Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates

Jan 7, 12:08

Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...

FC CSP substrate supply may be affected by explosion at Nippon Shokubai

Oct 4, 01:20

The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...

Kinsus looks to increasing shipments of FC CSP substrates in 4Q12

Sep 20, 13:59

Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...

Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper

Newswatch - Oct 4, 12:28

Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...

Unimicron lands orders from TI and Apple, says paper

Newswatch - Sep 9, 11:54

Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...

Kinsus lands FC CSP substrate orders from Intel, says paper

Newswatch - May 17, 14:12

IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10

Jul 28, 11:57

IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...

Kinsus FC CSP substrate utilization rate up on orders from Qualcomm

Aug 18, 14:37

Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...

Kinsus expects strong substrate shipment growth in March due to China 3G deployment

Mar 20, 17:11

IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...

IC substrate maker Kinsus to see sales decline but will remain profitable in January

Jan 19, 15:36

Investors estimate Kinsus Interconnect Technology's January sales to be only around NT$500 million (US$14.93 million) due to sagging market demand. However, the company said it expects...

Netbooks and handsets to drive up PPT sales in 3Q08

Aug 6, 14:59

Seeing its July sales sustain an upward trend, Phoenix Precision Technology (PPT) has delivered an optimistic outlook for the third quarter, with flip-chip (FC) and chip-scale packaging...

Memory market shows signs of a rebound

Jun 6, 01:10

Demand in the memory market is showing signs of a rebound, with IC substrate supplier Kinsus Interconnect Technology and PCB maker Tripod Technology saying June-orders from the flash...