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Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper
Commercial Times, October 4; Steve Shen, DIGITIMES
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month starting October, according to a Chinese-language Commercial Times...
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