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News tagged packaging
  • Last update: Monday 17 November 2014 [411 news items]

Amkor completes acquisition of Toshiba packaging unit in Malaysia

Aug 1, 14:50

IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.

Nichia faces competition for LED packaging from Taiwan-, China-, South Korea-based makers

Jul 23, 14:42

Japan-based Nichia has gained a leading market status in EMC (epoxy molding compound)-based LED chip packaging, but some Taiwan-, China- and South Korea-based LED packagers have been...

PTI enjoys rising shipments for mobile DRAM

Jul 15, 21:07

Packaging and testing firm Powertech Technology (PTI) has enjoyed growth in its shipments for mobile DRAM chips to Elpida Memory since the second half of 2012, according to market...

Some LED chip makers extend to packaging

Jul 10, 11:11

Some of Taiwan-based LED chip makers have extended to packaging, offering solutions that EMS players can directly turn into lighting products, according to industry sources.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

Edison Opto expanding LED packaging capacity

Jul 8, 10:23

Edison Opto is expanding its monthly LED packaging capacity from 150 million PLCC (plastic leaded chip carrier) small- to medium-power devices and 10 million high-power devices at...

LED packaging houses face rising technological challenge

Jun 17, 10:33

South Korea-based TV makers hope to further reduce the cost of direct-lit LED TVs by using fewer LED chips in backlight modules, hence the firms hope LED packaging houses can increase...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

Touchscreen IC suppliers to see May sales increase

May 10, 11:25

Touchscreen controller IC suppliers Elan Microelectronics and Egalax-Empia Technology (EETI) are expected to post significant growth in May sales driven by demand from the PC sector,...

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

Backend firms see DRAM market recovery

Apr 23, 16:16

Memory packaging and testing specialists Powertech Technology (PTI), Walton Advanced Engineering and Formosa Advanced Technologies (FATC) are expected to benefit from a recovery in...

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

Backend to outperform IC sector, says ASE chair

Apr 15, 23:37

The packaging and testing sector is set to outperform the overall industry in 2013, said Jason Chang, chairman for Advanced Semiconductor Engineering (ASE), during a recent company...

Demand for COB packaging used in high-power LED lighting to grow fast, says Lextar

Apr 2, 20:53

As high-power LED lighting for commercial purposes is significantly on the rise, demand for COB (chip on board) packaging of high-power LED chips used in lighting will grow fast in...

Intel to keep LGA as mainstream packaging until 1H15, say Taiwan motherboard makers

Mar 22, 10:53

Intel's latest roadmap for desktop platform development indicates that LGA will be maintained as the mainstream packaging for processors, accounting for 95% of all packaging, at least...

Packaging material supplier Chang Wah to post double-digit revenue growth in 2Q13

Mar 20, 14:19

Packaging material supplier Chang Wah Electromaterials is expected to post a double-digit growth in revenues in the second quarter of 2013, powered by increasing orders for flip chip...

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Scientech deepens development of 3D IC, wafer-level packaging equipment

Jan 31, 16:04

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

Spreadtrum adopts STATS ChipPAC eWLB packaging for smartphone ICs

Jan 24, 12:36

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones...

Walton to cut 2013 capex, provides cautious outlook

Jan 22, 21:50

Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

Unity Opto expects 1Q13 LED lighting packaging shipments to reach 200,000 units

Jan 9, 22:13

As LED lighting is expected to boom, firms have been looking into adopting automated production. Nan Ya Photonics, a Taiwan-based joint venture between LED chipmaker Epistar and the...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

ASE reportedly lands small-volume orders for Apple processors

Dec 27, 21:00

Taiwan-based Advanced Semiconductor Engineering (ASE), an IC packaging and testing services provider, reportedly has begun to fulfill small-volume orders for Apple's A-series proce...

Packaging material supplier Chang Wah looks to strong sales in 4Q12

Dec 18, 15:48

Packaging material supplier Chang Wah Electromaterials is expected to continue to post strong sales in the fourth quarter of 2012 thanks to brisk demand coming from the handset and...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

Digitimes Research: China LED packaging houses Refond, Jufei, Z-Light to continue capacity growth in 2013

Nov 27, 11:45

Refond Optoelectronics, Jufei Optoelectronics, and Z-Light Optoelectronics are medium-size LED packaging firms in China. These firms have relatively low capital compared to Nationstar...

Solder material maker Shenmao strengthening deployment in China

Nov 26, 22:10

Taiwan-based Shenmao Technology, which manufactures solder materials for IC packaging, plans to set up new plants in China in order to sustain future growth, according to the compa...

Taiwan IC backend production value to dip in 4Q12, says IEK

Nov 20, 13:45

The production value of Taiwan's IC packaging and testing industry sectors registered sequential growth of 2% and 2.3%, respectively, in the third quarter of 2012, according to data...

IC substrate makers develop coreless substrates for thin-profile mobile devices

Oct 26, 13:59

Major Taiwan-based IC substrate suppliers, including Nanya PCB (NPC) and Unimicron Technology, have developed coreless IC substrates for use in thin-profile mobile devices, and already...

Chipbond 4Q12 sales likely to drop 5%

Oct 18, 22:14

LCD-driver-IC packaging and testing house Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit...

STATS ChipPAC cuts 3Q12 outlook

Sep 21, 01:25

STATS ChipPAC, a semiconductor test and packaging service provider, now expects its third-quarter sales to decrease 3-5% on quarter. The firm previously estimated flat sequential...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

411 items [2/12]
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  • YoungTek 4Q14 sales to fall up to 10%

    Before Going to Press | Nov 20, 21:16

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    Before Going to Press | Nov 20, 20:57

  • eMemory intros Hybrid MTP

    Before Going to Press | Nov 20, 20:57

  • Acer unveils Aspire Switch, Iconia tablets, 4G phone tablet

    Before Going to Press | Nov 20, 18:50

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    Before Going to Press | Nov 20, 18:49

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  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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21-Nov-2014 markets closed

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