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News tagged packaging
  • Last update: Monday 2 November 2015 [437 news items]

Asia Tech Image steps into packaging 13-megapixel smartphone-use lens modules, says paper

Newswatch - May 30, 12:19

Taiwan-based contact image sensor module maker Asia Tech Image has stepped into packaging 13-megapixel smartphone-use lens modules based on its COB (chip on board) process and will...

Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Newswatch - Apr 23, 15:13

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's...

TSMC to ramp IC packaging revenues to US$1 billion in 2015, says paper

Newswatch - Apr 21, 11:27

Taiwan Semiconductor Manufacturing Company (TSMC) aims to ramp up its IC packaging revenues to US$1 billion in 2015 and to US$2 billion in 2016, according to a Chinese-language...

Digitimes Research: Taiwan IC backend production value to expand 5.9% in 2014

Apr 11, 10:47

The production value of Taiwan's IC testing and packaging industry is expected to grow 5.9% in 2014, higher than the 4.9% growth posted a year earlier, as well as the 4.2% growth...

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Mar 31, 21:48

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

ASE, ChipMOS stepping into MEMS packaging sector

Newswatch - Mar 28, 16:00

IC backend service companies Advanced Semiconductor Engineering (ASE) and ChipMOS Technologies have been strengthening their deployments in the MEMS packaging sector, according to...

Micron to release more commodity DRAM packaging orders to Taiwan backend service suppliers

Mar 18, 21:37

Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half...

ChipMOS to land more large-size LCD driver IC packaging orders in 2014

Mar 14, 16:23

IC backend service company ChipMOS Technologies is expected to land more packaging orders for large-size LCD driver ICs supporting Ultra HD displays amid increasing penetration, according...

STATS ChipPAC introduces FlexLine wafer level packaging method

Mar 12, 16:07

STATS ChipPAC has designed and implemented a new manufacturing method for wafer level packaging (WLP). This new approach is known as FlexLine.

ASE may land more packaging orders for Apple A8 CPUs

Mar 11, 21:40

Advanced Semiconductor Engineering (ASE) may land a higher portion of packaging orders for Apple's next-generation A8 processor than the 20% expected previously, according to industry...


Tong Hsing, Lingsen see MEMS driving 2014 growth

Mar 4, 13:45

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, expects robust growth in sales generated from its...

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

SPIL to grow sales of silver wire-bonding packaging in 2014

Feb 12, 11:49

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources

Jan 27, 14:55

Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

Asia Tech Image steps into COB packaging of smartphone CCMs, says paper

Newswatch - Jan 17, 10:32

Contact image sensor (CIS) module supplier Asia Tech Image has extended operation to COB (chip on board) packaging of smartphone compact camera modules (CCMs) and will start shipments...

Semiconductor packaging materials market to approach US$21 billion by 2017, says SEMI

Jan 14, 14:00

The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its US$20 billion value through 2017 despite shifts away from the...

Packaging material distributor Niching to set up nano silver paste production lines

Dec 26, 16:20

Taiwan-based IC packaging material distributor Niching Industrial has spent NT$125 million (US$4.16 million) for the purchase of a building in preparation for setting up nano silver...

PTI to grow sales of logic IC backend service biz in 2014

Dec 26, 10:29

Memory-IC packaging and testing specialist Powertech Technology (PTI) is expected to enjoy significant growth in sales of its logic IC backend service business in 2014, thanks to...

PTI chairman DK Tsai expresses optimism about company logic IC backend service business

ChipMOS to nearly halve capex for 2014

Dec 19, 22:04

Packaging and testing firm ChipMOS Technologies plans to allocate NT$1.8 billion (US$60.2 million) for its capex in 2014, down from NT$3.5 billion in 2013.

ASE starts moving production equipment at offending factories to other plants, say sources

Dec 16, 21:33

Advanced Semiconductor Engineering (ASE) has begun to move some of the production equipment installed at its K5, K7 and K11 factories to other plants, in order to mitigate the impact...

Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer

Nov 25, 10:21

Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...

Chip carrier packaging grows on widespread adoption of QFN package, says IC Insights

Sep 4, 12:32

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

SEMICON Taiwan 2013: 3D-IC, 450mm and advanced packaging in the spotlight

Sep 4, 11:08

The 18th annual SEMICON Taiwan trade show has kicked off and will run through Friday at the Taipei World Trade Center Nangang Exhibition Hall, highlighting seven theme pavilions including...


STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging

Aug 20, 11:44

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...

Taiwan 3Q13 IC backend production value to register slight growth, says IEK

Aug 16, 16:13

The production value of Taiwan's IC packaging and testing industry sectors will register sequential growth of 4.6% and 4.3%, respectively, in the third quarter of 2013, according...

Tong Hsing looks to strong sales in 3Q13

Aug 12, 18:09

Tong Hsing Electronic Industries expects its sales in the third quarter of 2013 to grow at the same pace or higher than the 8% it posted in the previous quarter, powered by ever growing...

Amkor completes acquisition of Toshiba packaging unit in Malaysia

Aug 1, 14:50

IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.

Nichia faces competition for LED packaging from Taiwan-, China-, South Korea-based makers

Jul 23, 14:42

Japan-based Nichia has gained a leading market status in EMC (epoxy molding compound)-based LED chip packaging, but some Taiwan-, China- and South Korea-based LED packagers have been...

PTI enjoys rising shipments for mobile DRAM

Jul 15, 21:07

Packaging and testing firm Powertech Technology (PTI) has enjoyed growth in its shipments for mobile DRAM chips to Elpida Memory since the second half of 2012, according to market...

Some LED chip makers extend to packaging

Jul 10, 11:11

Some of Taiwan-based LED chip makers have extended to packaging, offering solutions that EMS players can directly turn into lighting products, according to industry sources.

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

Edison Opto expanding LED packaging capacity

Jul 8, 10:23

Edison Opto is expanding its monthly LED packaging capacity from 150 million PLCC (plastic leaded chip carrier) small- to medium-power devices and 10 million high-power devices at...

LED packaging houses face rising technological challenge

Jun 17, 10:33

South Korea-based TV makers hope to further reduce the cost of direct-lit LED TVs by using fewer LED chips in backlight modules, hence the firms hope LED packaging houses can increase...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

Touchscreen IC suppliers to see May sales increase

May 10, 11:25

Touchscreen controller IC suppliers Elan Microelectronics and Egalax-Empia Technology (EETI) are expected to post significant growth in May sales driven by demand from the PC sector,...

437 items [2/13]
Realtime news
  • TEEMA urges Taiwan government to take action on China hostile headhunting

    Before Going to Press | 9h 26min ago

  • ASE to expand workforce at Chungli facility

    Before Going to Press | 9h 27min ago

  • All-in-one PC shipments to drop over 10% in 2015

    Before Going to Press | 9h 33min ago

  • Acer launches Predator series products in Taiwan, eying opportunity from IT Month show

    Before Going to Press | 9h 34min ago

  • Taiwan PCB production value increases over 7% sequentially in 3Q15

    Before Going to Press | 9h 41min ago

  • D-Link sees strong smart home product sales in Europe

    Before Going to Press | 9h 45min ago

  • Korea government to invest US$110 million into wearables development, says report

    Before Going to Press | 9h 53min ago

  • Global LCD TV shipments to grow 2% in 2016

    Before Going to Press | 9h 58min ago

  • Himax obtains design-wins for smartphone-use force touch solutions

    Before Going to Press | 10h 1min ago

  • ZTE receives government funds to accelerate development of in-house mobile processors

    Before Going to Press | 10h 5min ago

  • TSMC may raise dividend for 2016

    Before Going to Press | 10h 6min ago

  • Sales of 40-inch TVs in Japan strong in October

    Before Going to Press | 10h 8min ago

  • Taiwan notebook makers seeking lower chip quotes for 2016

    Before Going to Press | 10h 9min ago

  • TWM withdraws from bidding for 2,500-2,600MHz bands

    Before Going to Press | 10h 12min ago

  • Digitimes Research: Japan telecom operators offering household robots to boost revenues

    Before Going to Press | 10h 22min ago

View more
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

The Big Fund
Trends and forecasts for the China FPD industry, 2014-2017

25-Nov-2015 markets closed


TAIEX (TSE)8400.14-85.59-1.01% 

TSE electronic328.06-3.94-1.19% 

GTSM (OTC)126.69-1.59-1.24% 

OTC electronic157.69-2.98-1.85% 

2015 global notebook demand forecast
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.