Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, have slid by 3-5% on average in June 2011 amid weakening demand and falling global commodity...
Taiwan-based CCL (copper-clad laminate) makers have lowered their quotes by 10% on average recently because of dropping international copper prices and bleak order prospects, according...
STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...
Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...
Prices for fiber glass fabrics in May 2011 will rise at a slower rate compared to 5-10% increases in April as producers of copper clad laminates (CCL) have been reluctant to place...
Prices for fiber glass fabrics, which are used for making copper clad laminates (CCL), are set to increase by 5-10% in April 2011, according to industry sources. Mainstream 7628-size...
With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...
Prices for copper foil, a raw material for making copper clad laminates (CCL), will be adjusted upward again in March, the Chinese-language Commercial Times cited industry...
Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...
As London Metal Exchange (LME) spot quotes for copper are expected to steadily climb to a new record level of nearly US$10,000 per metric ton after the Lunar New Year, sources from...
Advanced Semiconductor Engineering (ASE) expects to see revenues generated from its core ATM (assembly test and material) business stay flat sequentially in the first quarter of 2011,...
Advanced Semiconductor Engineering (ASE) has announced net profits for the fourth quarter of 2010 climbed 43.8% on year to NT$4.96 billion (US$171 million). Net profits for the whole...
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...
