Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.

Quotes for copper foil have stayed at US$2.80/kg recently compared to US$2.50/kg in the fourth quarter of 2012, thanks to limited capacity ramps by makers, according to industry so...

Copper clad-laminate (CCL) maker Elite Material (EMC) has unveiled plans to invest CNY160 million (US$25.7 million) to expand capacity at its plant in Zhongshan (Guangdong province,...

Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

Co-Tech Copper Foil has extended production of electrolytic copper foil to thin foil for use in FCCLs (flexible copper-clad laminates), becoming the first Taiwan-based maker of such...

Having fallen over recent months, prices for copper foil stopped falling in August to reflect a rebound in copper prices, according to Taiwan-based Co-Tech Copper Foil.

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

First-tier motherboard makers have recently dropped their Intel 7 series motherboard prices to compete for market share, although Intel has not yet officially announced the chipset,...

Taiwan-based copper foil maker Co-Tech Copper Foil has decided to raise quotes for its products by US$0.2-0.3/kg in December as compared to the levels in November, according to the...

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...