Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...
Korea-based Doosan, a producer of copper clad laminates (CCL), has begun small-volume production at its new plant in Changshu, China. Monthly capacity at the facility is scheduled...
ShineMore Technology Materials, a maker of copper clad laminates (CCL), has revealed plans to grow the ratio of niche-market products in company revenues to 50% in 2012 from 27% estimated...
Copper foil manufacturers have moved to scale back their output by 30-40% as orders plummet to low levels, according to industry sources. The previous cutback took place in 2008,...
In line with declining global copper prices, quotes for copper foils from Taiwan makers will drop by 3% on average sequentially in October, the third month in a row that the makers...
Taiwan-based Thinflex, a supplier of flexible copper clad laminates (FCCLs), expects utilization rates at its plants in China and Taiwan will rebound to 70% in the third quarter of...
Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...
The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...
Co-Tech Copper Foil has revealed plans to add an additional capacity of 150 metric tons of copper foil by the end of 2011. The new capacity will be allocated for the production of...
Copper clad laminate (CCL) maker ShineMore Technology Materials has submitted an application to list on Taiwan's over-the-counter (OTC) market, according to the company. It is currently...
Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, are expected to remain unchanged in July after a slide of 3-5% on average in June although...
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...
IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...
