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NEWS TAGGED COPPER
Monday 17 January 2011
ASE raises capex for 2011, says paper
Advanced Semiconductor Engineering (ASE) has internally raised its capex budget to US$900 million for 2011 from the US$700 million estimated originally, according to a Chinese-language...
Thursday 6 January 2011
Co-Tech posts 16% sequential growth in December revenues
Copper foil maker Co-Tech saw December 2010 revenues climb 16% sequentially to NT$470 million (US$16 million), as clients began to build up inventory in anticipation of higher copper...
Friday 31 December 2010
PCB material prices on the rise
Prices for fiber glass yarns and fabrics, key materials for making copper clad laminates (CCL), are set to rise by as much as 15% in January 2011, according to industry sources. The...
Wednesday 29 December 2010
Copper foil prices set to continue rising
Prices for copper foil, the raw material of copper clad laminates (CCL), will go up by 5-7% in January 2011, according to industry sources. Prices already grew 5% in December.
Wednesday 22 December 2010
Co-Tech lowers copper foil quotes by 5% in December 2010
With copper prices continuing to trend up, copper foil quotes have increased 5% in December 2010, according to copper foil maker Co-Tech. Copper foil quotes from November 21 to December...
Thursday 16 December 2010
STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices
STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...
Friday 10 December 2010
Copper foil prices up another 5%
Quotes for copper foil have risen for the fourth consecutive month, up by 5% in December 2010 compared with November, according to industry sources. The upward trend reflects strengthening...
Wednesday 8 December 2010
Gold price increase spurs adoption of copper-wire bonding
With gold futures climbing to an historical high and copper prices relatively stable, IC packaging houses could see their gross margins eroded. The price difference between gold-wire...
Wednesday 24 November 2010
ASE grabs copper wirebonding orders from second-tier players
With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...
Tuesday 9 November 2010
CCL makers post mixed results for October
CCL (copper clad laminate) maker Iteq has registered NT$1.67 billion (US$55.3 million) in October consolidated revenues, up 1.8% from September. Fellow company Elite Materials (EMC)...
Friday 5 November 2010
Co-Tech October revenues down 11.5% on-month
Copper foil maker Co-Tech has posted revenues of NT$478 million (US$15.8 million) for October 2010, down 11.5% sequentially. But revenues were up 30% from a year ago.
Thursday 4 November 2010
Prices for copper foil up 5% in November
Prices for copper foil, a raw material for making copper clad laminates (CCL), have hiked 5% in November 2010 to reflect rising copper costs, according to industry sources. Meanwhile,...
Monday 1 November 2010
ASE plans for 2011 capex of US$700-800 million
Advanced Semiconductor Engineering (ASE) plans to budget US$700-800 million for 2011, similar to its 2010 budget according to the company. The packaging and testing firm also said...
Wednesday 20 October 2010
CCL maker Iteq reports self-evaluated 3Q10 results
Copper clad laminate (CCL) maker Iteq has reported third-quarter revenues of NT$5.36 billion (US$173.69 billion), down 5% sequentially. Pre-tax profit fell to NT$497 million or NT$5.75...
Monday 18 October 2010
Co-Tech expecting copper foil shipments decline in 4Q10
Co-Tech Copper Foil expects its revenues to be lower than expected in the fourth quarter of 2010 due to a decline in shipments of its copper foils in October and unclear order visibility...
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Summary of Tech Supply Chain News!
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