11 bankruptcy as it goes ahead with efforts to sell certain of its assets to Sumitomo Precision Products.
- 8 Jun 2009:This expansion includes a 50% increase in floor space, and a multi-million dollar investment in facilities and equipment.
- 1 Jun 2009:Nikon has said it will reorganize its lithography operations, cutting 800 production workers in Japan and 200 marketing and support staff worldwide. By October, Nikon plans to combine four production subsidiaries into two, focused on IC and display equipment.
- 21 May 2009:Axcelis Technologies, a supplier of ion implantation and cleaning systems, has announced a global workforce reduction of approximately 235, or 20% of its employees, since year end 2008.
- Nanometrics ships follow-on Lynx system to leading memory manufacturer - Semiconductor InternationalNanometrics has begun shipping its Lynx cluster metrology systems, as a follow-on order to a leading memory manufacturer as part of its plan for high-volume manufacturing of its latest DRAM and flash memory technologies.
- 14 May 2009:Applied Materials executives said customer confidence is improving, but cautioned that the company is seeing "a very dynamic environment" in all of its major segments. China's stimulus plans may continue to support cellphone and PC consumption there, said CEO Mike Splinter following release of fiscal Q2 financial results.
- 13 May 2009:Semiconductor equipment maker Applied Materials swung to a loss in the fiscal second-quarter as sales plunged a less-than-feared 53% in a tough environment for the chip sector.
- 28 Apr 2009:KLA-Tencor has announced operating results for its third quarter of fiscal 2009 (ended on March 31, 2009). KLA-Tencor reported a GAAP net loss of US$83 million and a GAAP loss per share of US$0.49 on revenues of US$310 million for the third quarter of fiscal 2009.
- 25 Apr 2009:Lam Research has revealed its third quarter financial results, indicating a swing to loss as revenues plunged 72% during the three-month period.
- Novellus Systems Chief Executive Richard Hill said the chip equipment market may have reached a bottom and provided second-quarter guidance above Wall Street estimates.
- MEMC Electronic Materials shares jumped on Friday after the silicon wafer maker posted a first-quarter profit helped mainly by a hefty tax gain.
- 23 Apr 2009:Equipment supplier EV Group said that strong equipment orders in the last quarter have led to plans to increase production capacity with an extra working shift, starting near the end of April. New orders have exceeded the equipment suppliers forecasts, with demand coming from 3D IC through-silicon via (TSV) and nanoimprint lithography markets.
- 8 Apr 2009:KLA-Tencor has introduced the TeraScanXR, bringing high-resolution reticle-, aerial-, and wafer-plane inspection capability to the 32-nm node.
- 7 Apr 2009:Applied Materials said on Monday the value of a sales agreement to supply solar production equipment to a private buyer has been slashed to US$250 million from US$1.9 billion due a worsening global economy.
- 1 Apr 2009:KLA-Tencor will reduce its global workforce by a further-10% as part of an effort to reduce its quarterly operating expenses to US$140 million to US$145 million by the end of calendar year 2009, down from the previously announced target of US$165-170 million per quarter.
- The highly sophisticated tool for protecting from data security vulnerabilities - MEjW TP-400-I
- The Fortrend OGS received U.S. Patent Certificate
- G.SKILL Releases World's Fastest DDR4 3333MHz Memory, Available Now! The Bleeding Edge of Speed Has Arrived!
- Indium Corporation announces new EZ-Pour Gallium Trichloride
- Genesys Logic announces a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics
- AccuTouch Five Wire Resistive Touchscreens
- Getting the Most Out Of Your Next Generation Digital Security Surveillance System
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Digitimes Research: Intel to see strong tablet AP shipments in 2H14
- Commentary: Apple Watch pioneering user interface will make around 10% of users Think Different
- Digitimes Research: Asustek detachable devices face size hurdle
- Digitimes Research: Apple refocuses on 9.7-inch iPad in 2H14
- Commentary: Time is running out for console makers to clean up GamerGate
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